摘要:
A semiconductor apparatus is disclosed. The semiconductor apparatus includes an SOI substrate including an active layer, a buried insulation film and a support substrate; a low potential reference circuit part located in the active layer and operable at a first reference potential; a high potential reference circuit part located in the active layer and operable at a second reference potential; a level-shifting element forming part located in the active layer and for providing a level-shift between the first and second reference potentials; and an insulation member insulating first and second portions of the support substrate from each other, wherein locations of the first and second portions respectively correspond to the low and high potential reference circuit parts.
摘要:
A wireless communication device, a wireless communication system and a wireless communication method for preventing buffer over flow in the wireless communication device acting as a relay node, and for improving throughput within the whole system are disclosed. The wireless communication device includes an information acquisition unit configured to acquire information on the amount of data relay processing in the wireless communication device and/or a neighbor wireless communication device; a priority calculation unit configured to calculate transmission priority of the wireless communication device, based on the acquired information; and a priority determination unit configured to determine a priority related parameter for data transmission from the wireless communication device, based on the transmission priority.
摘要:
A load driving device includes: an output power device for driving a load; a driving IC for controlling the output power device, wherein the driving IC is electrically coupled with the output power device through a wire or a connection member; and a first electrode substrate. The output power device and the driving IC are mounted on the first electrode substrate. In this case, the output power device is controlled with high speed, and a mounting area of the output power device and the driving IC is reduced.
摘要:
An object of the present invention is to suppress quality deterioration of a multicast packet due to transmission delay jitter. An access point comprises: a received packet analysis unit which extracts, from a packet transmitted from a wireless communication station, identification information for identifying a wireless communication station, MC reception information to indicate whether the wireless communication station receives a multicast packet or not, and communication operation information to indicate whether the communication operation of the wireless communication station is set to PS mode or not; an STA table management unit which generates an STA table associating the extracted identification information, MC reception information and communication operation information, and stores this STA table in a memory; and a packet transmission timing control unit which controls a transmission timing of the multicast packet based on the STA table stored in the memory.
摘要:
In a liquid substance supply device, a three port two valve directional control valve is provided in a transfer line, and a substance container and the transfer line are connected together by a four port three valve directional control valve in such a way that the four port three valve directional control valve and the substance container can be removed from the transfer line as a unit. Furthermore, in a vaporizer, an orifice member is provided to surround the end portion of an internal conduit in which flows a mixture substance consisting of a gas and a liquid substance mixed therewith, and gas for atomization is spouted into a vaporization chamber through a gap defined between the internal conduit and the orifice member. Yet further, the temperature of a vaporization surface in the vaporization chamber can be controlled independently in correspondence with the nature of the liquid substance.
摘要:
A semiconductor device includes: n transistor elements; n resistive elements; and n capacitive elements, each kind of elements coupled in series between the first and second terminals. The gate of each transistor element has a gate pad, and each transistor element includes transistor pads disposed on both sides. Each resistive element includes resistive pads disposed on both sides. Each capacitive element includes capacitive pads disposed on both sides. The gate pad other than the first stage transistor element, a corresponding resistive pad, and a corresponding capacitive pad are electrically coupled. One transistor pad, one resistive pad, and one capacitive pad in the first stage are electrically coupled. One transistor pad, one resistive pad, and one capacitive pad in the n-th stage are electrically coupled.
摘要:
Provided is a component bonding method with higher bonding precision in a process of bonding an electrode of a component to an electrode formed on a flat panel. A preliminary press bonding device includes: a control unit which includes a position displacement amount correction unit to which a position displacement amount after the press bonding process is fed back and which corrects the position displacement on the next component to be preliminarily bonded; and a component position determining unit which determines a position of the component using the fed back correction amount. On the other hand, a press bonding device includes a bonding recognition device for use in the recognition of positions of the electrodes on the flat panel and the component. The bonding recognition device includes a position displacement amount calculating unit which calculates the position displacement amount based on the recognized position information.
摘要:
A semiconductor device includes: a semiconductor substrate with a principal plane; a base region disposed on the principal plane; a source region disposed on the principal plane in the base region to be shallower than the base region; a drain region disposed on the principal plane, and spaced to the base region; a trench disposed on the principal plane; a trench gate electrode disposed in the trench through a trench gate insulation film; a planer gate electrode disposed on the principal plane of the semiconductor substrate through a planer gate insulation film; and an impurity diffusion region having high concentration of impurities and disposed in a portion of the base region to be a channel region facing the planer gate electrode.
摘要:
In a liquid substance supply device, a three port two valve directional control valve is provided in a transfer line, and a substance container and the transfer line are connected together by a four port three valve directional control valve in such a way that the four port three valve directional control valve and the substance container can be removed from the transfer line as a unit. Furthermore, in a vaporizer, an orifice member is provided to surround the end portion of an internal conduit in which flows a mixture substance consisting of a gas and a liquid substance mixed therewith, and gas for atomization is spouted into a vaporization chamber through a gap defined between the internal conduit and the orifice member. Yet further, the temperature of a vaporization surface in the vaporization chamber can be controlled independently in correspondence with the nature of the liquid substance.
摘要:
A pump-free water-cooling system is provided wherein external power supply is not involved; heat can be transported in any direction; and high reliability and low thermal resistance are ensured.The pump-free water-cooling system includes: a heat-exchange circulating solution container in which a heat-exchange circulating solution and vapor of the circulating solution are contained; a heat radiator provided on the outer wall of the container; a solution outlet for discharging from the container the heat-exchange circulating solution in the container; a gas-liquid two-phase fluid inlet for charging into the container gas-liquid two-phase fluid composed of the heat-exchange circulating solution at high temperature and vapor bubbles of the circulating solution; a first transportation route along which a sensible-heat-emitting heat exchanger is provided, the first transportation route linking with the solution outlet; a second transportation route along which heat exchange is carried out between heat-exchange circulating solution therein and the heat-exchange circulating solution in the container and the vapor of the heat-exchange circulating solution in the container; a third transportation route along which a heating heat exchanger is provided, the third transportation route linking with the gas-liquid two-phase fluid inlet; and a circulating-solution transporting route in which the first transportation route, the second transportation route, and the third transportation route are linked in that order.