Electronic device and method for adaptively changing information regarding band combination

    公开(公告)号:US11019541B2

    公开(公告)日:2021-05-25

    申请号:US16505934

    申请日:2019-07-09

    Abstract: An electronic device is provided. The electronic device includes wireless communication circuitry, a processor operatively coupled to the wireless communication circuitry, and a memory operatively coupled to the processor. The memory stores instructions configure, based on execution, the processor to control the electronic device to: receive, from a base station, a first message related with user equipment (UE) capability enquiry, the first message including information indicating the number of carrier aggregation (CA) combinations related with a network associated with the base station using the wireless communication circuitry, identify UE capability information, based at least in part on the number of CA combinations related with the network and the number of CA combinations supportable in the electronic device, and transmit a second message including the identified UE capability information to the network using the wireless communication circuitry.

    Method of fabricating semiconductor device

    公开(公告)号:US10910231B2

    公开(公告)日:2021-02-02

    申请号:US16453481

    申请日:2019-06-26

    Abstract: A method of fabricating a semiconductor device includes forming a first etching pattern structure and a second etching pattern structure on a substrate. The first cell etching pattern structure has a top surface at a level that is different from that of a top surface of the second etching pattern structure. The method further includes forming a first spacer layer on the first etching pattern structure and the second etching pattern structure. The first spacer layer covers top and lateral surfaces of the first etching pattern structure and top and lateral surfaces of the second etching pattern structure. The method further includes performing a first etching process on the first spacer layer to form a first spacer and a second spacer. The first spacer layer is fully exposed during the first etching process of the first spacer layer.

    Electronic device for controlling cellular network function in wireless network environment and method thereof

    公开(公告)号:US11570831B2

    公开(公告)日:2023-01-31

    申请号:US16934396

    申请日:2020-07-21

    Abstract: An electronic device is provided. The electronic device includes: wireless communication circuitry, at least one processor operatively connected with the wireless communication circuitry, and a memory operatively connected with the at least one processor. The memory stores instructions which, when executed, cause the at least one processor to control the electronic device to: identify a state of the electronic device, receive a system information block (SIB) from a first base station supporting a first cellular network via the wireless communication circuitry, identify whether a network to which the electronic device belongs supports dual connectivity (DC) between the first cellular network and a second cellular network based on information included in the SIB, enable a second cellular network function of the wireless communication circuitry based on the network supporting the DC, and transmit information indicating that the second cellular network function of the electronic device is enabled to the network via the wireless communication circuitry.

    Semiconductor device including device isolation layer with multiple patterns

    公开(公告)号:US12237208B2

    公开(公告)日:2025-02-25

    申请号:US17668452

    申请日:2022-02-10

    Abstract: A semiconductor device includes a substrate having one or more inner surfaces defining trenches that define an active pattern of the substrate, the trenches including a first trench and a second trench which have different widths, a device isolation layer on the substrate such that the device isolation layer at least partially fills the trenches, and a word line intersecting the active pattern. The device isolation layer includes a first isolation pattern covering a portion of the second trench, a second isolation pattern on the first isolation pattern and covering a remaining portion of the second trench, and a filling pattern filling the first trench under the word line. A top surface of the second isolation pattern is located at a higher level than a top surface of the filling pattern.

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