知搜-全球专利检索

  1. Login
  2. Sign Up

Search Results

29 records (took 0.019 seconds)

    Unmanned aerial vehicle and method for operating same, and automated guided vehicle for controlling movement of unmanned aerial vehicle
    11.
    发明授权
    Unmanned aerial vehicle and method for operating same, and automated guided vehicle for controlling movement of unmanned aerial vehicle 有权

    公开(公告)号：US11720105B2

    公开(公告)日：2023-08-08

    申请号：US16760168

    申请日：2018-12-17

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Junho Park ,  Sunggu Kwon ,  Jihoon Kim ,  Kyungshik Roh ,  Minsu Lee

    IPC: G05D1/02 ,  B64C39/02 ,  B64D47/08 ,  B64U101/30

    CPC classification number: G05D1/0202 ,  B64C39/02 ,  B64D47/08 ,  B64U2101/30

    Abstract: Various embodiments of the present invention relate to an unmanned aerial vehicle (UAV) and method for operating the same, and an automated guided vehicle (AGV) for controlling movements of the unmanned aerial vehicle. The unmanned aerial vehicle according to various embodiments of the present invention may comprise: a wireless communication circuit; at least one sensor; a processor operatively connected to the wireless communication circuit and the at least one sensor; and a memory operatively connected to the processor, wherein the memory stores instructions that, when executed, cause the processor to: receive a movement command for a movement with respect to the current location of the unmanned aerial vehicle, from an automated guided vehicle located within a predetermined distance from the unmanned aerial vehicle, by using the wireless communication circuit; acquire location-independent sensing information by using the at least one sensor, while the unmanned aerial vehicle moves according to the movement command; and transmit the location-independent sensing information to the automated guided vehicle so as to allow the automated guided vehicle to determine the location of the unmanned aerial vehicle by using the location-independent sensing information.

    Electronic device including multi-band antenna
    16.
    发明授权
    Electronic device including multi-band antenna 有权

    公开(公告)号：US11955731B2

    公开(公告)日：2024-04-09

    申请号：US17364103

    申请日：2021-06-30

    Applicant: Samsung Electronics Co., Ltd. ,  Postech Research And Business Development Foundation

    Inventor： Yeonwoo Kim ,  Wonbin Hong ,  Junho Park ,  Jaehyun Choi ,  Sehyun Park ,  Sumin Yun

    IPC: H01Q9/04 ,  H01Q5/10 ,  H04B1/38

    CPC classification number: H01Q9/0407 ,  H01Q5/10 ,  H04B1/38

    Abstract: An electronic device includes a housing including a first plate and a second plate; and a first antenna structure. The first antenna structure includes a board disposed between the first plate and the second plate. The board includes a first surface facing the first plate, a second surface facing the second plate, a plurality of insulating layers stacked on top of each other between the first surface and the second surface, a first conductive layer disposed on the first surface, a second conductive layer disposed on the second surface, a plurality of strips disposed between the plurality of insulating layers, and a plurality of vias connecting at least one or more of the first conductive layer, the second conductive layer, or the plurality of strips to each other and disposed in the plurality of insulating layers. The electronic device further includes a first conductive structure, a second conductive structure, a third conductive structure, and a fourth conductive structure formed as part of the plurality of strips and the plurality of vias; and a wireless communication circuit electrically connected to at least one of the vias and configured to transmit or receive at least one signal having a frequency of 3 GHz to 100 GHz.

    Electronic device comprising antenna array
    17.
    发明授权
    Electronic device comprising antenna array 有权

    公开(公告)号：US11417954B2

    公开(公告)日：2022-08-16

    申请号：US17262087

    申请日：2019-07-31

    Applicant: Samsung Electronics Co., Ltd. ,  POSTECH ACADEMY-INDUSTRY FOUNDATION

    Inventor： Yeonwoo Kim ,  Wonbin Hong ,  Sehyun Park ,  Junho Park ,  Sumin Yun

    IPC: H01Q3/36 ,  H04W16/28 ,  H04B7/06

    Abstract: An electronic device according to an embodiment of the present invention may include a housing and an antenna module disposed on one surface of the housing, wherein the antenna module may include a printed circuit board including a first layer facing the one surface of the housing, a second layer facing the first layer, and at least one ground layer disposed between the first layer and the second layer, a first antenna array disposed on the first layer, a second antenna array disposed on the second layer and at least partially overlapping the first antenna array when viewed from the one surface of the housing, and a communication circuit (radio frequency integrated circuit (RFIC)) electrically connected to the first antenna array and the second antenna array and feeding the first antenna array and the second antenna array, wherein the communication circuit may be configured to receive a first signal from an external device via at least one of the first antenna array or the second antenna array, change a phase of at least a portion of the first antenna array and the second antenna array based on the first signal, and transmit/receive a second signal in a direction of a beam formed by the changed phase. Other various embodiments could be derived from the description.

    SEMICONDUCTOR DEVICE
    20.
    发明申请
    SEMICONDUCTOR DEVICE 有权

    公开(公告)号：US20240431119A1

    公开(公告)日：2024-12-26

    申请号：US18405141

    申请日：2024-01-05

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Kilho Lee ,  Yongjae Kim ,  Junho Park

    IPC: H10B61/00

    Abstract: A semiconductor device may include a lower dielectric layer on a substrate, data storage patterns on the lower dielectric layer and spaced apart from each other in first and second directions, a cell dielectric layer on the lower dielectric layer and on the data storage patterns, voids in the cell dielectric layer and between ones of the data storage patterns, upper conductive contacts respectively on the data storage patterns and spaced apart from each other in the first and second directions, and upper conductive lines on the upper conductive contacts and spaced apart from each other in the second direction and extending in the first direction. Each of the upper conductive lines may be electrically connected to respective ones of the upper conductive contacts. The respective ones of the upper conductive contacts may be spaced apart from each other in the first direction.

Patent Agency Ranking