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    DETECTION CIRCUIT AND ELECTRONIC DEVICE INCLUDING SAME
    13.
    发明申请
    DETECTION CIRCUIT AND ELECTRONIC DEVICE INCLUDING SAME 有权

    公开(公告)号：US20220326313A1

    公开(公告)日：2022-10-13

    申请号：US17435529

    申请日：2021-08-24

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Sanguk KIM ,  Taekho LEE

    IPC: G01R31/55 ,  G01R19/00 ,  G01R15/18 ,  G01R19/165

    Abstract: Disclosed is an electronic device is provided. The electronic device includes a first substrate, a second substrate arranged to be spaced apart from the first substrate, a first cable electrically connecting a first point on the first substrate and a second point on the second substrate, and a second cable electrically connecting a third point on the first substrate and a fourth point on the second substrate. The first substrate may include a first communication circuit, a second communication circuit, a detection circuit, a voltage application unit, and a ground unit, and a second substrate may include a first antenna, a first capacitive element, a second antenna, a second capacitive element, and an isolation circuit. The isolation circuit may isolate a radio frequency (RF) signal between the first path and the second path, and electrically connect the detection circuit to the ground unit through the first cable and the second cable.

    ELECTRONIC DEVICE INCLUDING CIRCUIT BOARD PLACED ADJACENT TO FRAME MADE OF CONDUCTIVE MATERIAL
    14.
    发明申请
    ELECTRONIC DEVICE INCLUDING CIRCUIT BOARD PLACED ADJACENT TO FRAME MADE OF CONDUCTIVE MATERIAL 有权

    公开(公告)号：US20220311845A1

    公开(公告)日：2022-09-29

    申请号：US17673216

    申请日：2022-02-16

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Sanguk KIM ,  Jongdoo KIM ,  Hyoseok NA ,  Daeseung PARK ,  Wanjae JU

    IPC: H04M1/02

    Abstract: An electronic device is provided. The electronic device includes a first mechanical element, a second mechanical element moving with respect to the first mechanical element, a frame including a first frame formed of a conductive material and coupled to the first mechanical element and a second frame formed of a conductive material and coupled to the second mechanical element, a segmentation part formed at the frame to segment each of the first frame and the second frame into a plurality of parts, and a first substrate member which includes a first part and a second part spaced apart from each other, and a first bending part for bendably connecting the first part and the second part and is disposed to move together with at least one of the first mechanical element and the second mechanical element, wherein a plurality of wires arranged at the first substrate member may be arranged not to pass through a first area which is an area of the first bending part of the first substrate member and is adjacent to the segmentation part.

    SEMICONDUCTOR PACKAGE
    15.
    发明申请
    SEMICONDUCTOR PACKAGE 有权

    公开(公告)号：US20220068730A1

    公开(公告)日：2022-03-03

    申请号：US17196538

    申请日：2021-03-09

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Joonsung KIM ,  Yonghwan KWON ,  Sanguk KIM

    IPC: H01L21/66 ,  H01L23/00 ,  H01L23/31

    Abstract: A semiconductor package is provided. The semiconductor package includes a chip pad of a semiconductor chip, the chip pad including a connection portion and a test portion in a first surface of the chip pad; a barrier layer covering the chip pad, the barrier layer defining a first opening and a second opening that is separate from the first opening, the first opening exposing the connection portion of the chip pad, and the second opening exposing the test portion of the chip pad; and a redistribution structure.

    WIDE-BAND ANTENNA AND ELECTRONIC DEVICE INCLUDING THE SAME
    16.
    发明申请
    WIDE-BAND ANTENNA AND ELECTRONIC DEVICE INCLUDING THE SAME 审中-公开

    公开(公告)号：US20200350660A1

    公开(公告)日：2020-11-05

    申请号：US16861800

    申请日：2020-04-29

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Taegyu KIM ,  Kyungbae KO ,  Un KIM ,  Sanguk KIM ,  Donghwan KIM ,  Yongsub LEE

    IPC: H01Q1/24 ,  H05K5/00 ,  H05K5/02 ,  H05K7/14 ,  H05K1/02 ,  H01Q1/50 ,  H01Q5/20 ,  H01Q9/04 ,  H01Q1/48

    Abstract: An electronic device includes a housing including a first plate disposed to be oriented in a first direction, a second plate disposed to be oriented in a second direction opposite the first direction, and a side member surrounding a space between the first plate and the second plate and coupled to or integrally formed with the second plate; a display visible through at least part of the first plate; a printed circuit board (PCB) disposed in the space and including a ground; a first conductive pattern disposed between the PCB and the second plate and including a first portion and a second portion spaced apart from the first portion; a second conductive connection member disposed between the second portion and the PCB; and a radio frequency (RF) communication circuit electrically connected with the first conductive connection member and configured to transmit or receive at least one signal having a predetermined frequency. The PCB may include a first conductive path electrically connecting the RF communication circuit and the first portion; a second conductive path electrically connecting a first position of the ground and the second portion; a third conductive path electrically connecting the first portion and a second position of the ground; and a fourth conductive path electrically connecting the first portion and a third position of the ground.

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