公开(公告)号：US09331438B2

公开(公告)日：2016-05-03

申请号：US14185133

申请日：2014-02-20

Applicant: Apple Inc.

Inventor： Fletcher R. Rothkopf ,  Anna-Katrina Shedletsky ,  Ian P. Colahan ,  Daniele De Iuliis ,  Trent K. Do

IPC: H01R24/58 ,  H01R13/187

CPC classification number: H01R24/58 ,  H01R13/187 ,  Y10T29/49208

Abstract: Split jack assemblies are constructed with a tubeless pin block. Elimination (or split) of the tube, or more particularly, a tube that is an integrally formed part of the pin block form the pin block allows for the use of a tubeless pin block design that results in a jack assembly having smaller overall dimensions than a conventional jack assembly constructed to accommodate a plug of the same dimensions. The tubeless pin block can be used in conjunction with a tube sleeve or with a curved surface of a housing for an electronic device, or both to provide a plug receptacle of the split jack assembly.

Abstract translation: 分体式千斤顶组件采用无内孔的针座构成。 管的排除（或分裂），或更具体地，作为销块的整体形成部分的管形成销块允许使用无内筒销块设计，其导致千斤顶组件具有比 构造成容纳相同尺寸的插头的常规千斤顶组件。 无内胎销块可以与管套筒或用于电子设备的壳体的曲面结合使用，或者两者都提供分体插座组件的插头插座。

公开(公告)号：US09325097B2

公开(公告)日：2016-04-26

申请号：US13679036

申请日：2012-11-16

Applicant: Apple Inc.

Inventor： Trent K. Do

IPC: H01R13/405 ,  H01R43/24 ,  H01R13/6594

CPC classification number: H01R13/405 ,  H01R13/6594 ,  H01R43/24 ,  Y10T29/49222

Abstract: An improved electronic receptacle connector employs contacts that are partially encapsulated with a thermally conductive polymer. The thermally conductive polymer aids in the distribution of heat within the contact and may further form heat transfer features to conduct heat to other connector components such as the shell. The thermally conductive polymer may be used to encapsulate multiple contacts within a substantially unitary block.

Abstract translation: 改进的电子插座连接器采用部分被导热聚合物包封的触点。 导热聚合物有助于接触中的热量分布，并且可以进一步形成传热特征以将热量传导到诸如壳体的其它连接器部件。 导热聚合物可以用于将多个接触件封装在基本上单一的块内。

公开(公告)号：US20160066419A1

公开(公告)日：2016-03-03

申请号：US14472223

申请日：2014-08-28

Applicant: Apple Inc.

Inventor： Ibuki Kamei ,  Timothy J. Rasmussen ,  Trent K. Do

IPC: H05K1/03 ,  H05K3/40 ,  H05K1/11

CPC classification number: H05K1/0393 ,  H05K1/028 ,  H05K1/097 ,  H05K1/111 ,  H05K1/118 ,  H05K3/041 ,  H05K3/28 ,  H05K3/361 ,  H05K3/4007 ,  H05K2201/026 ,  H05K2201/05 ,  H05K2203/0759

Abstract: An electronic device has structures such as substrates and internal housing structures. The substrates may be rigid substrates such as rigid printed circuit boards and flexible substrates such as flexible printed circuits, flexible touch sensor substrates, and flexible display substrates. Carbon nanotubes may be patterned to form carbon nanotube signal paths on the substrates. The signal paths may resist cracking when bent. A flexible structure such as a flexible printed circuit may have carbon nanotube signal paths interposed between polymer layers. Openings in a polymer layer may expose metal solder pads on the carbon nanotube signal paths. A stiffener may be provided under the metal solder pads. Polymer materials in the flexible structure may be molded to form bends. Bends may be formed along edges of a touch sensor or display or may be formed in a flexible printed circuit.

Abstract translation: 电子设备具有诸如基板和内部壳体结构的结构。 基板可以是刚性基板，例如刚性印刷电路板和柔性基板，例如柔性印刷电路，柔性触摸传感器基板和柔性显示基板。 碳纳米管可以被图案化以在基底上形成碳纳米管信号路径。 当弯曲时，信号路径可能会抗开裂。 诸如柔性印刷电路的柔性结构可以具有夹在聚合物层之间的碳纳米管信号路径。 聚合物层中的开口可能会暴露碳纳米管信号路径上的金属焊盘。 可以在金属焊盘下设置加强件。 柔性结构中的聚合物材料可以被模制以形成弯曲。 弯曲部可以沿着触摸传感器或显示器的边缘形成，或者可以形成在柔性印刷电路中。

公开(公告)号：US08894445B2

公开(公告)日：2014-11-25

申请号：US13629477

申请日：2012-09-27

Applicant: Apple Inc.

Inventor： Eric S. Jol ,  Trent K. Do

IPC: H01R24/00

CPC classification number: H01R24/62 ,  H01R4/64 ,  H01R12/724

Abstract: Connector receptacles having a contoured form factor that allows their use in stylized enclosures. These receptacles may also be contoured to avoid circuitry internal to the device enclosure. The contoured form factor may also simplify the assembly of the connector receptacle.

