公开(公告)号：US20140167794A1

公开(公告)日：2014-06-19

申请号：US13715648

申请日：2012-12-14

Applicant: APPLE INC.

Inventor： Jayesh Nath ,  Liang Han ,  Matthew A. Mow ,  Ming-Ju Tsai ,  Joshua G. Nickel ,  Hao Xu ,  Peter Bevelacqua ,  Mattia Pascolini ,  Robert W. Schiub ,  Ruben Caballero

IPC: G01R35/00

CPC classification number: G01R35/007 ,  G01R31/2822 ,  G01R31/2879 ,  G01R31/3191

Abstract: A manufacturing system for assembling wireless electronic devices is provided. The manufacturing system may include test stations for testing the radio-frequency performance of components that are to be assembled within the electronic devices. A reference test station may be calibrated using calibration coupons having known radio-frequency characteristics. The calibration coupons may include transmission line structures. The reference test station may measure verification standards to establish baseline measurement data. The verification standards may include circuitry having electrical components with given impedance values. Many verification coupons may be measured to enable testing for a wide range of impedance values. Test stations in the manufacturing system may subsequently measure the verification standards to generate test measurement data. The test measurement data may be compared to the baseline measurement data to characterize the performance of the test stations to ensure consistent test measurements across the test stations.

Abstract translation: 提供了一种用于组装无线电子设备的制造系统。 制造系统可以包括用于测试要在电子设备内组装的组件的射频性能的测试站。 可以使用具有已知射频特性的校准试样来校准参考测试台。 校准试样可以包括传输线结构。 参考测试站可以测量验证标准以建立基线测量数据。 验证标准可以包括具有给定阻抗值的电气部件的电路。 可以测量许多验证券，以测试宽范围的阻抗值。 制造系统中的测试台随后可以测量验证标准以产生测试测量数据。 可以将测试测量数据与基线测量数据进行比较，以表征测试站的性能，以确保跨越测试站的一致的测试测量。

公开(公告)号：US20140139380A1

公开(公告)日：2014-05-22

申请号：US13681138

申请日：2012-11-19

Applicant: APPLE INC.

Inventor： Yuehui Ouyang ,  Robert W. Schlub ,  Nanbo Jin ,  Mattia Pascolini

IPC: H01Q21/30 ,  H01Q1/24

CPC classification number: H01Q21/30 ,  H01Q1/243 ,  H01Q5/20 ,  H01Q5/314 ,  H01Q7/00 ,  H01Q9/0421 ,  H01Q21/28

Abstract: Electronic devices may be provided that contain wireless communications circuitry. The wireless communications circuitry may include radio-frequency transceiver circuitry and antenna structures. The antenna structures may include conductive housing structures such as a peripheral conductive housing member. The antenna structures may be based on an inverted-F antenna resonating element or other types of antenna resonating element. An electronic device may have near field communications circuitry and non-near-field communications circuitry such as cellular telephone, satellite navigation system, or wireless local area network transceiver circuitry. Antenna structures may be configured to handle signals associated with the non-near-field communications circuitry. The antenna structures may also have portions that form a near field communications loop antenna for handling signals associated with the near field communications circuitry.

Abstract translation: 可以提供包含无线通信电路的电子设备。 无线通信电路可以包括射频收发器电路和天线结构。 天线结构可以包括诸如外围导电外壳构件的导电外壳结构。 天线结构可以基于倒F天线谐振元件或其他类型的天线谐振元件。 电子设备可以具有近场通信电路和非近场通信电路，例如蜂窝电话，卫星导航系统或无线局域网收发器电路。 天线结构可以被配置为处理与非近场通信电路相关联的信号。 天线结构还可以具有形成用于处理与近场通信电路相关联的信号的近场通信环形天线的部分。

