公开(公告)号：US06949011B2

公开(公告)日：2005-09-27

申请号：US10231762

申请日：2002-08-28

Applicant: Scott E. Moore ,  Dinesh Chopra

Inventor： Scott E. Moore ,  Dinesh Chopra

IPC: B24B21/04 ,  B24B53/007 ,  B24B53/017 ,  H01L21/00 ,  B24B1/00

CPC classification number: B24B53/017 ,  B24B21/04 ,  H01L21/67051

Abstract: A method and apparatus for cleaning a web-based chemical-mechanical planarization (CMP) system. Specifically, a fluid spray bar is coupled to a frame assembly which may be mounted on a CMP system. The fluid spray bar will move along the frame assembly. As the fluid spray bar traverses the length of the frame assembly, a cleaning fluid is sprayed onto the web in order to clean the web between planarization cycles.

Abstract translation: 一种用于清洁基于网络的化学 - 机械平面化（CMP）系统的方法和设备。 具体地，流体喷射杆联接到可以安装在CMP系统上的框架组件。 流体喷射杆将沿框架组件移动。 当流体喷射杆穿过框架组件的长度时，将清洁流体喷洒到卷筒纸上，以便在平坦化循环之间清洁卷材。

公开(公告)号：US06932679B2

公开(公告)日：2005-08-23

申请号：US10295197

申请日：2002-11-15

Applicant: Homayoun Talieh ,  Konstantin Volodarsky ,  Jalal Ashjaee ,  Douglas W. Young

Inventor： Homayoun Talieh ,  Konstantin Volodarsky ,  Jalal Ashjaee ,  Douglas W. Young

IPC: B24B21/04 ,  B24B21/08 ,  B24B21/22 ,  B24B37/04 ,  B24B47/04 ,  B24B49/16 ,  B24B1/00

CPC classification number: B24B21/04 ,  B24B21/08 ,  B24B21/22 ,  B24B37/013 ,  B24B37/04 ,  B24B37/205 ,  B24B47/04 ,  B24B49/16

Abstract: The present invention includes a polishing pad or belt secured to a mechanism that allows the pad or belt to move in a reciprocating manner, i.e. in both forward and reverse directions, at high speeds. The constant bidirectional movement of the polishing pad or belt as it polishes the wafer provides superior planarity and uniformity across the wafer surface. When a fresh portion of the pad is required, the pad is moved through a drive system containing rollers, such that the rollers only touch a back side of the pad, thereby minimizing sources of friction other than the wafer that is being polished from the polishing side of the pad, and maximizing the lifetime of the polishing pad.

Abstract translation: 本发明包括固定到机构的抛光垫或皮带，该机构允许垫或带以往往的方式即即向前和向后两个方向高速移动。 抛光垫或带在其抛光晶片时恒定的双向运动在晶片表面上提供了优异的平面性和均匀性。 当需要衬垫的新鲜部分时，衬垫移动通过包含辊的驱动系统，使得辊仅接触衬垫的背面，从而最小化除了从抛光抛光的晶片之外的摩擦源 并且使抛光垫的寿命最大化。

公开(公告)号：US06926582B2

公开(公告)日：2005-08-09

申请号：US10123320

申请日：2002-04-16

Applicant: Karl Frank Beckle ,  Michael William Chaw ,  Richard H. Koch ,  Mark Clinton Thurber ,  Bruno Alejandro Valdes

Inventor： Karl Frank Beckle ,  Michael William Chaw ,  Richard H. Koch ,  Mark Clinton Thurber ,  Bruno Alejandro Valdes

IPC: B24B7/22 ,  B24B21/04 ,  G11B5/187 ,  G11B5/60

CPC classification number: G11B5/6005 ,  B24B7/228 ,  B24B21/04 ,  B24B37/048 ,  G11B5/1871 ,  Y10T29/49032 ,  Y10T29/49041 ,  Y10T29/53165

Abstract: A system and method for burnishing the edges and corners of hard disk drive sliders uses a combination of flexible tape fixturing and mechanical protrusions located beneath the tape to systematically orient selected slider corners and edges to be exposed to an abrasive in a flexible manner. This solution carefully exposes the sliders even when there is very little clearance between the sliders. A variety of different rounding geometries are achieved by customizing the protrusions underneath the flexible tape. Multiple slider corners and/or edges are exposed to the abrasive at one time for bulk processing. The sliders are oriented in such a way that sensitive structures located on the air bearing surfaces of the sliders are not harmed during burnishing.

