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11.发明授权公开(公告)号：US11277949B2
公开(公告)日：2022-03-15
申请号：US16921801
申请日：2020-07-06
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Hyelim Yun , Bongkyu Min , Dohoon Kim , Taewoo Kim , Jinyong Park , Jungje Bang , Hyeongju Lee
Abstract: Disclosed is an electronic device. The electronic device includes a printed circuit board on which one or more circuit components are disposed, and an interposer surrounding at least some circuit components of the one or more circuit components and including an inner surface adjacent to the at least some circuit components and an outer surface facing away from the inner surface and having a plurality of through holes. The interposer is disposed on the printed circuit board such that one or more through holes of the plurality of through holes are electrically connected with a ground of the printed circuit board. The outer surface of the interposer includes a first conductive region electrically connected with at least one first through hole of the one or more through holes, and a non-conductive region, the inner surface of the interposer includes a second conductive region electrically connected with at least one second through hole of the one or more through holes, and the second conductive region includes a region facing the non-conductive region.
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公开(公告)号：US09924616B2
公开(公告)日：2018-03-20
申请号：US14640520
申请日：2015-03-06
Applicant: Samsung Electronics Co., Ltd.
Inventor： Kyunghoon Song , Jungje Bang , Kwangsub Lee , Saebom Lee , Seyoung Jang , Younoh Chi
IPC: H05K9/00 , H05K7/20 , H01L23/42 , H01L23/552
CPC classification number: H05K7/20445 , H01L23/42 , H01L23/552 , H01L2224/16225 , H01L2224/73253 , H01L2924/12044 , H05K9/0032 , Y10T29/4913 , Y10T29/49144 , H01L2924/00
Abstract: A shield can for electromagnetic shielding is provided. The shield can includes a shield cover having a bump protruding laterally therefrom, and a shield frame having a connecting part for selectively fixing the bump at a first height or a second height such that the shield frame is fastened to the shield cover. An electronic device includes a substrate, an internal device mounted on the substrate, and the shield can. The shield cover is located over the internal device, and the shield frame is formed vertically on the substrate to surround the internal device.
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公开(公告)号：US09652049B2
公开(公告)日：2017-05-16
申请号：US14640313
申请日：2015-03-06
Applicant: Samsung Electronics Co., Ltd.
Inventor： Kyunghoon Song , Jungje Bang , Kicheol Bae , Kwangsub Lee , Seyoung Jang
CPC classification number: G06F3/0202 , H01H13/48 , H01H2215/004 , H01H2215/036 , H01H2221/05 , H01R13/703 , H01R24/62 , H05K1/184 , H05K2201/09163 , H05K2201/10053 , H05K2201/10189 , H05K2201/10446 , H05K2201/10537
Abstract: An input device may include: (a) a connector that recognizes a connection of an external device; (b) a switch located at an upper end portion of the connector and that connects an electrical signal when a physical input of a threshold pressure or more is pressed; (c) a substrate connected to a connection terminal of the switch and mounted at a surface in which the switch is not located; and/or (d) a key base that presses the switch.
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公开(公告)号：US12144115B2
公开(公告)日：2024-11-12
申请号：US18084994
申请日：2022-12-20
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Youngsun Lee , Dohyeon Kim , Byeongkeol Kim , Jinsu Kim , Seokjoon Park , Jungje Bang , Hoyeon Seo , Jongbum Lee , Jongmin Jeon
Abstract: An electronic device including a thermosetting bonding sheet may include: a base substrate including a base substrate body and a plurality of base pads disposed on the base substrate body, a connection substrate including a connection substrate body facing the base substrate body, a plurality of connection pads disposed on the connection substrate body and including a pad hole, and a plurality of connection lines disposed on the connection substrate body and connected to the plurality of connection pads, a solder, at least a portion of which is inserted into the pad hole, disposed on the base pad and configured to electrically connect the base pad to the connection pad, and a thermosetting bonding sheet provided between the base substrate body and the connection substrate body, bonded to the base substrate body and the connection substrate body, and enclosing the solder.
