公开(公告)号：US11869855B2

公开(公告)日：2024-01-09

申请号：US17953162

申请日：2022-09-26

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Zhemin Zhang ,  Kenji Otake ,  Yi Yan ,  Jeffrey Morroni ,  Yuki Sato ,  Takafumi Ando

IPC: H01L23/64 ,  H01F27/28 ,  H01F41/06 ,  H01F41/02 ,  H01F17/04 ,  H01L21/48 ,  H01L23/31 ,  H01L23/495 ,  H01L49/02 ,  H01F27/02

CPC classification number: H01L23/645 ,  H01F17/04 ,  H01F27/022 ,  H01F27/28 ,  H01F41/0206 ,  H01F41/06 ,  H01L21/4842 ,  H01L23/3114 ,  H01L23/4952 ,  H01L23/49503 ,  H01L28/10

Abstract: In examples, a method of manufacturing a transformer device comprises providing a first magnetic member and providing a laminate member containing primary and secondary transformer windings wound around an orifice extending through the laminate member. The method further comprises positioning a build up film abutting the laminate member. The method also comprises positioning at least a portion of a second magnetic member in the orifice. The method further comprises heat pressing at least one of the first and second magnetic members such that a distance between the first and second magnetic members decreases and such that the build-up film melts, thereby producing a transformer device.

公开(公告)号：US20240006392A1

公开(公告)日：2024-01-04

申请号：US17852925

申请日：2022-06-29

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Anton Winkler ,  Christopher Manack ,  Jeffrey Morroni ,  Hidetoshi Inoue ,  Yuki Sato ,  Kenji Otake

IPC: H01L25/16 ,  H01L23/00 ,  H01L23/31 ,  H01L23/29 ,  H01L49/02 ,  H01L21/54 ,  H01F27/29 ,  H01F27/32

CPC classification number: H01L25/165 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L23/3128 ,  H01L23/295 ,  H01L28/10 ,  H01L28/40 ,  H01L24/29 ,  H01L24/81 ,  H01L24/94 ,  H01L21/54 ,  H01F27/292 ,  H01F27/327 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/2919 ,  H01L2224/29186 ,  H01L2224/81447 ,  H01F41/005

Abstract: In one example, an integrated circuit comprises: a substrate; a semiconductor die; metal interconnects coupled between the semiconductor die and the substrate; an insulation layer coupled between the semiconductor die and the substrate, the insulation layer surrounding the metal interconnects; an inductor coupled to the substrate; and a magnetic material encapsulating the semiconductor die, the inductor, the metal interconnects and the insulation layer, the magnetic material having a different material from the insulation layer.

公开(公告)号：US20240006259A1

公开(公告)日：2024-01-04

申请号：US17852979

申请日：2022-06-29

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Hidetoshi Inoue ,  Kenji Otake ,  Yuki Sato ,  Takafumi Ando ,  Jeffrey Morroni ,  Anton Winkler ,  Yi Yan

IPC: H01L23/29 ,  H01L23/00 ,  H01L23/31 ,  H01L25/16 ,  H01L49/02 ,  H01L21/56 ,  H01F27/32 ,  H01F41/00

CPC classification number: H01L23/295 ,  H01L24/16 ,  H01L23/3128 ,  H01L25/165 ,  H01L28/10 ,  H01L2224/81447 ,  H01L24/81 ,  H01L21/561 ,  H01F27/327 ,  H01F41/005 ,  H01L2224/16227 ,  H01L28/40

Abstract: In one example, an integrated circuit comprises: a substrate; a semiconductor die; metal interconnects, the semiconductor die being mounted to the substrate via the metal interconnects; an inductor mounted to the substrate; and a magnetic material encapsulating the semiconductor die, the inductor, and the metal interconnects, the magnetic material including: coated metal particles, which are coated with a first insulation material; and a second insulation material, in which the coated metal particles are suspended.

公开(公告)号：US20230013938A1

公开(公告)日：2023-01-19

申请号：US17947288

申请日：2022-09-19

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Yuki Sato ,  Kenji Otake ,  Takafumi Ando ,  Jeffrey Morroni ,  Charles Allen Devries, JR. ,  Kristen Nguyen Parrish

IPC: H01L23/64 ,  H01L49/02 ,  H01L23/31 ,  H01L21/78 ,  H01L21/48 ,  H01L21/56 ,  H01L23/495

Abstract: An integrated circuit includes a substrate having an electronic component. A substrate-based coil is on the substrate. The coil is electrically coupled to the electronic component. A magnetic mold compound encapsulates the coil and the electronic component.

公开(公告)号：US11488914B2

公开(公告)日：2022-11-01

申请号：US16581033

申请日：2019-09-24

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Zhemin Zhang ,  Kenji Otake ,  Yi Yan ,  Jeffrey Morroni ,  Yuki Sato ,  Takafumi Ando

IPC: H01L23/64 ,  H01F41/06 ,  H01F41/02 ,  H01F17/04 ,  H01F27/28 ,  H01L21/48 ,  H01L23/31 ,  H01L23/495 ,  H01L49/02 ,  H01F27/02

Abstract: In examples, a method of manufacturing a transformer device comprises providing a first magnetic member and providing a laminate member containing primary and secondary transformer windings wound around an orifice extending through the laminate member. The method further comprises positioning a build up film abutting the laminate member. The method also comprises positioning at least a portion of a second magnetic member in the orifice. The method further comprises heat pressing at least one of the first and second magnetic members such that a distance between the first and second magnetic members decreases and such that the build-up film melts, thereby producing a transformer device.

公开(公告)号：US11456262B2

公开(公告)日：2022-09-27

申请号：US17138150

申请日：2020-12-30

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Yuki Sato ,  Kenji Otake ,  Takafumi Ando ,  Jeffrey Morroni ,  Charles Allen Devries, Jr. ,  Kristen Nguyen Parrish

IPC: H01L23/64 ,  H01L49/02 ,  H01L23/31 ,  H01L21/78 ,  H01L21/48 ,  H01L21/56 ,  H01L23/495

Abstract: An integrated circuit and method of making an integrated circuit is provided. The integrated circuit includes a substrate having an electronic component. A substrate-based coil is on the substrate and the substrate-based coil is electrically coupled to the electronic component. A magnetic mold compound encapsulates the substrate-based coil and the electronic component.