公开(公告)号：US20230194567A1

公开(公告)日：2023-06-22

申请号：US17878414

申请日：2022-08-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kwangeun Kim ,  Seungbum Hong ,  Sungyoon Ryu ,  Hoon Kim ,  Jiwon Yeom ,  Seokjung Yun ,  Souk Kim ,  Younghoon Sohn ,  Yusin Yang

IPC: G01Q40/00 ,  H01L21/66 ,  G01Q70/10

CPC classification number: G01Q40/00 ,  H01L22/12 ,  G01Q70/10 ,  H01L27/10876

Abstract: A method of operating an atomic force microscope (AFM) is provided. The method includes inspecting a sample by using the AFM and inspecting a tip of a probe of the AFM by using a characterization sample. The characterization sample includes a first characterization pattern that includes a line and space pattern of a first height, a second characterization pattern that includes a line and space pattern of a second height that is lower than the first height, and a third characterization pattern that includes a line and space pattern of a third height that is lower than the second height, and includes a rough surface.

公开(公告)号：US10410937B2

公开(公告)日：2019-09-10

申请号：US16035991

申请日：2018-07-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jang Ik Park ,  Bong Seok Kim ,  Souk Kim ,  Yu Sin Yang ,  Soo Seok Lee

IPC: H01L21/00 ,  H01L21/66 ,  H01L21/762 ,  H01L21/78

Abstract: A method of manufacturing a semiconductor device comprising: obtaining a raw light signal by selecting a predetermined wavelength band of light reflected from a wafer on which a plurality of patterns are formed; converting the raw light signal into a frequency domain; obtaining a first detection signal having a first frequency band from the raw light signal converted into the frequency domain; obtaining a second detection signal having a second frequency band from the raw light signal converted into the frequency domain, the second frequency band being different from the first frequency band; obtaining a representative value using the first detection signal, the representative value representing a profile of the plurality of patterns; and obtaining a distribution value using the second detection signal, the distribution value representing a profile of the plurality of patterns using the second detection signal. The method may include determining whether the representative value and the distribution value are within predetermined ranges respectively; and performing a following step of manufacturing the semiconductor device when the representative value and the distribution value are within respective predetermined ranges.

公开(公告)号：US20160293379A1

公开(公告)日：2016-10-06

申请号：US15084059

申请日：2016-03-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Souk Kim ,  Chung-sam Jun ,  Woo-seok Ko ,  Sang-Kil Lee ,  Kwang-il Shin ,  Yu-sin Yang ,  Min-chul Yoon

IPC: H01J37/22 ,  H01J37/20

CPC classification number: H01J37/222 ,  H01J37/20 ,  H01J37/28 ,  H01J2237/20214 ,  H01J2237/226 ,  H01J2237/2817

Abstract: A method of inspecting a wafer may include: loading of a wafer onto a stage, the wafer having a plurality of dies thereon; positioning of the wafer such that a plurality of electron beam columns on the wafer respectively face a partial region of each of the plurality of dies on the wafer; scanning the respective partial regions of each of the plurality of dies by using the electron beam columns; and combining a plurality of partial images that are obtained by scanning the partial regions to provide a die image.

Abstract translation: 检查晶片的方法可以包括：将晶片装载到台上，所述晶片在其上具有多个管芯; 晶片的定位使得晶片上的多个电子束列分别面对晶片上的多个管芯中的每一个的部分区域; 通过使用电子束柱扫描多个管芯中的每一个的各个部分区域; 以及组合通过扫描所述部分区域获得的多个部分图像以提供管芯图像。