公开(公告)号：US20140206237A1

公开(公告)日：2014-07-24

申请号：US14219928

申请日：2014-03-19

Applicant: APPLE INC.

Inventor： Trent K. Do

IPC: H01R13/648 ,  H01R43/26 ,  H01R43/20 ,  H01R13/658

CPC classification number: H01R13/6485 ,  H01R13/658 ,  H01R13/6583 ,  H01R13/6599 ,  H01R43/205 ,  H01R43/26 ,  H01R2201/06 ,  Y10T29/49147 ,  Y10T29/49204

Abstract: An improved electronic receptacle connector with portions thereof formed from an electrically conductive polymer is disclosed. A conductive polymer front face enables improved device aesthetics and can discharge electrostatic energy from a plug before it is mated with the connector. A conductive polymer housing with internal ground structures may provide electromagnetic interference shielding and improved data transfer speed.

公开(公告)号：US08715007B2

公开(公告)日：2014-05-06

申请号：US13631659

申请日：2012-09-28

Applicant: Apple Inc.

Inventor： Trent K. Do

IPC: H01R13/658

CPC classification number: H01R13/6485 ,  H01R13/658 ,  H01R13/6583 ,  H01R13/6599 ,  H01R43/205 ,  H01R43/26 ,  H01R2201/06 ,  Y10T29/49147 ,  Y10T29/49204

Abstract: An improved electronic receptacle connector with portions thereof formed from an electrically conductive polymer is disclosed. A conductive polymer front face enables improved device aesthetics and can discharge electrostatic energy from a plug before it is mated with the connector. A conductive polymer housing with internal ground structures may provide electromagnetic interference shielding and improved data transfer speed.

Abstract translation: 公开了一种改进的电子插座连接器，其一部分由导电聚合物形成。 导电聚合物正面可以改善设备美观性，并且可以在与插头配合之前从插头中释放静电能量。 具有内部接地结构的导电聚合物外壳可提供电磁干扰屏蔽和改善的数据传输速度。

公开(公告)号：US08668528B2

公开(公告)日：2014-03-11

申请号：US13631553

申请日：2012-09-28

Applicant: Apple Inc.

Inventor： Fletcher R. Rothkopf ,  Anna-Katrina Shedletsky ,  Ian P. Colahan ,  Daniele De Iuliis ,  Trent K. Do

IPC: H01R24/04

CPC classification number: H01R24/58 ,  H01R13/187 ,  Y10T29/49208

Abstract: Split jack assemblies are constructed with a tubeless pin block. Elimination (or split) of the tube, or more particularly, a tube that is an integrally formed part of the pin block form the pin block allows for the use of a tubeless pin block design that results in a jack assembly having smaller overall dimensions than a conventional jack assembly constructed to accommodate a plug of the same dimensions. The tubeless pin block can be used in conjunction with a tube sleeve or with a curved surface of a housing for an electronic device, or both to provide a plug receptacle of the split jack assembly.

Abstract translation: 分体式千斤顶组件采用无内孔的针座构成。 管的排除（或分裂），或更具体地，作为销块的整体形成部分的管形成销块允许使用无内筒销块设计，其导致千斤顶组件具有比 构造成容纳相同尺寸的插头的常规千斤顶组件。 无内胎销块可以与管套筒或用于电子设备的壳体的曲面结合使用，或者两者都提供分体插座组件的插头插座。

公开(公告)号：US20130109248A1

公开(公告)日：2013-05-02

申请号：US13631553

申请日：2012-09-28

Applicant: Apple Inc.

Inventor： Fletcher R. Rothkopf ,  Anna-Katrina Shedletsky ,  Ian P. Colahan ,  Daniele De Iuliis ,  Trent K. Do

IPC: H01R4/48 ,  H01R43/20

CPC classification number: H01R24/58 ,  H01R13/187 ,  Y10T29/49208

Abstract: Split jack assemblies are constructed with a tubeless pin block. Elimination (or split) of the tube, or more particularly, a tube that is an integrally formed part of the pin block form the pin block allows for the use of a tubeless pin block design that results in a jack assembly having smaller overall dimensions than a conventional jack assembly constructed to accommodate a plug of the same dimensions. The tubeless pin block can be used in conjunction with a tube sleeve or with a curved surface of a housing for an electronic device, or both to provide a plug receptacle of the split jack assembly.

Abstract translation: 分体式千斤顶组件采用无内孔的针座构成。 管的排除（或分裂），或更具体地，作为销块的整体形成部分的管形成销块允许使用无内筒销块设计，其导致千斤顶组件具有比 构造成容纳相同尺寸的插头的常规千斤顶组件。 无内胎销块可以与管套筒或用于电子设备的壳体的曲面结合使用，或者两者都提供分体插座组件的插头插座。