公开(公告)号：US11515348B2

公开(公告)日：2022-11-29

申请号：US16900076

申请日：2020-06-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Minho Jang ,  Jeongsoon Kang ,  Taehyoung Kim ,  Masaru Ishii ,  In Sung Joe

IPC: H01L27/146

Abstract: An image sensor includes a substrate having a first surface, a charge storage portion disposed in the substrate, a light-blocking pattern disposed on the first surface overlapping the charge storage portion, and a low-refractive index pattern on the light-blocking pattern.

公开(公告)号：US09767869B2

公开(公告)日：2017-09-19

申请号：US14791356

申请日：2015-07-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyunil Byun ,  In Sung Joe ,  Dong Jae Shin

IPC: H04B10/00 ,  G11C7/10

CPC classification number: G11C7/1081 ,  G11C7/1054

Abstract: A memory system in accordance with an embodiment of the inventive concept includes a memory controller comprising a controller optical transmission unit photoelectrically-converting a data signal to output a first optical modulation signal and a second optical modulation signal, a first memory device which is optically connected with the memory controller to receive the first optical modulation signal, and a second memory device which is optically connected with the memory controller to receive the second optical modulation signal. The first optical modulation signal and the second optical modulation signal are complementary to each other.

公开(公告)号：US12266674B2

公开(公告)日：2025-04-01

申请号：US17315321

申请日：2021-05-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Minho Jang ,  Kyoungwon Na ,  Seungkuk Kang ,  Hyunchul Kim ,  Hyun Young Yeo ,  In Sung Joe

IPC: H01L27/146

Abstract: An image sensor includes a first chip that includes a pixel region and a pad region, and a second chip that is in contact with one surface of the first chip and includes circuits that drive the first chip. The first chip includes a first substrate, an interlayer insulating layer disposed between the first substrate and the second chip, first interconnection lines disposed in the interlayer insulating layer, a conductive pad disposed in the pad region between the second chip and the first interconnection lines, and a recess region formed in the pad region that penetrates the first substrate and the interlayer insulating layer and exposes the conductive pad.

公开(公告)号：US20240234462A9

公开(公告)日：2024-07-11

申请号：US18204974

申请日：2023-06-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Minkwan Kim ,  Inyong Park ,  Jinsun Pyo ,  Beomsuk Lee ,  Sungeun Lee ,  In Sung Joe

IPC: H01L27/146 ,  G02B3/00

CPC classification number: H01L27/14627 ,  G02B3/0043 ,  H01L27/14621 ,  H01L27/1463 ,  H01L27/14634 ,  H01L27/14645 ,  H01L27/14685 ,  G02B1/14

Abstract: Image sensors and fabrication methods thereof. For example, the image sensor may include a first substrate having a first surface and a second surface that are opposite to each other, a plurality of pixels provided in the first substrate and arranged in pixel groups, each pixel group including four pixels arranged in two columns and two rows, a pixel separation structure in the first substrate and including a pixel group separation part that separates each pixel group from adjacent pixel groups and a pixel separation part that separates the pixels in each pixel group from each other, and a plurality of microlenses on the first surface and respectively overlapping the plurality of pixel groups. Each of the microlenses includes a central part that has a first curvature and an edge part that has a second curvature. The first curvature is less than the second curvature.

公开(公告)号：US20140270758A1

公开(公告)日：2014-09-18

申请号：US14211040

申请日：2014-03-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Amir Hossein Nejadmalayeri ,  Yoon Dong Park ,  Hyun Il Byun ,  In Sung Joe

IPC: H04L5/14 ,  H04J14/06

CPC classification number: H04L5/14 ,  H04J14/06

Abstract: An optical communication apparatus and printed circuit board (PCB), which include an optical interface for realizing concurrent read and write operations, and a data processing system including a memory module and the PCB are provided. The optical communication apparatus includes an optical interface unit configured to output optical signal of first data and receive optical signal of second data simultaneously, and an optical bus configured to transmit the optical signals between the first optical interface unit and a second optical interface unit, the second optical interface unit being configured to receive the optical signal of the first data and output the optical signal of the second data simultaneously. The optical signal of the first data and the optical signal of the second data have polarizations, respectively, orthogonal to each other.

Abstract translation: 提供了一种光通信装置和印刷电路板（PCB），其包括用于实现并行读写操作的光接口，以及包括存储器模块和PCB的数据处理系统。 光通信装置包括：光接口单元，被配置为同时输出第一数据的光信号并接收第二数据的光信号;以及光总线，被配置为在第一光接口单元和第二光接口单元之间传输光信号， 第二光接口单元被配置为接收第一数据的光信号并同时输出第二数据的光信号。 第一数据的光信号和第二数据的光信号分别具有彼此正交的极化。