EARPHONES
    21.
    发明申请
    EARPHONES 审中-公开

    公开(公告)号:US20200314518A1

    公开(公告)日:2020-10-01

    申请号:US16564804

    申请日:2019-09-09

    Applicant: Apple Inc.

    Abstract: An earpiece is described that includes a driver housing that encloses an audio driver. The driver housing is oriented so that a first end of the driver housing can be supported by a concha bowl of a user's ear and a second end opposite the first end can tilt outside of the user's ear so that the ear need not accommodate an entirety of the driver housing. The driver housing is held in place by an ear clip that engages an exterior portion of the user's ear and attaches to the driver housing by way of a bridge element that can enclose other electronic components such as a battery, antenna, processor and the like.

    Electronic devices with sound permeable fabric

    公开(公告)号:US12003916B1

    公开(公告)日:2024-06-04

    申请号:US17211607

    申请日:2021-03-24

    Applicant: Apple Inc.

    CPC classification number: H04R1/1091 D04B21/14 H04R1/023 D10B2503/00

    Abstract: A pair of headphones may include first and second ear cups that each contain one or more speakers. The speakers may emit audio through a sound-permeable warp knit spacer fabric that is coupled to each ear cup. The warp knit spacer fabric may include inner and outer fabric layers joined by a spacer layer. The outer fabric layer may have first and second regions with different fabric densities. The first region with the greater fabric density may be used to form a label such as an R-shape or L-shape to indicate which ear cup should cover the user's right ear and which ear cup should cover the user's left ear. The denser first region may have diamond-shaped openings of a first size and the less dense second region may have diamond-shaped openings of a second size that is greater than the first size.

Patent Agency Ranking