公开(公告)号：US09910015B2

公开(公告)日：2018-03-06

申请号：US14252222

申请日：2014-04-14

Applicant: Texas Instruments Incorporated

Inventor： Stuart M. Jacobsen

IPC: G01N29/036 ,  G01N33/487 ,  G01N29/24 ,  G01N29/02

CPC classification number: G01N29/036 ,  G01N29/022 ,  G01N29/2437 ,  G01N33/48707 ,  G01N2291/0255 ,  G01N2291/0256 ,  G01N2291/0423 ,  G01N2291/0426 ,  G01N2291/0427 ,  G01N2291/106

Abstract: A method of forming a functionalized sensor array includes providing a substrate having at least one sensor array chip including a plurality of sensor structures. The sensor structures include a piezoelectric layer interposed between upper and lower electrodes and positioned across an area of the sensor array chip in a spatial arrangement. An inkjet cartridge chip is also provided having a plurality of microfluidic channels including a fill side having a plurality of fill side orifices and a dispense side having a plurality of dispense nozzles, wherein two or more of the plurality of microchannels are loaded with different sensing materials, and wherein locations of the plurality of dispense nozzles are matched to the spatial arrangement. The plurality of dispense nozzles are aligned to the plurality of sensor structures, and the plurality of dispense nozzles are actuated to deposit the different sensing materials on the plurality of sensor structures.

公开(公告)号：US09305971B2

公开(公告)日：2016-04-05

申请号：US14816266

申请日：2015-08-03

Applicant: Texas Instruments Incorporated

Inventor： Stuart M. Jacobsen ,  Sridhar Ramaswamy ,  William Robert Krenik

IPC: H01L27/20 ,  H01L41/29 ,  H03H9/05 ,  H03H9/17

CPC classification number: H01L27/20 ,  H01L41/29 ,  H03H9/0542 ,  H03H9/175

Abstract: A semiconductor device comprises a semiconductor wafer; a piezoelectric resonator formed on the wafer, and an active circuit also formed on the wafer. The active circuit (e.g., a frequency divider) is electrically connected to the piezoelectric resonator.