Abstract translation: 用于抛光硬盘驱动器滑块的边缘和角落的系统和方法使用柔性带固定和位于带下方的机械突起的组合，以系统地定向所选择的滑块拐角和边缘以以柔性方式暴露于研磨剂。 即使滑块之间的间隙非常小，该解决方案也会仔细地露出滑块。 通过定制柔性带下方的突起来实现各种不同的圆形几何形状。 多个滑块拐角和/或边缘一次暴露于研磨剂进行批量加工。 滑块的定位方式使得位于滑块的空气支承表面上的敏感结构在抛光过程中不受损害。

公开(公告)号：US06908369B2

公开(公告)日：2005-06-21

申请号：US10616574

申请日：2003-07-09

Applicant: Tetsujiro Tada

Inventor： Tetsujiro Tada

IPC: B24B7/17 ,  B24B21/00 ,  B24B21/04 ,  B24B7/30

CPC classification number: B24B21/04 ,  B24B7/17 ,  B24B21/004

Abstract: An apparatus for smoothing a surface of a rotatably supported substrate includes a base plate, a block having an extending arm structure and being attached to the base plate so as to be movable along the surface of the base plate, a roller attached to a tip portion of the arm structure in a direction perpendicular to the base plate, a mobile member attached to the arm structure so as to be movable perpendicularly to the axial direction of the roller, a tape-running device attached to the base plate for feeding and taking up a polishing tape through the roller so as to advance the tape around the mobile member, and a moving device attached to the arm structure of the block for moving the mobile member.

Abstract translation: 用于使可旋转支撑的基板的表面平滑的装置包括基板，具有延伸臂结构的块，并且被附接到基板，以便能够沿着基板的表面移动，安装到末端部分的辊 所述臂结构沿垂直于所述基板的方向移动;移动构件，其附接到所述臂结构以能够垂直于所述辊的轴向移动;带运行装置，安装在所述基板上用于进给和卷取 通过辊子的抛光带，以使胶带围绕可移动部件前进;以及移动装置，附接到块的臂结构，用于移动移动部件。

公开(公告)号：US20050118936A1

公开(公告)日：2005-06-02

申请号：US10724350

申请日：2003-11-26

Applicant: Anil Pant ,  Rahul Jairath ,  Kamal Mishra ,  Saket Chadda ,  Wilbur Krusell

Inventor： Anil Pant ,  Rahul Jairath ,  Kamal Mishra ,  Saket Chadda ,  Wilbur Krusell

IPC: B24B37/20 ,  B24B21/00 ,  B24B21/04 ,  B24B37/04 ,  B24B37/24 ,  B24D11/00 ,  B24D11/06 ,  H01L21/304 ,  B24B1/00

CPC classification number: B24B37/04 ,  B24B21/04 ,  B24D11/00 ,  B24D11/06

Abstract: An integrated pad and belt for polishing a surface comprising a belt integrated with a polishing pad that forms a seamless polishing surface.

Abstract translation: 一种用于抛光表面的集成垫和带，包括与抛光垫一体的带，其形成无缝抛光表面。

公开(公告)号：US06899601B2

公开(公告)日：2005-05-31

申请号：US10631050

申请日：2003-07-29

Applicant: John M. Boyd

Inventor： John M. Boyd

IPC: B24B21/04 ,  B24B53/007 ,  B24B53/017 ,  B24B57/02 ,  B24B1/00

CPC classification number: B24B53/017 ,  B24B21/04 ,  B24B57/02

Abstract: A method and apparatus for conditioning a polishing pad is described. The method includes applying a stream of pressurized liquid to the polishing pad, and removing a significant amount of slurry and liquid from the polishing pad using a vacuum. The apparatus includes a liquid distribution unit forming at least one opening upon which liquid is forced through at high pressure, the opening directed at the polishing pad, and a liquid recovery unit positioned downstream from the liquid distribution unit and in communication with the polishing pad, the liquid recovery unit connected with a vacuum for removing liquid and slurry from the polishing pad.