公开(公告)号：US20140087668A1

公开(公告)日：2014-03-27

申请号：US13629414

申请日：2012-09-27

Applicant: APPLE INC

Inventor： Matthew A. Mow ,  Thomas E. Biedka ,  Ming-Ju Tsai ,  Liang Han ,  Xu Han ,  Anand Lakshmanan ,  Nanbo Jin ,  Hongfei Hu ,  Dean F. Darnell ,  Joshua G. Nickel ,  Jayesh Nath ,  Yijun Zhou ,  Hao Xu ,  Yuehui Ouyang ,  Nirali Shah ,  Mattia Pascolini ,  Robert W. Schlub ,  Ruben Caballero

IPC: H04W24/00

CPC classification number: H04W24/08 ,  H04B17/318 ,  H04B17/345 ,  H04W24/06

Abstract: Radio frequency test systems for characterizing antenna performance in various radio coexistence scenarios are provided. In one suitable arrangement, a test system may be used to perform passive radio coexistence characterization. During passive radio coexistence characterization, at least one signal generator may be used to feed aggressor signals directly to antennas within an electronic device under test (DUT). The aggressor signals may generate undesired interference signals in a victim frequency band, which can then be received and analyzed using a spectrum analyzer. During active radio coexistence characterization, at least one radio communications emulator may be used to communicate with a DUT via a first test antenna. While the DUT is communicating with the at least one radio communications emulator, test signals may also be conveyed between DUT 10 and a second test antenna. Test signals conveyed through the second test antenna may be used in obtaining signal interference level measurements.

Abstract translation: 提供了用于在各种无线电共存场景中表征天线性能的射频测试系统。 在一种合适的布置中，可以使用测试系统来执行被动无线电共存表征。 在被动无线电共存表征期间，可以使用至少一个信号发生器将攻击者信号直接馈送到被测电子设备（DUT）内的天线。 攻击者信号可能在受害频段中产生不期望的干扰信号，然后使用频谱分析仪接收和分析。 在有源无线电共存表征期间，可以使用至少一个无线电通信仿真器来经由第一测试天线与DUT进行通信。 当DUT正在与至少一个无线电通信仿真器进行通信时，也可以在DUT 10和第二测试天线之间传送测试信号。 通过第二测试天线传送的测试信号可用于获得信号干扰电平测量。

公开(公告)号：US20250112371A1

公开(公告)日：2025-04-03

申请号：US18477868

申请日：2023-09-29

Applicant: Apple Inc.

Inventor： Behnam Ghassemiparvin ,  Jingni Zhong ,  Ming Chen ,  Bhaskara R Rupakula ,  Yiren Wang ,  Han Wang ,  Yuan Tao ,  Victor C Lee ,  Salih Yarga ,  Erdinc Irci ,  Jennifer M Edwards ,  Hao Xu ,  Hongfei Hu ,  Carlo Di Nallo ,  Mattia Pascolini

IPC: H01Q9/04 ,  H01Q19/00

Abstract: An electronic device may be provided with an antenna module having a substrate. An antenna may be disposed on the substrate. The antenna may have a directly fed patch and parasitic patches. The antenna may be fed by a feed via. The parasitic patches may include a first layer of parasitic patches separated by a gap overlapping the directly fed patch. The parasitic patches may include an additional parasitic patch formed in a second layer. The additional parasitic patch may overlap the gap. A floating ground via may couple a center of the additional parasitic patch and a center of the directly fed patch to a landing pad in a ground layer. The landing pad may short the via to the ground layer at the radiating frequency of the antenna. The landing pad may be electrically floating at DC frequencies.

公开(公告)号：US20250087869A1

公开(公告)日：2025-03-13

申请号：US18465014

申请日：2023-09-11

Applicant: Apple Inc.

