公开(公告)号：US20150024690A1

公开(公告)日：2015-01-22

申请号：US14507217

申请日：2014-10-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sang-Kyu PARK ,  Seung-Yup LEE ,  Jung-Ho PARK ,  Soo-Ho SONG

IPC: H04M1/60 ,  H04M1/725 ,  H04W4/00

CPC classification number: H04M1/7253 ,  H04M1/6016 ,  H04M1/6058 ,  H04M1/6066 ,  H04M1/725 ,  H04W4/80

Abstract: An electronic device and a method implemented in the electronic device are provided. The method includes detecting, by a device detector, whether a wired external device coupled to the electronic device and including a wired external speaker further includes a wired external microphone; providing a signal, by the device detector, indicating whether the wired external device includes the wired external microphone; detecting, by a controller, a call establishment; and operating, by the controller, a built-in microphone to receive a voice sound if the signal from the device detector indicates that the wired external device does not include the wired external microphone and providing a voice signal received from a second electronic device to the wired external device so that the wired external speaker outputs the voice signal, wherein the built-in microphone and a built-in speaker of the electronic device are coupled to the controller via a COder-DECoder (CODEC).

Abstract translation: 提供了一种在电子设备中实现的电子设备和方法。 该方法包括通过设备检测器检测耦合到电子设备并且包括有线外部扬声器的有线外部设备是否还包括有线外部麦克风; 通过设备检测器提供指示有线外部设备是否包括有线外部麦克风的信号; 由控制器检测呼叫建立; 以及如果来自所述设备检测器的信号指示所述有线外部设备不包括所述有线外部麦克风并且将从第二电子设备接收的语音信号提供给所述第二电子设备的语音信号，则由所述控制器操作内置麦克风以接收语音的声音 有线外部设备，使得有线外部扬声器输出语音信号，其中内置麦克风和电子设备的内置扬声器经由编解码器（CODEC）耦合到控制器。

公开(公告)号：US20220216068A1

公开(公告)日：2022-07-07

申请号：US17656695

申请日：2022-03-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jung-Ho PARK ,  Jin-Woo PARK ,  Seok Hyun LEE ,  Jae Gwon JANG ,  Gwang Jae JEON

IPC: H01L21/48 ,  H01L21/52 ,  H01L25/00 ,  H01L21/56 ,  H01L23/498

Abstract: A method for fabricating a semiconductor package, the method including: forming a. release layer on a first carrier substrate, wherein the release layer includes a first portion and a second portion, wherein the first portion has a first thickness, and the second portion has a second thickness thicker than the first thickness; forming a barrier layer on the release layer; forming a redistribution layer on the barrier layer, wherein the redistribution layer includes wirings and an insulating layer; mounting a semiconductor chip on the redistribution layer; forming a molding layer on the redistribution layer to at least partially surround the semiconductor chip; attaching a second carrier substrate onto the molding layer; removing the first carrier substrate and the release layer; removing the barrier layer; and attaching a solder ball onto the redistribution layer exposed by removal of the barrier layer and the second portion of the release layer.

公开(公告)号：US20160322296A1

公开(公告)日：2016-11-03

申请号：US15210108

申请日：2016-07-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： YoungHoon RO ,  Seung Hwan KIM ,  Jung-Ho PARK

IPC: H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31

CPC classification number: H01L23/49855 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49894 ,  H01L2224/131 ,  H01L2224/16238 ,  H01L2224/45144 ,  H01L2224/48228 ,  H01L2924/014 ,  H01L2924/00

Abstract: Package substrates, semiconductor packages including the package substrates, and methods for fabricating the semiconductor packages are provided. A package substrate may include a core including a first surface on which a semiconductor chip is disposed and a second surface opposite the first surface. The package substrate may also include a metal pad on the second surface of the core. The metal pad may include a saline water corrosion resistant surface.

Abstract translation: 提供包装衬底，包括封装衬底的半导体封装以及用于制造半导体封装的方法。 封装基板可以包括芯，芯包括设置有半导体芯片的第一表面和与第一表面相对的第二表面。 封装衬底还可以包括在芯的第二表面上的金属焊盘。 金属垫可以包括盐水耐腐蚀表面。

公开(公告)号：US20160276381A1

公开(公告)日：2016-09-22

申请号：US15169975

申请日：2016-06-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jung-Ho PARK

IPC: H01L27/146

CPC classification number: H01L27/1463 ,  H01L27/1462 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14654 ,  H01L27/14689 ,  H01L2224/11

Abstract: Image sensor and method of manufacturing the same are provided. The image sensor includes a semiconductor substrate including a pixel area, a voltage connection area, and a pad area, a plurality of photoelectric conversion devices in the pixel area, an anti-reflective layer on a back side of the semiconductor substrate and on the plurality of photoelectric conversion devices, a device isolation structure between the plurality of photoelectric conversion devices, at least one voltage connection structure in the voltage connection area, and electrically connected to the device isolation structure, at least one voltage applying device electrically connected to the at least one voltage connection structure, an internal circuit including at least one conductive inner wire and at least one conductive inner via in an insulating layer, and a through via structure in the pad area.