Abstract translation: 描述了一种用于调节抛光垫的方法和装置。 该方法包括将加压液体流施加到抛光垫，以及使用真空从抛光垫中去除大量的浆料和液体。 该装置包括形成至少一个开口的液体分配单元，液体在高压下被迫通过，开口指向抛光垫，液体回收单元位于液体分配单元的下游并与抛光垫连通， 液体回收单元与用于从抛光垫去除液体和浆料的真空相连。

公开(公告)号：US06881127B2

公开(公告)日：2005-04-19

申请号：US09915657

申请日：2001-07-25

Applicant: Gundu M. Sabde ,  Whonchee Lee

Inventor： Gundu M. Sabde ,  Whonchee Lee

IPC: B24B21/04 ,  B24B37/24 ,  B24B37/26 ,  C10M125/20 ,  C10M129/08 ,  C10M145/04 ,  C10M145/28 ,  C10M145/30 ,  C10M173/02 ,  C10N20/02 ,  C10N40/00 ,  H01L21/304 ,  B24B1/00

CPC classification number: B24B37/245 ,  B24B21/04 ,  B24B37/26 ,  B24D2203/00

Abstract: Methods and apparatuses for planarizing microelectronic substrate assemblies on fixed-abrasive polishing pads with non-abrasive lubricating planarizing solutions. One aspect of the invention is to deposit a lubricating planarizing solution without abrasive particles onto a fixed-abrasive polishing pad having a body, a planarizing surface on the body, and a plurality of abrasive particles fixedly attached to the body at the planarizing surface. The front face of a substrate assembly is pressed against the lubricating planarizing solution and at least a portion of the fixed abrasive particles on the planarizing surface of the polishing pad. At least one of the polishing pad or the substrate assembly is then moved with respect to the other to impart relative motion therebetween. As the substrate assembly moves relative to the polishing pad, regions of the front face are separated from the abrasive particles in the polishing pad by a lubricant-additive in the lubricating planarizing solution.

Abstract translation: 在具有非磨蚀性润滑平坦化溶液的固定研磨抛光垫上平面化微电子基板组件的方法和装置。 本发明的一个方面是将没有磨料颗粒的润滑平坦化溶液沉积在具有主体，主体上的平坦化表面的固定磨料抛光垫上，以及在平坦化表面处固定地附接到主体的多个磨料颗粒。 衬底组件的前表面被压在抛光垫的平坦化表面上的润滑平坦化溶液和固定磨料颗粒的至少一部分上。 然后抛光垫或基板组件中的至少一个相对于另一个移动以在其间进行相对运动。 当基板组件相对于抛光垫移动时，前表面的区域通过润滑平面化溶液中的润滑剂添加剂与抛光垫中的磨料颗粒分离。

公开(公告)号：US06846222B2

公开(公告)日：2005-01-25

申请号：US10379497

申请日：2003-03-04

Applicant: Mark A. Church ,  Alain M. L. Desouches ,  Glenn P. Gee

Inventor： Mark A. Church ,  Alain M. L. Desouches ,  Glenn P. Gee

IPC: B24B21/04 ,  B24B37/04 ,  B24B37/16 ,  B24B49/16 ,  B24B49/00 ,  B24B51/00

CPC classification number: B24B37/16 ,  B24B21/04 ,  B24B37/048 ,  B24B49/16

Abstract: An apparatus and method of lapping of rows of magnetic recording heads uses multiple fluid-filled ports with variable pressure against a flexible adhesive tape to secure to and support the row. The tape provides the necessary tangential restraining force to drag the workpiece along a lapping plate. The multiple ports beneath the tape provide the necessary normal force to press the workpiece against the lapping plate to allow lapping to occur. The amount of material removal from the row is varied by adjusting the pressure in the ports such that higher pressure is applied to those heads with higher stripe height, and lower pressure is applied to recording heads with lower stripe height. To set or adjust the port pressures, measurements of the read sensor resistance are taken to calculate the stripe height. The stripe height is roughly proportional to the reciprocal of resistance.

