SEMICONDUCTOR PACKAGE
    11.
    发明申请

    公开(公告)号:US20240429214A1

    公开(公告)日:2024-12-26

    申请号:US18820569

    申请日:2024-08-30

    Abstract: Disclosed is a semiconductor package comprising an interposer substrate having first and second surfaces opposite each other and including a wiring layer adjacent to the first surface, a semiconductor chip on the first surface of the interposer substrate, a passivation layer on the first surface of the interposer substrate and covering the semiconductor chip, and redistribution patterns in the passivation layer and connected to the semiconductor chip. The semiconductor chip has third and fourth surfaces opposite to each other. The third surface of the semiconductor chip faces the first surface of the interposer substrate. The redistribution patterns are connected to the fourth surface of the semiconductor chip. The semiconductor chip includes chip pads adjacent to the third surface and chip through electrodes connected to the chip pads. Each of the chip pads is directly bonded to a corresponding one of wiring patterns in the wiring layer.

    METHOD AND APPARATUS FOR GENERATING DEPTH IMAGE

    公开(公告)号:US20210366139A1

    公开(公告)日:2021-11-25

    申请号:US17225574

    申请日:2021-04-08

    Abstract: A method and apparatus for generating a depth image are provided. The apparatus receives an input image, extracts a feature corresponding to the input image, generates features for each depth resolution by decoding the feature using decoders corresponding to different depth resolutions, estimates probability distributions for each depth resolution by progressively refining the features for each depth resolution, and generates a target depth image corresponding to the input image based on a final estimated probability distribution from among the probability distributions for each depth resolution.

    METHOD AND APPARATUS WITH DEPTH IMAGE GENERATION

    公开(公告)号:US20210144357A1

    公开(公告)日:2021-05-13

    申请号:US16861510

    申请日:2020-04-29

    Abstract: A method with depth image generation may include: receiving an input image; generating a first low-resolution image having a resolution lower than a resolution of the input image; acquiring a first depth residual image corresponding to the input image by using a first generation model based on a first neural network; generating a first low-resolution depth image corresponding to the first low-resolution image by using a second generation model based on a second neural network; and generating a target depth image corresponding to the input image, based on the first depth residual image and the first low-resolution depth image.

    METHOD AND APPARATUS FOR GENERATING DEPTH IMAGE

    公开(公告)号:US20250069246A1

    公开(公告)日:2025-02-27

    申请号:US18944857

    申请日:2024-11-12

    Abstract: A method and apparatus for generating a depth image are provided. The apparatus receives an input image, extracts a feature corresponding to the input image, generates features for each depth resolution by decoding the feature using decoders corresponding to different depth resolutions, estimates probability distributions for each depth resolution by progressively refining the features for each depth resolution, and generates a target depth image corresponding to the input image based on a final estimated probability distribution from among the probability distributions for each depth resolution.

    SEMICONDUCTOR PACKAGE DEVICE
    19.
    发明申请

    公开(公告)号:US20240429189A1

    公开(公告)日:2024-12-26

    申请号:US18822646

    申请日:2024-09-03

    Abstract: A semiconductor package device may include a redistribution substrate and a semiconductor chip on a top surface of the redistribution substrate. The redistribution substrate may include an under-bump pattern, which includes including a body portion and a protruding portion extended from the body portion to form a single object, an insulating layer covering a side surface of the body portion, and an outer coupling terminal on the protruding portion. The body portion may have a first diameter in a first direction parallel to the top surface of the redistribution substrate, and the protruding portion may have a second diameter in the first direction, which is smaller than the first diameter. A top surface of the protruding portion may be parallel to the first direction, and a side surface of the protruding portion may be inclined at an angle to a top surface of the body portion.

    METHOD AND DEVICE WITH AUTOMATIC LABELING
    20.
    发明公开

    公开(公告)号:US20240161007A1

    公开(公告)日:2024-05-16

    申请号:US18351100

    申请日:2023-07-12

    CPC classification number: G06N20/00

    Abstract: A processor-implemented method includes training a first model to predict confidences of labels for data samples in a training dataset, including using a corrected data sample obtained by correcting an incorrect label based on a corresponding confidence detected by the first model and an estimated corrected label generated by a second model; training the second model to estimate correct labels for the data samples, including estimating a correct other label corresponding to another incorrect label detected based on a corresponding confidence generated by the first model with respect to the other incorrect label; and automatically correcting the other incorrect label with the estimated correct other label.

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