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公开(公告)号：US11088438B2
公开(公告)日：2021-08-10
申请号：US16676824
申请日：2019-11-07
Applicant: Samsung Electronics Co., Ltd.
Inventor： Seongjin Park , Dongyeon Kim , Sehyun Park , Sumin Yun , Woomin Jang , Myunghun Jeong , Jehun Jong , Jinwoo Jung , Jaehoon Jo
Abstract: An electronic device is provided. The electronic device includes a housing including a first plate, a second plate directed in an opposite direction to the first plate, and a side member surrounding a space between the first plate and the second plate and being combined with or being integrally formed with the second plate, a display configured to be seen through at least a part of the first plate, an antenna structure arranged inside the housing, the antenna structure including a first conductive layer including a first region including a first U-shaped slot and a second region coming in contact with the first region, and a second conductive layer facing the first conductive layer to be spaced apart from the first conductive layer, and including a third region including a second U-shaped slot facing the first U-shaped slot and a fourth region coming in contact with the third region and facing the second region, and at least one wireless communication circuitry electrically connected to the first conductive layer or the second conductive layer and configured to transmit and/or receive a signal having a frequency in a range of 3 GHz to 100 GHz. Other various embodiments are possible.
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公开(公告)号：US12272867B2
公开(公告)日：2025-04-08
申请号：US17903504
申请日：2022-09-06
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jiho Kim , Seongyong An , Sehyun Park
Abstract: A printed board assembly (PBA) is provided. The PBA includes first printed circuit board (PCB), a second PCB disposed parallel to the first PCB and including a conductive area, a first interposer surrounding a space between the first PCB and the second PCB, and a wireless communication circuit, wherein the interposer may include a first partition wall structure configured to provide shielding for at least one electronic component disposed in the PBA, and a second partition wall structure connected to the first partition wall structure and including an dielectric material, the second partition wall structure including a conductive via configured to connect the first PCB and the second PCB, and the wireless communication circuit may transmit and/or receive a signal in a specified frequency band by feeding power to the conductive area of the second PCB through the conductive via.
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公开(公告)号：US12015193B2
公开(公告)日：2024-06-18
申请号：US17423724
申请日：2020-01-07
Applicant: Samsung Electronics Co., Ltd.
Inventor： Dongyeon Kim , Seongjin Park , Sehyun Park , Sumin Yun , Myunghun Jeong , Jehun Jong , Jaehoon Jo
Abstract: Disclosed is an electronic device including: a housing including a first plate, a second plate facing away from the first plate, and a side member surrounding a space between the first plate and the second plate, connected to the second plate or integrally formed with the second plate, and including a first portion comprising a conductive material, wherein the first portion of the side member includes a plurality of through-holes aligned in a first direction substantially parallel to the first plate and a non-conductive material inside the through-holes; a structure disposed inside the space to face the through-holes and including at least one conductive path; and a wireless communication circuit electrically connected to the conductive path. Various other embodiments inferred from the specification are also possible.
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公开(公告)号：US11664579B2
公开(公告)日：2023-05-30
申请号：US16655969
申请日：2019-10-17
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jonghyuck Lee , Taeik Kim , Haeyeon Kim , Sehyun Park , Dongjun Oh , Shinho Yoon , Myeongsu Oh
CPC classification number: H01Q1/2266 , G06F1/1616 , H01Q1/2291 , H01Q1/243 , H04M1/0216 , H05K1/118
Abstract: An electronic device is provided. The electronic device includes a foldable housing, a flexible display, at least one printed circuit board (PCB), and a wireless communication circuit. The foldable housing includes a hinge structure, a first housing structure connected to the hinge structure and including a first surface facing in a first direction, a second surface facing in a direction opposite to the first direction, and a first lateral member surrounding a first space between the first surface and the second surface, and a second housing structure connected to the hinge structure and including a third surface facing in a second direction, a fourth surface facing in a direction opposite to the second direction, and a second lateral member surrounding a second space between the third surface and the fourth surface.
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公开(公告)号：US11450966B2
公开(公告)日：2022-09-20
申请号：US17269798
申请日：2019-08-29
Applicant: Samsung Electronics Co., Ltd.
Inventor： Myunghun Jeong , Sehyun Park , Sumin Yun , Jehun Jong , Jaehoon Jo , Jinwoo Jung , Jaebong Chun
Abstract: According to various embodiments, an electronic device may include a housing, an antenna structure disposed inside the housing and including a first face, a second face facing away from the first face, a first conductive helical pattern which extends between the first face and the second face and is constructed inside the antenna structure, and a second conductive helical pattern which extends between the first face and the second face, overlaps with at least in part with the first conductive helical pattern when viewed from above the first face, and is constructed inside the antenna structure, and at least one wireless communication circuit electrically coupled to a first point of the first conductive helical pattern and a second point of the second conductive helical pattern. The first point may be disposed to be spaced apart from the second point when viewed from above the first face. The at least one wireless communication circuit may be configured to provide the first point with a first signal having a frequency between 3 GHz and 100 GHz, and provide the second point with a second signal having a first phase difference with the first signal and having the frequency. Various other embodiments may also be possible.