Abstract translation: 研磨磁记录头的行的装置和方法使用多个流体填充的端口，其可变压力抵靠柔性胶带固定并支撑该行。 胶带提供必要的切向限制力，以沿研磨板拖动工件。 胶带下面的多个端口提供必要的法向力，以将工件压靠在研磨板上以允许研磨发生。 通过调节端口中的压力来改变从行排出的材料的量，使得对具有较高条纹高度的那些头部施加更高的压力，并且将较低的压力施加到具有较低条纹高度的记录头。 要设置或调整端口压力，可以测量读取传感器电阻以计算条带高度。 条纹高度大致与电阻倒数成正比。

公开(公告)号：US20050009452A1

公开(公告)日：2005-01-13

申请号：US10711229

申请日：2004-09-02

Applicant: Saket Chadda ,  Timothy Dyer ,  Clinton Fruitman

Inventor： Saket Chadda ,  Timothy Dyer ,  Clinton Fruitman

IPC: B24B21/04 ,  B24B37/10 ,  B24B1/00

CPC classification number: B24B37/105 ,  B24B21/04

Abstract: An apparatus for planarizing a workpiece has a web with a face which is positioned adjacent the workpiece during planarization. At least one tension assembly is configured to maintain tension of the web. An orbiting assembly is configured to orbit the web relative to the workpiece. The apparatus for planarizing a workpiece may include first and second polishing surfaces where the first polishing surface has a substantially horizontal web with a face which is positioned adjacent the workpiece during the planarization process. The apparatus may also have a rotatable carousel and at least two workpiece carriers suspended from the carousel. Each of the carriers is configured to carry a workpiece and press the workpiece against one of the polishing surfaces while causing relative motion between the workpiece and the polishing surface. An apparatus for planarizing a workpiece which includes a plurality of polishing stations is also disclosed. At least one of the polishing stations has a web with a first face which is positioned adjacent the workpiece during planarization . The apparatus also includes an orbiting assembly configured to orbit the web relative to the workpiece.

Abstract translation: 用于平坦化工件的装置具有在平坦化期间具有与工件相邻定位的面的腹板。 至少一个张力组件被配置成保持卷材的张力。 轨道组件被配置为相对于工件来绕轨道轨道。 用于平坦化工件的设备可以包括第一和第二抛光表面，其中第一抛光表面具有基本上水平的腹板，其中在平坦化过程期间邻近工件定位面。 该装置还可以具有可旋转的转盘和至少两个从转盘中悬挂的工件载体。 每个载体构造成承载工件并将工件压靠在抛光表面之一上，同时引起工件和抛光表面之间的相对运动。 还公开了一种用于平坦化包括多个抛光站的工件的设备。 抛光站中的至少一个具有在平坦化期间具有与工件相邻定位的第一面的腹板。 该装置还包括构造成相对于工件使幅材轨道运动的轨道组件。

公开(公告)号：US5997388A

公开(公告)日：1999-12-07

申请号：US909187

申请日：1997-08-11

Applicant: Robert L. Canella ,  Tony T. Ibarra

Inventor： Robert L. Canella ,  Tony T. Ibarra

IPC: B24B21/04 ,  H01L21/00 ,  B24B7/06

CPC classification number: H01L21/67282 ,  B24B21/04

Abstract: A de-marking apparatus and method are provided for de-marking a marked packaged integrated circuit (IC). The de-marking apparatus comprises a de-marking head for removing a thin layer of material from the marked surface. The apparatus may also include mechanisms for feeding, transferring and conveying the marked ICs to and from the de-marking head, and washing, drying, and receiving the de-marked ICs in an automated fashion. The method includes physically removing package material from a marked IC surface and producing a surface reflectivity suitable for re-marking with a laser beam.

Abstract translation: 提供了一种用于对标记的封装集成电路（IC）进行标记的去标记装置和方法。 去标记装置包括用于从标记表面去除薄层材料的去标记头。 该设备还可以包括用于将标记的IC进给，传送和传送到去标记头的机构，以及以自动方式洗涤，干燥和接收去标记的IC。 该方法包括从标记的IC表面物理移除封装材料并产生适于用激光束重新标记的表面反射率。