METHODS OF FABRICATING A SEMICONDUCTOR DEVICE INCLUDING DUAL TRANSISTORS
    11.
    发明申请
    METHODS OF FABRICATING A SEMICONDUCTOR DEVICE INCLUDING DUAL TRANSISTORS 审中-公开
    制造包括双晶体管的半导体器件的方法

    公开(公告)号:US20130171807A1

    公开(公告)日:2013-07-04

    申请号:US13678002

    申请日:2012-11-15

    CPC classification number: H01L21/02381 H01L21/26513 H01L21/823842

    Abstract: Provided are a semiconductor device having dual transistors, and methods of fabricating a semiconductor device, including sequentially forming an insulating layer and a polysilicon layer on a substrate having a first region and a second region, forming a first mask to cover the polysilicon layer on the second region, injecting at least one n-type impurity into the polysilicon layer on the first region to form an N-region, injecting nitrogen into the N-region, forming a second mask to cover the N-region, and injecting at least one p-type impurity into the polysilicon layer on the second region to form a P-region.

    Abstract translation: 提供了具有双晶体管的半导体器件和制造半导体器件的方法,包括在具有第一区域和第二区域的衬底上顺序地形成绝缘层和多晶硅层,形成第一掩模以覆盖所述多晶硅层 将至少一个n型杂质注入到所述第一区域上的所述多晶硅层中以形成N区,向所述N区注入氮,形成覆盖所述N区的第二掩模,以及注入至少一个 p型杂质进入第二区域的多晶硅层,形成P区。

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