Inventor： Ming Chen ,  Enrique Ayala Vazquez ,  Joel Ravi ,  Woonyong Bae ,  Laura M Burke ,  Yuancheng Xu ,  Bhaskara R Rupakula ,  Haozhan Tian ,  Salih Yarga ,  Erdinc Irci ,  Tiejun Yu ,  Seyed Mohammad Amjadi ,  Ahmed Ali Abdelhaliem Nafe ,  Hongfei Hu ,  Carlo Di Nallo ,  Mattia Pascolini

IPC: H01Q1/24 ,  H05K5/02

Abstract: An electronic device may be provided with sidewalls and a conductive plate. A segment of the sidewalls may form a radiating arm of an antenna. A display may be mounted to the sidewalls. The display may include a conductive frame and a flexible printed circuit. The flexible circuit may have a bend. Conductive foam may short a conductive trace on the flexible circuit to the conductive frame near the bend. Low injection pressure overmolding (LIPO) may be molded over the flexible circuit, the foam, and the frame. A conductive spring may short the frame to the conductive plate. The spring may include a wider and/or thinner portion that optionally includes one or more notches for reducing its inductance. The conductive plate, the spring, the frame, the foam, and the conductive trace may form part of the antenna ground for the antenna.

公开(公告)号：US20240079784A1

公开(公告)日：2024-03-07

申请号：US18458710

申请日：2023-08-30

Applicant: Apple Inc.

Inventor： Han Wang ,  Victor C. Lee ,  Jingni Zhong ,  Ming Chen ,  Bhaskara R. Rupakula ,  Yiren Wang ,  Yuan Tao ,  Christopher Q. Ma ,  Zhiheng Zhou ,  Sherry Cao ,  Kevin M. Froese ,  Hao Xu ,  Hongfei Hu ,  Mattia Pascolini

IPC: H01Q9/04 ,  H01Q9/40

CPC classification number: H01Q9/0414 ,  H01Q9/0442 ,  H01Q9/40

Abstract: An electronic device may be provided with an antenna having a resonating element and a light source module mounted to a flexible printed circuit and a metal cowling. The module may emit light through a rear housing wall. The printed circuit may be interposed between the metal cowling and a conductive support plate in the rear housing wall. The printed circuit may include a ground trace coupled to the resonating element. A dimpled pad may couple the ground trace to the support plate. Compressive foam may be used to exert a force against the flexible printed circuit that presses the dimpled pad against the conductive support plate. The ground trace and the dimpled pad may form a return path to ground for the resonating element. The dimpled pad may occupy less height within the device than other structures such as metal springs.

公开(公告)号：US20240079782A1

公开(公告)日：2024-03-07

申请号：US18458916

申请日：2023-08-30

Applicant: Apple Inc.

Inventor： Alden T. Rush ,  Han Wang ,  Jingni Zhong ,  Ming Chen ,  Yiren Wang ,  Yuan Tao ,  Hao Xu ,  Hongfei Hu ,  Mattia Pascolini

IPC: H01Q7/00 ,  H01Q1/38 ,  H01Q1/48

CPC classification number: H01Q7/00 ,  H01Q1/38 ,  H01Q1/48

Abstract: An electronic device may be provided with a housing and an antenna. The antenna may be on a first substrate mounted to a second substrate. The housing may include a dielectric cover, a conductive plate on the dielectric cover, and a mid-chassis. The second substrate may be mounted to the mid-chassis. The antenna may include a conductive patch extending from a segment of a conductive ring on the first substrate. The conductive plate may have an opening aligned with the conductive patch. The first substrate may be separated from the dielectric cover by an air gap. A conductive gasket may couple the conductive ring to the conductive plate and may laterally surround the air gap and the opening. The antenna may convey ultra-wideband (UWB) signals through the air gap, the opening, and the dielectric cover layer.

公开(公告)号：US20240079761A1

公开(公告)日：2024-03-07

申请号：US18458835

申请日：2023-08-30

Applicant: Apple Inc.