公开(公告)号：US20160056531A1

公开(公告)日：2016-02-25

申请号：US14831355

申请日：2015-08-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyung-Jong LEE ,  Se-Woong KIM ,  Jung-Ho PARK ,  Kyung-Jae LEE ,  Soo-Young JANG ,  Austin KIM ,  Seung-Hwan KIM ,  Joon-Ho BYUN

IPC: H01Q1/24 ,  H01Q21/30 ,  H01Q7/00

CPC classification number: H01Q1/243 ,  H01Q7/00 ,  H01Q9/42 ,  H01Q19/10 ,  H01Q21/30

Abstract: An antenna apparatus and an electronic device having the same is provided. The electronic device includes an antenna radiator formed in a loop shape having at least one opening end part opened by a slit, at least a portion of the at least one opening end part is fed, at least one electronic component of metal material electrically connected with the antenna radiator, and at least one metal member arranged around the antenna radiator, where the at least one opening end part is formed in a reverse direction from the direction of the metal member.

Abstract translation: 提供了一种天线装置和具有该天线装置的电子装置。 电子装置包括形成为环形的天线辐射体，其具有至少一个由狭缝开口的开口端部分，所述至少一个开口端部分的至少一部分被馈送，至少一个金属材料电子部件与 所述天线辐射器以及设置在所述天线辐射体周围的至少一个金属部件，其中所述至少一个开口端部沿与所述金属部件的方向相反的方向形成。

公开(公告)号：US20150334520A1

公开(公告)日：2015-11-19

申请号：US14812577

申请日：2015-07-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sang-Kyu PARK ,  Seung-Yup LEE ,  Jung-Ho PARK ,  Soo-Ho SONG

IPC: H04W4/00 ,  H04M1/60 ,  H04M1/725

CPC classification number: H04M1/7253 ,  H04M1/6016 ,  H04M1/6058 ,  H04M1/6066 ,  H04M1/725 ,  H04W4/80

Abstract: An electronic device and method are provided. The electronic device includes a built-in microphone; a Bluetooth communication module configured to wirelessly connect to a first wireless external device including a speaker and a second wireless external device including a speaker; and a controller configured to detect a call establishment, if the call establishment is detected while one of the first and second wireless external devices is connected to the electronic device, operate the built-in microphone to receive sound based on information regarding the connected one of the first and second wireless external devices, and if the call establishment is detected while both of the first and second wireless external devices are connected to the electronic device, select one of the first and second wireless external devices and provide an incoming call audio signal received via the call establishment to the selected one of the first and second wireless external devices.

Abstract translation: 提供了一种电子设备和方法。 电子设备包括内置麦克风; 蓝牙通信模块，被配置为无线地连接到包括扬声器的第一无线外部设备和包括扬声器的第二无线外部设备; 以及控制器，被配置为检测呼叫建立，如果在所述第一和第二无线外部设备中的一个连接到所述电子设备的同时检测到所述呼叫建立，则基于关于所连接的所述第二和第二无线外部设备的信息来操作所述内置麦克风以接收声音 第一和第二无线外部设备，并且如果在第一和第二无线外部设备都连接到电子设备的同时检测到呼叫建立，则选择第一和第二无线外部设备中的一个，并提供接收到的呼入音频信号 经由所述呼叫建立到所述第一和第二无线外部设备中的所选择的一个。

公开(公告)号：US20140323114A1

公开(公告)日：2014-10-30

申请号：US14325848

申请日：2014-07-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sang-Kyu PARK ,  Seung-Yup LEE ,  Jung-Ho PARK ,  Soo-Ho SONG

IPC: H04M1/60

CPC classification number: H04M1/7253 ,  H04M1/6016 ,  H04M1/6058 ,  H04M1/6066 ,  H04M1/725 ,  H04W4/80

Abstract: An apparatus and method for controlling a built-in microphone of a portable terminal is provided. The method includes checking whether a connection device connected to the portable electronic device includes an external microphone; operating the built-in microphone of the portable electronic device to receive a first signal, upon connecting a call, when the connection device does not include the external microphone; and selecting, upon connecting the call while a plurality of connection devices are connected to the portable electronic device, one connection device from among the plurality of connection devices to output a second signal.

Abstract translation: 提供了一种用于控制便携式终端的内置麦克风的装置和方法。 该方法包括检查连接到便携式电子设备的连接装置是否包括外部麦克风; 当所述连接装置不包括所述外部麦克风时，操作所述便携式电子设备的内置麦克风以在连接呼叫时接收第一信号; 以及在多个连接装置连接到所述便携式电子装置的同时，在连接所述呼叫时选择来自所述多个连接装置中的一个连接装置，以输出第二信号。