公开(公告)号：US20230191517A1

公开(公告)日：2023-06-22

申请号：US18082711

申请日：2022-12-16

申请人： COMMISSARIAT À L'ÉNERGIE ATOMIQUE ET AUX ÉNERGIES ALTERNATIVES ,  OTICON MEDICAL A/S ,  INSTITUT POLYTECHNIQUE DE GRENOBLE ,  UNIVERSITÉ GRENOBLE ALPES ,  CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE

发明人： Marie Fischer ,  Valerie Chaumat ,  Camille Godinot ,  Fiqiri Hodaj ,  Ania Merlet ,  Guillaume Tourrel

IPC分类号： B23K1/00 ,  A61N1/05 ,  B23K1/20 ,  B23K35/30 ,  C22C5/02

CPC分类号： B23K1/0008 ,  A61N1/0541 ,  B23K1/20 ,  B23K35/3013 ,  C22C5/02 ,  B23K2103/52

摘要： A method for assembling a zirconia part to a titanium element with braze, the method comprising the following steps: coating a surface of the titanium element with a niobium layer, positioning a braze between the zirconia part and the niobium, the braze being of gold or a gold alloy, heating the whole to a temperature higher than the melting temperature of the braze, and then cooling the whole, whereby an assembly comprising the zirconia part and the titanium element assembled by a brazing joint comprising a first portion of gold or a gold alloy, a second portion formed by a reaction layer comprising intermetallics of the AuNbTi system, and a third portion formed by an oxide reaction layer is obtained.

公开(公告)号：US11628519B2

公开(公告)日：2023-04-18

申请号：US17357443

申请日：2021-06-24

申请人： Lenovo (Singapore) Pte. Ltd.

发明人： Ko Inaba ,  Tetsu Takemasa ,  Tadashi Kosuga

IPC分类号： B23K35/26 ,  C22C12/00 ,  B23K1/00 ,  H05K3/34 ,  H01L25/07 ,  H01L25/18 ,  C22C13/02 ,  B23K1/20 ,  B23K1/008 ,  C22C13/00 ,  B23K101/42

摘要： A solder joint, for bonding an electrode of a circuit board to an electrode of an electronic component, that includes: an Sn—Bi-based solder deposited on the electrode of the circuit board; and a solder alloy deposited on the electrode of the electronic component. The Sn—Bi-based solder alloy has a lower melting point than the solder alloy deposited on the electrode of the electronic component. Fine Bi phases in the solder joint each have an area of less than or equal to 0.5 μm2. Coarse Bi phases in the solder joint each have an area of greater than 0.5 μm2 and less than or equal to 5 μm2. A proportion of the fine Bi phases among the fine Bi phases and the coarse Bi phases is greater than or equal to 60%.

公开(公告)号：US11618107B2

公开(公告)日：2023-04-04

申请号：US16941125

申请日：2020-07-28

申请人： HAMANAKODENSO CO., LTD. ,  DENSO CORPORATION

发明人： Sadayuki Tsuda ,  Atsushi Furumoto ,  Yoshinori Suzuki

IPC分类号： B23K31/02 ,  B23K1/20 ,  H01R43/02 ,  B23K101/40

摘要： An electric component manufacturing device includes a preheater that contacts and preheats a transported work, a melting heater that is downstream of the preheater in a transport direction of the work and contacts and heats the work at a temperature which is higher than a temperature of the preheater and at which a solder melts, a cooler that is downstream of the melting heater in the transport direction and contacts and cools the work, and a transporter that supports and transports the work to sequentially contact the preheater, the melting heater, and the cooler in this order. The transporter performs intermittent transport in which the work is transported from the preheater to the melting heater without stopping to contact both the preheater and the melting heater at the same time, and then the work stops on the melting heater.

公开(公告)号：US20230095943A1

公开(公告)日：2023-03-30

申请号：US18073480

申请日：2022-12-01

申请人： Abbott Cardiovascular System Inc.

发明人： John A. Simpson ,  Jeffrey F. Dooley ,  Matthew J. Gillick

IPC分类号： B23K1/20 ,  B23K3/06 ,  B23K35/02 ,  B23K35/30 ,  C23C2/00 ,  C23C2/02 ,  C23C2/04 ,  C23C2/26 ,  C23C2/38 ,  B23K1/08 ,  C23C2/08 ,  B23K1/00 ,  B05C3/172 ,  B05C3/00 ,  B05D7/20

摘要： A method of pretinning a core wire for a guidewire having an elongate axis, comprising placing a ball of solder within a pocket in a soldering block; melting the ball of solder; holding a core wire over the ball of solder, with the elongate axis in a horizontal orientation; lowering a portion of the core wire into the ball of solder while maintaining the elongate axis in a horizontal orientation; removing the core wire from the ball of solder.

