公开(公告)号：US20100051327A1

公开(公告)日：2010-03-04

申请号：US12514365

申请日：2007-10-09

Applicant: Toshinobu Ogatsu

Inventor： Toshinobu Ogatsu

IPC: H05K1/03

CPC classification number: H05K3/4688 ,  H05K1/0366 ,  H05K1/0393 ,  H05K3/4635 ,  H05K3/4691 ,  H05K2201/0287 ,  H05K2201/029 ,  H05K2201/0296 ,  H05K2201/09018 ,  H05K2203/302 ,  Y10T428/24917 ,  Y10T442/3065 ,  Y10T442/3195 ,  Y10T442/3236

Abstract: Provided is a multilayer-wired substrate for mobile electric equipment, wherein the multilayer-wired substrate is very strong, includes a larger elastically deformable region and a higher elasticity than those of the conventional structure, and can be curved. The multilayer-wired substrate is a multilayer-wired substrate including one or more insulating layers. At least one insulating layer of the substrate is made of a material in which the mechanical characteristic in an in-plane direction component exhibits anisotropy.

Abstract translation: 本发明提供一种移动电子设备用多层布线基板，其中多层布线基板非常坚固，包括比常规结构更大的弹性变形区域和更高的弹性，并且可以是弯曲的。 多层布线基板是包括一个或多个绝缘层的多层布线基板。 衬底的至少一个绝缘层由其中面内方向分量的机械特性表现出各向异性的材料制成。

公开(公告)号：US20050121828A1

公开(公告)日：2005-06-09

申请号：US10505589

申请日：2003-02-27

Applicant: Kazushi Kobue ,  Tomofumi Sakai ,  Yoshiharu Suzuki ,  Diego Scari ,  Marco Scari

Inventor： Kazushi Kobue ,  Tomofumi Sakai ,  Yoshiharu Suzuki ,  Diego Scari ,  Marco Scari

IPC: C08J5/24 ,  C03B37/08 ,  D03D15/00 ,  D03D15/12 ,  H05K1/03 ,  B29C31/00

CPC classification number: D03D15/0011 ,  H05K1/0366 ,  H05K2201/029 ,  H05K2201/0296

Abstract: Method of production of glass fabric that does not exhibit surface hairiness, that is sufficiently close-woven, with which printed circuits with a high degree or rigidity can be realized, as well at supply of a glass fabric, prepreg and print circuits. Glass fabric (40) woven from warp yarn (20) and weft yarn (30) containing multiple glass filaments; in relation to the warp yarn (20) and the weft yarn (30), at least one of the two has not undergone twisting and the profile of its glass filament has been flattened. Since between warp yarn (20) and weft yarn (30), at least one of the two has not undergone twisting, it is possible to limit the surface hairiness and at the same time to obtain that the fabrics arm separated and uniformly distributed during the weaving operation also without performing a specific treatment of uniform fibers redistribution. Moreover, since between warp yarn (20) and weft yarn (30), the filament F of at least one of the two has a flattened profile, the spacing between the filaments F is closer, the degree of distribution of the fibers of the glass fabric is higher and the rigidly of the printed circuit laminate is greater.

Abstract translation: 玻璃织物的制造方法，也可以实现玻璃织物，预浸料坯和印刷电路的供给，不会发生表面起毛，即具有足够接近编织的玻璃织物，具有高度或刚性的印刷电路。 由经纱（20）和含有多根玻璃丝的纬纱（30）编织的玻璃织物（40） 相对于经纱（20）和纬纱（30），两者中的至少一个没有经受扭转，并且其玻璃丝的轮廓已经变平。 由于在经纱（20）和纬纱（30）之间，两者中的至少一个没有经受扭转，所以可以限制表面毛羽，并且同时可以使织物臂分离和均匀分布在 编织操作也不会对纤维均匀分布进行特殊处理。 此外，由于在经纱（20）和纬纱（30）之间，两个中的至少一个的灯丝F具有扁平的轮廓，所以灯丝F之间的间隔更接近，玻璃纤维的分布程度 织物更高，并且印刷电路层压板的刚性更大。