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Patent Agency Ranking
15.发明授权公开(公告)号：US11825639B2
公开(公告)日：2023-11-21
申请号：US17694529
申请日：2022-03-14
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Hyelim Yun , Bongkyu Min , Dohoon Kim , Taewoo Kim , Jinyong Park , Jungje Bang , Hyeongju Lee
CPC classification number: H05K9/0032 , H05K1/115 , H05K1/144 , H05K1/181 , H05K7/1427 , H05K2201/10371 , H05K2201/10378
Abstract: An example electronic device includes a printed circuit board on which one or more circuit components are disposed, and an interposer surrounding at least some circuit components of the one or more circuit components and including an inner surface adjacent to the at least some circuit components and an outer surface facing away from the inner surface and having a plurality of through holes. The interposer is disposed on the printed circuit board such that one or more through holes of the plurality of through holes are electrically connected with a ground of the printed circuit board. The outer surface of the interposer includes a first conductive region electrically connected with at least one first through hole of the one or more through holes, and a non-conductive region, the inner surface of the interposer includes a second conductive region electrically connected with at least one second through hole of the one or more through holes, and the second conductive region includes a region facing the non-conductive region.
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公开(公告)号：US11516950B2
公开(公告)日：2022-11-29
申请号：US16766363
申请日：2018-11-19
Applicant: Samsung Electronics Co., Ltd.
Inventor： Gyeongmin Jin , Min Park , Jaedeok Lim , Jungje Bang , Jaeheung Ye , Yongwon Lee , Seyoung Jang
Abstract: The disclosure provides an electronic device having an electromagnetic shielding structure for preventing an antenna performance degradation. The disclosed electronic device may include: an antenna disposed in some areas of the electronic device; a printed circuit board; and a display module including a display panel, one or more signal lines coupled to the display panel, and a flexible substrate on which the one or more signal lines are disposed. The flexible substrate may include: a conductive layer coupled to the printed circuit board in a curved state and configured to shield an electromagnetic wave radiated from the one or more signal lines to the antenna; and a stress neutralization layer of which a material can be deformed over time in response to a shape of the flexible substrate coupled in a curved state. The stress neutralization layer may be disposed between the flexible substrate and the conductive layer.
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公开(公告)号：US11202364B2
公开(公告)日：2021-12-14
申请号：US17258631
申请日：2019-06-05
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Eunseok Hong , Jungje Bang
Abstract: An electronic device according to various embodiments comprises: a circuit element; a printed circuit board comprising a first connection pad connected to the ground of the electronic device, a second connection pad, and a third connection pad arranged between the first connection pad and the second connection pad and connected to a signal terminal of the circuit element; and a flexible printed circuit board (FPCB) comprising a coupling part connected to the printed circuit board, and a connection part extending from the coupling part, wherein the FPCB comprises first ground wiring connected to the first connection pad and extending from the coupling part to the connection part in an assigned direction, second ground wiring connected to the second connection pad and extending from the coupling part to the connection part in the assigned direction, signal wiring connected to the third connection pad and extending from the coupling part to the connection part in the assigned direction, while being arranged between the first ground wiring and the second ground wiring, and third ground wiring arranged in an opposite direction to the assigned direction so as to be connected, in the coupling part, to the first ground wiring and the second ground wiring and surround the signal wiring. Other various embodiments are possible.
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18.发明授权公开(公告)号：US10709043B2
公开(公告)日：2020-07-07
申请号：US16575679
申请日：2019-09-19
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Hyelim Yun , Bongkyu Min , Dohoon Kim , Taewoo Kim , Jinyong Park , Jungje Bang , Hyeongju Lee
Abstract: Disclosed is an electronic device. The electronic device includes a printed circuit board on which one or more circuit components are disposed, and an interposer surrounding at least some circuit components of the one or more circuit components and including an inner surface adjacent to the at least some circuit components and an outer surface facing away from the inner surface and having a plurality of through holes. The interposer is disposed on the printed circuit board such that one or more through holes of the plurality of through holes are electrically connected with a ground of the printed circuit board. The outer surface of the interposer includes a first conductive region electrically connected with at least one first through hole of the one or more through holes, and a non-conductive region, the inner surface of the interposer includes a second conductive region electrically connected with at least one second through hole of the one or more through holes, and the second conductive region includes a region facing the non-conductive region.
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19.发明申请公开(公告)号：US20200053919A1
公开(公告)日：2020-02-13
申请号：US16535528
申请日：2019-08-08
Applicant: Samsung Electronics Co., Ltd
Inventor： Haejin LEE , Min Park , Jungje Bang , Kyungha Koo , Yunjeong Park
Abstract: Provided is an electronic device including a printed circuit board (PCB) in which at least one electrical element is disposed; a shield can including a concave portion and an opening formed in part of the concave portion and configured to receive the at least one electrical element at an inside of the concave portion disposed on the PCB; a conductive plate configured to cover the opening at an outside of the concave portion; a support member disposed between the conductive plate and the outside of the concave portion; and a shielding member disposed between the support member and the outside of the concave portion and connected to at least part of the conductive plate extended in a direction of the opening from the support member and configured to cover the opening.
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