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Patent Agency Ranking
公开(公告)号：US11411300B2
公开(公告)日：2022-08-09
申请号：US17272985
申请日：2019-09-27
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jonghyuck Lee , Haeyeon Kim , Sehyun Park
Abstract: An electronic device according to various embodiments of the present invention can comprise: a housing comprising a front plate, a rear plate which faces the opposite direction from the front plate, and a lateral bezel structure which surrounds a space between the front plate and rear plate, and the side bezel structure comprises a first conductive part, a second conductive part and a first insulating part formed between the first conductive part and second conductive part; a printed circuit board which is disposed inside the housing and comprises at least one ground layer electrically connected in a first position of the first conductive part adjacent to the first insulating part; a first conductive pattern which is electrically connected in a second position of the first conductive part further away from the first insulating part than the first position, and is disposed between the first position and second position when seen from the outside of the lateral bezel structure; a first wireless communication circuit which is electrically connected in a second position and transmits and receives a first signal having a first frequency, and is electrically connected in a third position of the second conductive part and transmits and receives a second signal having a second frequency; a second conductive pattern which is disposed between the second position and third position when seen from the outside of a lateral member, and is electrically connected to the ground layer; and a second wireless communication circuit which is electrically connected in the second position and receives a third signal having a third frequency, and is electrically connected in the third position and receives a fourth signal having a fourth frequency. Various other embodiments may be possible.
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公开(公告)号：US11363711B2
公开(公告)日：2022-06-14
申请号：US16200401
申请日：2018-11-26
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jaehoon Jo , Sehyun Park , Sumin Yun , Myunghun Jeong , Jehun Jong , Jinwoo Jung , Jaebong Chun , Eunseok Hong
Abstract: According to various embodiments of the present disclosure, an electronic device may include: a housing including a first plate and a second plate; a printed circuit board having a first surface and a second surface; and a communication circuit arranged inside the housing. The printed circuit board may include: a plurality of insulating layers laminated on each other between the first surface and the second surface; an antenna element arranged in a first region above the second surface of the printed circuit board or between a first pair of insulating layers of the printed circuit board, when seen from above the second surface of the printed circuit board; and a plurality of first electroconductive patterns arranged in a second region that at least surrounds one surface of the first region. Various embodiments may be possible.
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公开(公告)号：US11342981B2
公开(公告)日：2022-05-24
申请号：US16564256
申请日：2019-09-09
Applicant: Samsung Electronics Co., Ltd.
Inventor： Byungman Lim , Dongyeon Kim , Sehyun Park , Sumin Yun , Yoonjae Lee , Youngjun Cho
Abstract: An electronic device is provided. The electronic device includes a housing, an antenna structure including a printed circuit board, a first sub antenna structure including first group antenna elements, a second sub antenna structure including second group antenna elements disposed in a first direction from the first sub antenna structure, a third sub antenna structure including third group antenna elements disposed in a second direction perpendicular to the first direction, and a fourth sub antenna structure including fourth group antenna elements disposed to form a two-dimensional array together with at least some antenna elements of the first group antenna elements, the second group antenna elements, or the third group antenna elements, and a communication circuit that transmits and/or receives a signal having a frequency between 3 GHz and 100 GHz by using at least a part of the first, the second, the third, or the fourth group antenna elements.
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公开(公告)号：US11303021B2
公开(公告)日：2022-04-12
申请号：US16200816
申请日：2018-11-27
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sumin Yun , Sehyun Park , Myunghun Jeong , Jehun Jong , Jae Hoon Jo , Jinwoo Jung , Jae-Bong Chun
IPC: H01Q5/10 , H01Q1/24 , H01Q1/48 , H01Q21/10 , H01Q9/04 , H05K1/11 , H04B1/40 , H04B1/00 , H05K1/02 , H01Q21/28 , H04B1/3888 , H01Q5/40 , H01Q21/08 , H01Q21/24
Abstract: According to an embodiment, an electronic device comprises a housing comprising a first plate and a second plate facing away from to the first plate; and a substrate disposed between the first plate and the second plate and comprising a first side facing the first plate and a second side facing the second plate, wherein the substrate comprises, a first conductive plate disposed on a first insulating layers and facing the second side; a conductive pattern disposed on a second insulating layer, wherein the second conductive layer is between the first conductive layer and the first side; a second conductive plate disposed on a third insulating layer between the second insulating layer and the first side, and when the second plate is viewed from above the second side, the second plate at least partially overlaps with the first conductive plate; a ground plate disposed on a fourth insulating layer, wherein the fourth insulating layer is between the third insulating layer and the first side; a conductive via constructed through the third and fourth insulating layers, and electrically connected with the conductive pattern; and a wireless communication circuit electrically connected with the conductive via, and configured to transmit/receive at least one signal having a frequency band in the range of 20 GHz to 100 GHz.
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公开(公告)号：US11962068B2
公开(公告)日：2024-04-16
申请号：US17431861
申请日：2020-02-19
Applicant: Samsung Electronics Co., Ltd.
Inventor： Dongjun Oh , Taeik Kim , Haeyeon Kim , Sehyun Park , Shinho Yoon , Jonghyuck Lee
CPC classification number: H01Q1/243 , H01Q5/328 , H01Q5/385 , H01Q21/28 , H04B1/40 , H04M1/0216 , H04M1/0268 , H04M1/0277
Abstract: An electronic device is provided. The electronic device includes a first housing structure, a second housing structure, and a foldable housing structure for connecting the first housing structure and the second housing structure. The first housing structure and the second housing structure may include a front plate for interconnecting front surfaces with a flexible display, a rear plate which is an opposite surface to the front plate, a side member which surrounds a space between the front plate and the rear plate, and includes at least in part a conductive portion and an insulating portion, a communication circuit and at least one switch electrically connected to the communication circuit.
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