Inventor： Jingni Zhong ,  Ming Chen ,  Han Wang ,  Alden T Rush ,  Behnam Ghassemiparvin ,  Bhaskara R Rupakula ,  Yiren Wang ,  Yuan Tao ,  Hao Xu ,  Jennifer M Edwards ,  Hongfei Hu ,  Mattia Pascolini

IPC: H01Q1/24 ,  H01Q1/48

CPC classification number: H01Q1/243 ,  H01Q1/48 ,  H01Q9/0407

Abstract: An electronic device may be provided with a flexible printed circuit and a rigid printed circuit mounted to the flexible printed circuit using a board-to-board (B2B) connector. The flexible printed circuit may include signal conductors coupled to one or more antennas on the rigid printed circuit through the B2B connector. A given one of the signal conductors may include a phase shifter segment on the flexible printed circuit and/or a thick impedance matching segment on the rigid printed circuit that help to form a smooth impedance transition from the flexible printed circuit to the rigid printed circuit and the antenna(s). The B2B connector may include signal contacts interleaved with a ground contacts. The B2B connector may include ground bars laterally surrounding the signal and ground contacts to maximize the strength of mechanical coupling between the flexible printed circuit and the rigid printed circuit.

公开(公告)号：US20240072417A1

公开(公告)日：2024-02-29

申请号：US18502979

申请日：2023-11-06

Applicant: Apple Inc.

Inventor： Jennifer M. Edwards ,  Harish Rajagopalan ,  Simone Paulotto ,  Bilgehan Avser ,  Hao Xu ,  Rodney A. Gomez Angulo ,  Siwen Yong ,  Matthew A. Mow ,  Mattia Pascolini

IPC: H01Q1/24 ,  H01Q1/38 ,  H01Q3/26 ,  H01Q9/04 ,  H01Q21/06 ,  H01Q21/22

CPC classification number: H01Q1/243 ,  H01Q1/38 ,  H01Q3/26 ,  H01Q3/2605 ,  H01Q3/2658 ,  H01Q9/0414 ,  H01Q21/061 ,  H01Q21/065 ,  H01Q21/22

Abstract: An electronic device may be provided with a dielectric cover layer, a dielectric substrate, and a phased antenna array on the dielectric substrate for conveying millimeter wave signals through the dielectric cover layer. The array may include conductive traces mounted against the dielectric layer. The conductive traces may form patch elements or parasitic elements for the phased antenna array. The dielectric layer may have a dielectric constant and a thickness selected to form a quarter wave impedance transformer for the array at a wavelength of operation of the array. The substrate may include fences of conductive vias that laterally surround each of the antennas within the array. When configured in this way, signal attenuation, destructive interference, and surface wave generation associated with the presence of the dielectric layer over the phased antenna array may be minimized.

公开(公告)号：US20230420830A1

公开(公告)日：2023-12-28

申请号：US18324835

申请日：2023-05-26

Applicant: Apple Inc.

Inventor： Dimitrios Papantonis ,  Eduardo Jorge Da Costa Bras Lima ,  Yuko N Kanagy ,  Jiaxiao Niu ,  Mario Martinis ,  Andrea Ruaro ,  Jayesh Nath ,  Mattia Pascolini

IPC: H01Q1/27 ,  H01Q1/48 ,  H01Q1/50 ,  H01Q9/04 ,  G04G17/04 ,  G04C10/00 ,  H02J50/10

CPC classification number: H01Q1/273 ,  H01Q1/48 ,  H01Q1/50 ,  H01Q9/0407 ,  G04G17/045 ,  G04C10/00 ,  H02J50/10

Abstract: An electronic device may have conductive sidewalls and a rear wall. The rear wall may have a first portion mounted to the sidewalls and a second portion protruding away from the first portion to define a cavity. A sensor board may be mounted within the cavity. A coil structure may be mounted within the cavity and surrounding the sensor board. An antenna may have an antenna ground separated from a patch element by an antenna volume. The patch element may include a first conductive trace on the first portion of the rear wall, a second conductive trace on the sensor board, and a conductive interconnect structure that couples the first conductive trace to the second conductive trace. The coil structure may be disposed outside of the antenna to minimize impact of the coil structure on performance of the antenna.