公开(公告)号：US20250054878A1

公开(公告)日：2025-02-13

申请号：US18632437

申请日：2024-04-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sujie Kang ,  Minsoo Han ,  Minwoo Rhee ,  Kyoungwhan Oh ,  Kyeongbin Lim

IPC: H01L23/00 ,  H01L21/66

Abstract: A warpage control method includes measuring displacement in a vertical direction perpendicular to a front surface of a wafer and dividing the front surface of the wafer into a first stress region with a negative displacement value and a second stress region with a positive displacement value, to thereby derive a warpage model, defining a portion of a region, overlapping the first stress region, on the front surface of the wafer as a first compensation region based on the warpage model and defining a region, other than the first compensation region, on the front surface of the wafer as a second compensation region based on the warpage model, to thereby derive a stress compensation film pattern model, and forming a mask pattern in a region on a back surface of the wafer.

公开(公告)号：US20240139972A1

公开(公告)日：2024-05-02

申请号：US18206635

申请日：2023-06-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Daeho Min ,  Minwoo Rhee ,  Juno Kim ,  Kazuya ONO ,  Kangsan Lee ,  Kyeongbin Lim

IPC: B25J15/06 ,  B25J11/00

CPC classification number: B25J15/0658 ,  B25J11/0095

Abstract: A non-contact type gripper may include a gripping plate, a plurality of blowing holes, a plurality of suction holes and a cavity. The blowing holes may be formed at the gripping plate to inject a gas to an object. The suction holes may be formed at the gripping plate to suck the gas. The cavity may be extended from at least one of the blowing holes to suppress a pressure drop of the gas. The gas flowing through the cavities extended from the corner suction hole and the blowing holes between the adjacent suction holes may receive a low flow resistance. Thus, a pressure drop of the gas injected from the blowing holes may be suppressed by the cavities to maintain a pressure of the gas, thereby preventing a deflection of the corner portion of the object such as the semiconductor chip by a strong suction force. As a result, the non-contact type gripper may grip the object in the non-contact manner to prevent a contamination of the object.

公开(公告)号：US20230178280A1

公开(公告)日：2023-06-08

申请号：US18075814

申请日：2022-12-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sumin KIM ,  Minwoo Rhee ,  Yongchul Shin ,  Ilyoung Han ,  Nungpyo Hong ,  Seungdon Lee ,  Kyeongbin Lim

IPC: H01F13/00 ,  H01L25/00 ,  H01L23/00

CPC classification number: H01F13/00 ,  H01L25/50 ,  H01L23/564

Abstract: A die alignment method includes vertically aligning a first die comprising first magnetic patterns and a second die comprising second magnetic patterns with each other using magnetic force between the first magnetic patterns and the second magnetic patterns. Each of the first magnetic patterns and the second magnetic patterns comprises a horizontally magnetically anisotropic material. The first magnetic patterns and the second magnetic patterns do not vertically overlap each other when the first die and the second die are vertically aligned with each other.

公开(公告)号：US20210143030A1

公开(公告)日：2021-05-13

申请号：US16911919

申请日：2020-06-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyeongbin Lim ,  Junhyung Kim ,  Siwoong Woo ,  Seungdae Seok

IPC: H01L21/67 ,  H01L21/683 ,  H01L33/00 ,  H01L21/68 ,  H01L33/48

Abstract: A wafer bonding apparatus includes a lower stage having a first surface and holding a first wafer on the first surface, an upper stage having a second surface and holding a second wafer on the second surface, an upper push rod passing through a center hole of the upper stage to press a middle region of the second wafer, and a plurality of first heating circuits provided at the second surface of the upper stage to heat the second wafer held by the upper stage. Each of the plurality of first heating circuits is independently controlled such that the second wafer is heated to have different temperature distributions along a circumferential direction about a center of the second wafer.

公开(公告)号：US20210104405A1

公开(公告)日：2021-04-08

申请号：US16842083

申请日：2020-04-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Junhyung Kim ,  Kyeongbin Lim ,  Minsoo Han ,  Minwoo Rhee ,  Inbae Chang

IPC: H01L21/18 ,  B32B37/00 ,  B23K20/10 ,  H01L21/20 ,  H01L21/67 ,  H01L21/683 ,  H01L21/687

Abstract: A substrate bonding apparatus for bonding a first substrate to a second substrate includes a first bonding chuck supporting the first substrate, a second bonding chuck disposed above the first bonding chuck and supporting the second substrate, a resonant frequency detector detecting a resonant frequency of a bonded structure with the first substrate and the second substrate which are at least partially bonded to each other, and a controller controlling a distance between the first bonding chuck and the second bonding chuck according to the detected resonant frequency of the bonded structure.