公开(公告)号：US06242078B1

公开(公告)日：2001-06-05

申请号：US09123952

申请日：1998-07-28

Applicant: Richard J. Pommer ,  Jeffrey T. Gotro ,  Nancy M. W. Androff ,  Marc D. Hein ,  Corey J. Zarecki

Inventor： Richard J. Pommer ,  Jeffrey T. Gotro ,  Nancy M. W. Androff ,  Marc D. Hein ,  Corey J. Zarecki

IPC: B32B300

CPC classification number: H05K3/022 ,  H01L23/5383 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K1/0366 ,  H05K3/388 ,  H05K2201/029 ,  H05K2201/0296 ,  Y10S428/901 ,  Y10T428/24917 ,  H01L2224/0401

Abstract: The present invention is a method and apparatus for providing an electrical substrate. The electrical substrate comprises a dielectric layer having a surface roughness of no greater than 6.0 microns. A first conductive layer is attached to the dielectric layer. In one embodiment, the dielectric layer comprises a laminate that comprises a cloth having a uniform weave and a resin that is consistently impregnated within the uniform weave. A removable layer may be attached to the laminate and removed prior to metallizing of the first conductive layer. Various embodiments are described.

Abstract translation: 本发明是提供电气基板的方法和装置。 电气基板包括表面粗糙度不大于6.0微米的电介质层。 第一导电层附着到电介质层。 在一个实施例中，电介质层包括层压体，其包括具有均匀织物的织物和始终浸入均匀织物中的树脂。 可去除的层可以附接到层压体并在第一导电层的金属化之前去除。 描述各种实施例。

公开(公告)号：US4981753A

公开(公告)日：1991-01-01

申请号：US246967

申请日：1988-09-21

Applicant: Hironori Ohta ,  Takashi Mukaiyama

Inventor： Hironori Ohta ,  Takashi Mukaiyama

IPC: C03B37/01 ,  C03B37/075 ,  H05K1/03

CPC classification number: C03B37/011 ,  C03B37/075 ,  H05K1/0366 ,  H05K2201/029 ,  H05K2201/0293 ,  H05K2201/0296 ,  Y10T428/2973 ,  Y10T428/298 ,  Y10T442/3008 ,  Y10T442/3114 ,  Y10T442/601 ,  Y10T442/611

Abstract: A fabric for a printed circuit substrate composed essentially of inorganic fibers having a non-circular cross section.

Abstract translation: 用于印刷电路基板的织物，其基本上由具有非圆形横截面的无机纤维组成。

公开(公告)号：US4980217A

公开(公告)日：1990-12-25

申请号：US226013

申请日：1988-07-29

Applicant: Michael A. Grundfest ,  Joseph A. Grundfest

Inventor： Michael A. Grundfest ,  Joseph A. Grundfest

IPC: B29C70/20 ,  H05K1/03 ,  H05K1/11 ,  H05K3/00

CPC classification number: B29C70/202 ,  H05K1/0366 ,  H05K1/115 ,  B29C2793/0045 ,  B29L2031/3425 ,  H05K2201/0287 ,  H05K2201/0296 ,  H05K2201/09854 ,  H05K3/0047 ,  H05K3/005 ,  Y10S428/901 ,  Y10T428/24124 ,  Y10T428/24322 ,  Y10T428/24917 ,  Y10T428/249924

Abstract: The reinforcing fibers in a printed circuit board laminate are arranged in an ordered manner to leave fiber-free zones for the formation of holes. The holes may be oblong to enhance the connection to electrical leads of components mounted on the printed circuit board. The holes may be oriented with their long dimensions transverse to the side of an electrical component, and the electrical component may have its leads correspondingly oriented, to improve wiring flexibility and allow more direct wiring paths.

Abstract translation: 印刷电路板层叠体中的增强纤维以有序的方式布置以留下用于形成孔的无纤维区域。 孔可以是长圆形的，以增强与安装在印刷电路板上的部件的电引线的连接。 孔可以以其横向于电气部件的侧面的长尺寸定向，并且电气部件可以使其引线相应地定向，以提高布线灵活性并允许更直接的布线路径。