Substrate processing apparatus and substrate processing method

    公开(公告)号:US11923209B2

    公开(公告)日:2024-03-05

    申请号:US17678233

    申请日:2022-02-23

    CPC classification number: H01L21/67051 H01L21/6715 H01L21/68764

    Abstract: A substrate processing apparatus includes a substrate support configured to support and rotate a substrate, at least one first lower cleaning nozzle configured to spray a first cleaning liquid on a lower surface of the substrate, at least one second lower cleaning nozzle configured to spray a second cleaning liquid on the lower surface of the substrate, a bowl assembly disposed around the substrate support, the bowl assembly including a cup body providing an annular shaped accommodating space and inner and outer collection portions sequentially arranged in a radial direction in a lower portion of the cup body, an annular shaped discharge guide plate disposed in the receiving space of the bowl assembly under the substrate and extending outwardly from a circumference of the substrate, and a discharge separation plate provided within the receiving space of the bowl assembly to be movable upward and downward.

    Server and method for defending malicious code using same

    公开(公告)号:US11038901B2

    公开(公告)日:2021-06-15

    申请号:US16212083

    申请日:2018-12-06

    Abstract: A server is provided. The server includes a communication interface configured to communicate with an electronic apparatus connected to an Internet of things (IoT) device, a storage configured to store a scenario about an attack received by the IoT device from an external apparatus by stages and information relating to a malicious code corresponding to the scenario, and a processor configured to, based on the IoT device being attacked by the external apparatus over at least one step through the electronic apparatus, receive, from the electronic apparatus, an alert for an attack received by stages, and to identify information relating to a malicious code corresponding to at least one alert received from the electronic apparatus based on the pre-stored scenario.

    Methods of manufacturing semiconductor packages

    公开(公告)号:US10199366B2

    公开(公告)日:2019-02-05

    申请号:US15627536

    申请日:2017-06-20

    Abstract: A method of manufacturing a semiconductor package, the method including forming a hole that penetrates an interconnect substrate; providing a first carrier substrate below the interconnect substrate; providing a semiconductor chip in the hole; forming a molding layer by coating a molding composition on the semiconductor chip and the interconnect substrate; adhering a second carrier substrate onto the molding layer with an adhesive layer; removing the first carrier substrate to expose a bottom surface of the semiconductor chip and a bottom surface of the interconnect substrate; forming a redistribution substrate below the semiconductor chip and the interconnect substrate; detaching the second carrier substrate from the adhesive layer; and removing the adhesive layer.

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