摘要:
A cooling system is provided for use in conjunction with a semiconductor assembly including a first semiconductor device and a second semiconductor device electrically coupled to the first semiconductor device by an elongated electrical connection. The cooling system includes a flow passage, a pump fluidly coupled to the flow passage, and an outlet array fluidly coupled to the flow passage and configured to direct a coolant fluid over the second semiconductor device. The outlet array has an interconnect feature formed therein configured to receive the elongated electrical connection there through.
摘要:
An electric motor includes a stator having a plurality of slots. The slots have slot ends and channels formed between the slot ends. A plurality of wire windings is disposed in the slots. A plurality of winding end-turns is formed by the wire windings and is adjacent to the slot ends. The electric motor also includes a cooling tube connected to a periphery formed by the winding end-turns. The cooling tube is operable to absorb heat from the electric motor. The cooling tube can cool the winding end-turns more efficiently than traditional electric motor water jackets and/or cooling fans.
摘要:
A semiconductor subassembly is provided for use in a switching module of an inverter circuit for a high power, alternating current motor application. The semiconductor subassembly includes a wafer having first and second opposed metallized faces; a semiconductor switching device electrically coupled to the first metallized face of the wafer and having at least one electrode region; and an interconnect bonded to the semiconductor switching device. The interconnect includes a first metal layer bonded to the at least one electrode region of the semiconductor switching device, a ceramic layer bonded to the first metal layer, the ceramic layer defining a via for accessing the first metal layer, a second metal layer bonded to the ceramic layer, and a conducting substance disposed in the via of the ceramic layer to electrically couple the first metal layer to the second metal layer.
摘要:
In order to provide a modular arrangement, an inverter for an electric traction motor used to drive an automotive vehicle is positioned in proximity with the traction motor. The inverter is located within a compartment adjacent to one end of the electric traction motor and is cooled in a closed system by spraying a liquid coolant directly onto the inverter. The liquid coolant absorbs heat from the inverter and is cooled by a heat exchange arrangement comprising a reservoir with pipes carrying a second coolant from the radiator of the automotive vehicle. In a preferred embodiment, the coolant is collected from the inverter in an annular reservoir that is integral with the compartment containing the inverter. In accordance with one embodiment of the cooling arrangement, heat from the inverter vaporizes the liquid coolant by absorbing heat from the inverter during a phase change from a liquid to a vapor. The vaporized coolant is condensed by a circulating second coolant in pipes connected to the vehicle's radiator through a condenser that is preferably coaxial with the motor and the annular reservoir, which annular reservoir in the second embodiment collects overspray liquid coolant. In order to avoid degrading the inverter, the coolant is a dielectric fluid.
摘要:
A method of controlling an IPM machine having a salient rotor. Stator terminal signals are measured and rotated to obtain synchronous reference frame current signals. A rotor position is estimated based on an impedance generated using the rotor and included in the current signals. The estimated rotor position is used to control the machine. An alternator-starter system in which this method is used can provide high cranking torque and generation power over a wide speed range while providing operational efficiency.
摘要:
A power electronics cooling housing for use in a power electronics system. The power electronics cooling housing has a body with a coolant cavity formed in one surface and a capacitor bus assembly potting cavity formed in an opposite surface. A bus bar passthrough opening is formed through the body. The bus bar passthrough opening provides an opening from the coolant cavity and the capacitor bus assembly potting cavity. A coolant inlet manifold having a coolant cavity inlet and a coolant outlet manifold having a coolant cavity outlet are formed in the body that are coupled to respective ends of the coolant cavity. An environmental sealing gasket surrounds the coolant cavity.
摘要:
A pin fin heat sink having mixed geometry pin fin configurations is presented. The mixed geometry pin fin configuration are designed to optimize the positive attributes of each individual pin fin geometry to provide a low cost overall system and provide better system performance in high flow rate systems. In an exemplary embodiment, the pin fin heat sink comprises a base surface having a plurality of pin fins perpendicular to and protruding therefrom. The plurality of pin fins actually comprises a plurality of pin fins having a first configuration and a plurality of pin fins having a second configuration. The second configuration pin fins are intended to streamline any turbulence created by the first configuration pin fins which are located upstream of the second configuration pin fins. Preferably, the first configuration comprises substantially circular shaped pin fins and the second configuration comprises substantially elliptical shaped pin fins.
摘要:
A power electronics power module is provided. The power electronics power module includes an electrically conductive substrate, a electronic die having first and second opposing surfaces and at least one transistor formed thereon, the electronic die being mounted to the electrically conductive substrate and the at least one transistor being configured such that when the at least one transistor is activated, current flows from the first surface of the electronic die into the electrically conductive substrate, and a control member at least partially imbedded in the electrically conductive substrate, the control member having a control conductor formed thereon and electrically connected to the at least one transistor such that when a control signal is provided to the control conductor, the at least one transistor is activated.
摘要:
A cooling device is provided for liquid cooling a power semiconductor device. The device includes a coolant diverter for guiding liquid coolant to the power semiconductor device. The coolant diverter has a first plate for dividing the coolant diverter into a first cavity and a second cavity. The second cavity positioned adjacent the power semiconductor device. The first plate further includes an opening to fluidly couple the first cavity with the second cavity such that the liquid coolant flows into the first cavity, through the opening in the first plate, and into the second cavity to cool the power semiconductor device. The first cavity has a cross-sectional area that generally decreases in a downstream direction, and the second cavity has a cross-sectional area that generally increases in the downstream direction.
摘要:
An automotive power electronics system is provided. The automotive power electronics system includes a support member and at least one electronic die mounted to the support member. The at least one electronic die has an integrated circuit formed thereon comprising at least one wide band gap transistor.