公开(公告)号：US11612955B2

公开(公告)日：2023-03-28

申请号：US17120542

申请日：2020-12-14

申请人： VOLKSWAGEN AKTIENGESELLSCHAFT ,  IPG Laser GmbH

发明人： Thorge Hammer ,  Wilfried Reimann ,  Eugene Shcherbakov

IPC分类号： B23K26/06 ,  B23K1/005 ,  B23K1/20 ,  B23K26/24 ,  B23K26/354 ,  B23K26/361 ,  B23K101/34 ,  B23K103/08

摘要： A joining device and method for laser-based joining of two components includes a first laser radiation source, a first radiation guide connected to the first radiation source to couple first laser radiation into the first radiation guide, a second laser radiation source, at least one second radiation guide connected to the second radiation source to couple second laser radiation into the second radiation guide, and a focusing device coupled to the laser radiations and focusing them at a distance from each other into a joining zone of the components. To reduce installation effort, the focusing device focuses the first and second laser radiations through a common beam path and a coupling device is connected on its input side to the first and second radiation guides and on its output side to the focusing device. The coupling device couples the first and second laser radiations into the common beam path.

公开(公告)号：US20230023353A1

公开(公告)日：2023-01-26

申请号：US17677702

申请日：2022-02-22

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Chi-Chun Peng ,  Chih-Yuan Chiu ,  Min-Yu Wu ,  Yi-Kai Tu ,  Cheng-Lung Wu

IPC分类号： H01L23/00 ,  H01L23/32 ,  B23K1/20 ,  B23K3/08

摘要： A die dipping structure includes a plate including a first recessed portion having a first depth and filled with a first flux material. The plate further includes a second recessed portion, isolated from the first recessed portion, with a second depth and filled with a second flux material. The second depth is different from the first depth. The die dipping structure further includes a motor configured to move the plate so as to simultaneously dip a first die and a second die into the flux of the first recessed portion and the flux of the second recessed portion, respectively.

公开(公告)号：US11548086B2

公开(公告)日：2023-01-10

申请号：US16723781

申请日：2019-12-20

申请人： Abbott Cardiovascular Systems Inc.

发明人： John A. Simpson ,  Jeffrey F. Dooley ,  Matthew J. Gillick

IPC分类号： C23C2/38 ,  B23K1/20 ,  B23K3/06 ,  B23K35/02 ,  B23K35/30 ,  C23C2/00 ,  C23C2/02 ,  C23C2/04 ,  C23C2/26 ,  B23K1/08 ,  C23C2/08 ,  B23K1/00 ,  B05C3/172 ,  B05C3/00 ,  B05D7/20 ,  B23K101/32

摘要： A method of pretinning a guidewire core made of shape memory alloy and having an elongate axis, comprising: placing a ball of solder in a pocket in a soldering block; melting the ball of solder; holding a guidewire core over the ball of solder; lowering the guidewire core into the ball of solder; removing the guidewire from the ball of solder.

公开(公告)号：US20220339744A1

公开(公告)日：2022-10-27

申请号：US17474805

申请日：2021-09-14

申请人： SK hynix Inc. ,  Evertech Enterprise Co., Ltd.

发明人： Hyun Suk LEE ,  Sang Hoon YOON ,  Gwang Hyeon GOH ,  Jang Rak CHOI ,  Yong Ju SEO ,  Chang Il YOO ,  Seung Hoon LEE ,  Da Been PARK

IPC分类号： B23K35/362 ,  B23K1/00 ,  B23K1/20 ,  H01L23/00

摘要： A flux composition includes an aromatic resin including one benzene ring and one or two hydroxyl (—OH) groups, an activator selected from a group consisting of a dicarboxylic acid and a dicarboxylic anhydride, and a solvent.

公开(公告)号：US11471967B2

公开(公告)日：2022-10-18

申请号：US16713185

申请日：2019-12-13

申请人： Tyco Electronics (Shanghai) Co. Ltd. ,  Measurement Specialties (China) Ltd. ,  Shenzhen AMI Technology Co., Ltd.

发明人： Yingcong Deng ,  Jeffrey Rochette ,  Qiyu Cai ,  Yang Zhou ,  Wenzhao Liao ,  Yumin Lan ,  Yanbing Fu ,  Yun Liu ,  Dandan Zhang ,  Qinglong Zeng

IPC分类号： H05K3/34 ,  B23K1/20 ,  B23K1/00

摘要： A fixation apparatus includes a base, a wire fixing device mounted on the base, and a pressing device mounted on the base. The wire fixing device positions and fixes a wire on a circuit board and includes a fixing frame mounted on the base and a moving unit received in a receiving chamber of the fixing frame. The fixing frame has a first positioning groove. The moving unit is movable between a clamping position and a release position and has a second positioning groove coupled with the first positioning groove. The wire is inserted into a wire insertion hole in the circuit board between the first positioning groove and the second positioning groove when the mobile unit is moved to the release position. The wire is clamped and fixed between the first positioning groove and the second positioning groove when the moving unit is moved to the clamping position.

公开(公告)号：US20220316071A1

公开(公告)日：2022-10-06

申请号：US17607996

申请日：2020-03-25

申请人： Amosense Co., Ltd.

发明人： Ji-Hyung LEE

IPC分类号： C23F1/02 ,  B23K1/20

摘要： The present invention is a method of manufacturing a ceramic substrate, the method including forming a mask on one surface of a metal layer, forming an inclined protrusion by etching the metal layer exposed by the mask, and bonding the metal layer on which the inclined protrusion is formed to a ceramic base material, and according to the present invention, the inclined protrusion is formed on an outer perimeter of the metal layer bonded to the ceramic base material to increase a bonding strength between the ceramic base material and the metal layer and facilitate a metal layer etching process.