Low shrinkage dielectric films
    23.
    发明授权
    Low shrinkage dielectric films 有权
    低收缩介电膜

    公开(公告)号:US09018108B2

    公开(公告)日:2015-04-28

    申请号:US13834333

    申请日:2013-03-15

    Abstract: Methods of forming a dielectric layer on a substrate are described, and may include introducing a first precursor into a remote plasma region fluidly coupled with a substrate processing region of a substrate processing chamber A plasma may be formed in the remote plasma region to produce plasma effluents. The plasma effluents may be directed into the substrate processing region. A silicon-containing precursor may be introduced into the substrate processing region, and the silicon-containing precursor may include at least one silicon-silicon bond. The plasma effluents and silicon-containing precursor may be reacted in the processing region to form a silicon-based dielectric layer that is initially flowable when formed on the substrate.

    Abstract translation: 描述了在基板上形成电介质层的方法,并且可以包括将第一前体引入到与衬底处理室的衬底处理区域流体耦合的远程等离子体区域中。等离子体可以形成在远程等离子体区域中以产生等离子体流出物 。 等离子体流出物可以被引导到基板处理区域中。 可以将含硅前体引入衬底处理区域,并且含硅前体可以包括至少一个硅 - 硅键。 等离子体流出物和含硅前体可以在处理区域中反应以形成当在基底上形成时最初可流动的硅基电介质层。

Patent Agency Ranking