公开(公告)号：US20220217462A1

公开(公告)日：2022-07-07

申请号：US17496748

申请日：2021-10-07

Applicant: APPLE INC.

Inventor： Lee M. Panecki ,  Arun D. Chawan ,  Julia C. Canning ,  Michael B. Minerbi ,  Pengchuan Wang ,  Kyle Tse ,  Brian R. Twehues ,  Sean T. Bong ,  Eric X. Zhou ,  Ethan L. Huwe ,  Scott C. Grinker ,  Haochuan Sang ,  Martin Kuster ,  Sean J. Docherty ,  Ryan Buck ,  Yuta Kuboyama

IPC: H04R1/10 ,  H04R1/22

Abstract: A portable acoustic device comprising: a device housing that defines an internal cavity, the device housing comprising a speaker housing portion and a stem portion extending away from the speaker housing portion; a first acoustic port formed through a wall of the speaker housing; an audio driver disposed within the speaker housing portion and aligned to emit sound through the acoustic first port; a battery disposed within the speaker housing portion and positioned an opposite side of the audio driver than the acoustic port; an antenna disposed in the stem; a user input region disposed along the stem; and a system in a chip disposed in the stem, the system in a chip comprising: a processor that controls operation of the portable wireless acoustic device, charging circuitry, an accelerometer, a wireless communication controller, support components for the antenna and support components for the user input region.

公开(公告)号：US11277679B1

公开(公告)日：2022-03-15

申请号：US17023246

申请日：2020-09-16

Applicant: Apple Inc.

Inventor： Jarrett B. Lagler ,  Michael B. Minerbi ,  Miikka O. Tikander ,  Lee M. Panecki ,  Trang Fisher ,  Esge Andersen ,  Eugene Whang ,  Ben Shaffer ,  Edward Siahaan ,  Daniel R. Bloom ,  Kitty Yung ,  Tyler A. Green ,  Krithika Elangovan ,  Sarah Gysbers ,  Michael Burello ,  Matthew Zaverl ,  Christopher A. Sandieson ,  Casey L. Baran

IPC: H04R1/10

Abstract: A headphone earcup including a frame defining a cavity dimensioned to surround an ear of a user; a damping component coupled to the frame and encircling the cavity; a wrap component that covers the damping component and defines a continuous acoustic opening around the cavity to acoustically connect the cavity to the damping component; and a cosmetic component that covers the wrap component and the continuous acoustic opening.

公开(公告)号：US11272280B1

公开(公告)日：2022-03-08

申请号：US17023244

申请日：2020-09-16

Applicant: Apple Inc.

Inventor： Michael B. Minerbi ,  Prathamesh R. Bhagwat

IPC: H04R25/00 ,  H04R1/10 ,  H04R5/033

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that enhance user comfort and improve user control of the headphones are discussed. Various sensor configurations and electronic component positions are also discussed. User convenience features that include detachable cushions and automatically detecting the donning and doffing of headphones are also discussed.