公开(公告)号：US20210074313A1

公开(公告)日：2021-03-11

申请号：US16952339

申请日：2020-11-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Cheheung KIM ,  Sungchan KANG ,  Sangha PARK ,  Yongseop YOON ,  Choongho RHEE ,  Hyeokki HONG

IPC: G10L21/0388 ,  H03G5/16 ,  G10L21/0232

Abstract: Sound signal processing apparatuses and methods of operating the same are provided. The sound signal processing apparatus includes: a band separator configured to separate sound signals into frequency bands; an adder configured to add sound signals; and a signal processor that is arranged between the band separator and the adder and comprises a plurality of signal processing blocks. The band separator includes elements for separating the sound signals into frequency bands, and the elements correspond one to one to the signal processing blocks.

公开(公告)号：US20190174244A1

公开(公告)日：2019-06-06

申请号：US16162795

申请日：2018-10-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Cheheung KIM ,  Sungchan KANG ,  Yongseop YOON ,  Choongho RHEE ,  Sangha PARK ,  Hyeokki HONG

IPC: H04S7/00 ,  H04R5/04 ,  G10L21/0216 ,  H04R1/32 ,  G06F3/16 ,  B60K35/00

Abstract: Provided are a directional acoustic sensor that detects a direction of sound, a method of detecting a direction of sound, and an electronic device including the directional acoustic sensor. The directional acoustic sensor includes a sound inlet through which a sound is received, a sound outlet through which the sound received through the sound inlet is output, and a plurality of vibration bodies arranged between the sound inlet and the sound outlet, in which one or more of the plurality of vibration bodies selectively react to the sound received by the sound inlet according to a direction of the received sound.

公开(公告)号：US20190028799A1

公开(公告)日：2019-01-24

申请号：US15823881

申请日：2017-11-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sangha PARK ,  Sungchan KANG ,  Cheheung KIM ,  Yongseop YOON ,  Choongho RHEE ,  Hyeokki HONG

IPC: H04R1/24 ,  H04R17/02 ,  H04R29/00

CPC classification number: H04R1/245 ,  G06F17/14 ,  H04R1/28 ,  H04R1/2807 ,  H04R3/005 ,  H04R7/08 ,  H04R9/18 ,  H04R11/14 ,  H04R17/025 ,  H04R17/10 ,  H04R29/006 ,  H04R2201/003 ,  H04R2440/03

Abstract: A signal processing method of an audio sensing device is provided. The audio sensing device includes a plurality of resonators, at least some of the plurality of resonators having different frequency bands. The method includes setting a plurality of time frames corresponding to the plurality of resonators, and calculating a sound feature for each of the plurality of time frames, the sound feature being calculated based on an audio signal detected by each of the plurality of the resonators, wherein the plurality of time frames are set independently for each of the frequency bands, and at least some of the plurality of time frames are set to have different time intervals.

公开(公告)号：US20180097506A1

公开(公告)日：2018-04-05

申请号：US15643778

申请日：2017-07-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sungchan KANG ,  Cheheung KIM ,  Sangha PARK ,  Yongseop YOON ,  Choongho RHEE

IPC: H03H9/54 ,  H03H9/13

CPC classification number: H03H9/54 ,  G01H11/08 ,  H03H9/13 ,  H03H9/24 ,  H04R17/02 ,  H04R17/10 ,  H04R25/00 ,  H04R2499/13 ,  H04R2499/15

Abstract: A filter system includes a first resonator having a first resonant frequency, and a second resonator having a second resonant frequency different from the first resonant frequency, and electrically connected to the first resonator. A first response characteristic of the first resonator and a second response characteristic of the second resonator with respect to a frequency include a first section in which a first phase of the first resonator is equal to a second phase of the second resonator, and a second section in which the first phase is different from the second phase by 180 degrees. A first electrode of the first resonator is reversely connected to a second electrode of the second resonator.

