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    METHOD AND APPARATUS WITH LABEL NOISE PROCESSING
    1.
    发明公开
    METHOD AND APPARATUS WITH LABEL NOISE PROCESSING 审中-公开

    公开(公告)号：US20230252771A1

    公开(公告)日：2023-08-10

    申请号：US17988072

    申请日：2022-11-16

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Heewon KIM ,  Jihye KIM ,  Seungju HAN

    IPC: G06V10/776 ,  G06V10/82 ,  G06N3/04

    CPC classification number: G06V10/776 ,  G06N3/0454 ,  G06V10/82

    Abstract: A processor-implemented method with label noise processing includes: iteratively training a first model for correcting a label of a data set, the label comprising noise, and a second model for detecting the noise of the label; and processing the data set comprising the noise using either one or both of the trained first model and the trained second model, wherein the iterative training comprises: identifying clean data in the data set using the second model; training the first model using the clean data; correcting the label of the data set using the trained first model; and training the second model based on the data set comprising the corrected label.

    SEMICONDUCTOR PACKAGE DEVICE
    2.
    发明申请
    SEMICONDUCTOR PACKAGE DEVICE 有权

    公开(公告)号：US20220020714A1

    公开(公告)日：2022-01-20

    申请号：US17204313

    申请日：2021-03-17

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Ju-Il CHOI ,  Gyuho KANG ,  Heewon KIM ,  Junyoung PARK ,  Seong-Hoon BAE ,  Jin Ho AN

    IPC: H01L23/00 ,  H01L23/532 ,  H01L23/538

    Abstract: A semiconductor package device may include a redistribution substrate and a semiconductor chip on a top surface of the redistribution substrate. The redistribution substrate may include an under-bump pattern, which includes including a body portion and a protruding portion extended from the body portion to form a single object, an insulating layer covering a side surface of the body portion, and an outer coupling terminal on the protruding portion. The body portion may have a first diameter in a first direction parallel to the top surface of the redistribution substrate, and the protruding portion may have a second diameter in the first direction, which is smaller than the first diameter. A top surface of the protruding portion may be parallel to the first direction, and a side surface of the protruding portion may be inclined at an angle to a top surface of the body portion.

    SEMICONDUCTOR PACKAGE
    3.
    发明申请
    SEMICONDUCTOR PACKAGE 有权

    公开(公告)号：US20220399316A1

    公开(公告)日：2022-12-15

    申请号：US17677453

    申请日：2022-02-22

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Ju-Il CHOI ,  Gyuho KANG ,  Heewon KIM ,  Sechul PARK ,  Jongho PARK ,  Junyoung PARK

    IPC: H01L25/10 ,  H01L23/498 ,  H01L23/538 ,  H01L23/00 ,  H01L23/48

    Abstract: Disclosed is a semiconductor package comprising an interposer substrate having first and second surfaces opposite each other and including a wiring layer adjacent to the first surface, a semiconductor chip on the first surface of the interposer substrate, a passivation layer on the first surface of the interposer substrate and covering the semiconductor chip, and redistribution patterns in the passivation layer and connected to the semiconductor chip. The semiconductor chip has third and fourth surfaces opposite to each other. The third surface of the semiconductor chip faces the first surface of the interposer substrate. The redistribution patterns are connected to the fourth surface of the semiconductor chip. The semiconductor chip includes chip pads adjacent to the third surface and chip through electrodes connected to the chip pads. Each of the chip pads is directly bonded to a corresponding one of wiring patterns in the wiring layer.

    SEMICONDUCTOR PACKAGE
    7.
    发明申请
    SEMICONDUCTOR PACKAGE 有权

    公开(公告)号：US20230060115A1

    公开(公告)日：2023-02-23

    申请号：US17723552

    申请日：2022-04-19

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Sechul PARK ,  Unbyoung KANG ,  Heewon KIM ,  Jongho PARK ,  Hyojin YUN ,  Juil CHOI

    IPC: H01L23/00 ,  H01L25/065

    Abstract: A semiconductor package includes a first semiconductor chip on a base chip, a second semiconductor chip on the first semiconductor chip in a first direction, each of the first and second semiconductor chips including a TSV and being electrically connected to each other via the TSV, dam structures on the base chip and surrounding a periphery of the first semiconductor chip, a first adhesive film between the base chip and the first semiconductor chip, a portion of the first adhesive film filling a space between the first semiconductor chip and the dam structures, a second adhesive film between the first semiconductor chip and the second semiconductor chip, a portion of the second adhesive film overlapping the dam structures in the first direction, and an encapsulant encapsulating a portion of each of the dam structures, the first semiconductor chip, and the second semiconductor chip.

    METHOD AND APPARATUS WITH IMAGE PROCESSING
    9.
    发明申请
    METHOD AND APPARATUS WITH IMAGE PROCESSING 有权

    公开(公告)号：US20220188987A1

    公开(公告)日：2022-06-16

    申请号：US17383346

    申请日：2021-07-22

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Heewon KIM ,  Seon Min RHEE ,  Jihye KIM ,  Seungju HAN

    IPC: G06T5/00 ,  G06T5/50 ,  G06N3/08 ,  G06N3/04

    Abstract: A method with image processing includes: generating a first surface normal image comprising surface normal vectors corresponding to pixels of a first depth image; and applying the first depth image and the first surface normal image to a first neural network, and acquiring a second depth image by changing the first depth image using the first neural network. The first neural network generates the second depth image to have an improved quality compared to the first depth image, based on an embedding vector that comprises a feature of the first depth image and a feature of the first surface normal image.

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