ELECTRONIC DEVICE INCLUDING DISPLAY MODULE HAVING MULTIPLE FPCBS

    公开(公告)号:US20230224396A1

    公开(公告)日:2023-07-13

    申请号:US18180508

    申请日:2023-03-08

    Inventor: Daeseung PARK

    Abstract: An electronic device is provided. The electronic device includes a frame, a first partition wall protruding from the frame in a first direction and dividing the frame into a first area and a second area, a second partition wall portion protruding from the frame in the first direction and dividing the frame into a second area and a third area, a first printed circuit board disposed in the first area, a battery disposed in the second area, a second printed circuit board disposed in the third area, and a display circuit including at least two flexible printed circuit boards. The flexible printed circuit boards include an overlapping area in which at least some areas overlap, the overlapping area being disposed in the second area, and, in the frame, an opening is formed in a portion facing the overlapping area.

    ELECTRONIC DEVICE INCLUDING CIRCUIT BOARD PLACED ADJACENT TO FRAME MADE OF CONDUCTIVE MATERIAL

    公开(公告)号:US20220311845A1

    公开(公告)日:2022-09-29

    申请号:US17673216

    申请日:2022-02-16

    Abstract: An electronic device is provided. The electronic device includes a first mechanical element, a second mechanical element moving with respect to the first mechanical element, a frame including a first frame formed of a conductive material and coupled to the first mechanical element and a second frame formed of a conductive material and coupled to the second mechanical element, a segmentation part formed at the frame to segment each of the first frame and the second frame into a plurality of parts, and a first substrate member which includes a first part and a second part spaced apart from each other, and a first bending part for bendably connecting the first part and the second part and is disposed to move together with at least one of the first mechanical element and the second mechanical element, wherein a plurality of wires arranged at the first substrate member may be arranged not to pass through a first area which is an area of the first bending part of the first substrate member and is adjacent to the segmentation part.

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