公开(公告)号：US20240121524A1

公开(公告)日：2024-04-11

申请号：US18210456

申请日：2023-06-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Choongho RHEE ,  Byonggwon SONG ,  Jangwoo YOU ,  Jaekwan KIM ,  Jinmyoung KIM ,  Wontaek SEO ,  Yongseop YOON ,  Byungkyu LEE

IPC: H04N25/21 ,  G01K7/36

CPC classification number: H04N25/21 ,  G01K7/36

Abstract: A thermal image sensor includes a substrate; a composite layer including an absorption layer and a sensor array layer provided below the absorption layer, the sensor array layer including a plurality of temperature sensing cells, the composite layer having a pattern formed therein, and the pattern including at least one hole penetrating through the absorption layer; and a support separating the substrate from the composite layer.

公开(公告)号：US20220173210A1

公开(公告)日：2022-06-02

申请号：US17671040

申请日：2022-02-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyeokki HONG ,  Cheheung KIM ,  Sungchan KANG ,  Yongseop YOON ,  Choongho RHEE

IPC: H01L49/02

Abstract: A capacitor structure includes at least one first layer and at least one second layer that are alternately stacked. The at least one first layer includes first electrodes and second electrodes alternately arranged in a first direction, and the at least one second layer includes third electrodes and fourth electrodes alternately arranged in a second direction intersecting the first direction, the third electrodes and the fourth electrodes being electrically connected to the first electrodes and the second electrodes. Each of the first electrodes and the second electrodes includes a base portion and branch portions protruding from the base portion, and the third electrodes and the fourth electrodes are arranged side by side to correspond to the branch portions.

公开(公告)号：US20220158074A1

公开(公告)日：2022-05-19

申请号：US17224254

申请日：2021-04-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Choongho RHEE ,  Sungchan KANG ,  Yongseop YOON

IPC: H01L41/113 ,  H01L41/332 ,  G01L1/16

Abstract: An etching method for forming a vertical structure is provided. The etching method may include: positioning a mask on a substrate, wherein the mask includes an opening pattern and a compensation pattern, and the compensation pattern is disposed at a corner of two adjacent sides of the opening pattern and includes a concave compensation pattern that is indented from one of the two adjacent sides; and forming the vertical structure on the substrate through the opening pattern of the mask by a dry etching process.

公开(公告)号：US20210126615A1

公开(公告)日：2021-04-29

申请号：US16880231

申请日：2020-05-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yongseop YOON ,  Sungchan KANG ,  Cheheung KIM ,  Choongho RHEE

IPC: H03H9/24 ,  H03H9/02

Abstract: A micromechanical resonator includes a support beam having a fixed end, and a free end configured to vibrate. The micromechanical resonator includes a lumped mass disposed on the free end. A height of the lumped mass is greater than a width of the lumped mass.

公开(公告)号：US20200370951A1

公开(公告)日：2020-11-26

申请号：US16574916

申请日：2019-09-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sungchan KANG ,  Hyunwook KANG ,  Yongseop YOON ,  Jaehyung JANG

IPC: G01H11/06 ,  G01H13/00

Abstract: Provided are a directional acoustic sensor and a method of detecting a distance from a sound source using the same. The directional acoustic sensor may include a plurality of resonators arranged in different directions; and a processor configured to calculate a time difference between a first signal that is received by the plurality of resonators directly from a sound source and a second signal that is received by the plurality of resonators from the sound source after being reflected on a wall surface around the sound source, and determine a distance between the sound source and the directional acoustic sensor based on the time difference.

公开(公告)号：US20200212885A1

公开(公告)日：2020-07-02

申请号：US16599275

申请日：2019-10-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Cheheung KIM ,  Sungchan KANG ,  Choongho RHEE ,  Yongseop YOON ,  Hyeokki HONG

IPC: H03H9/56

Abstract: Provided are a resonator, a method of manufacturing the resonator, and a strain sensor and a sensor array including the resonator. The resonator is provided to extend in a lengthwise direction from a support. The resonator includes a single crystal material and is provided to extend in a crystal orientation that satisfies at least one from among a Young's modulus and a Poisson's ratio, from among crystal orientations of the single crystal material.