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公开(公告)号:US20240349511A1
公开(公告)日:2024-10-17
申请号:US18521629
申请日:2023-11-28
Applicant: Samsung Electronics Co., Ltd.
Inventor: Jungmin PARK , Ji-Sung KIM , Han Jin LIM , Hyungsuk JUNG
Abstract: A capacitor according to at least one embodiment may include a first electrode and a second electrode spaced apart from each other, and a dielectric layer disposed between the first electrode and the second electrode and including a ferroelectric layer and an auxiliary portion disposed in the ferroelectric layer, wherein an energy band gap Eg of the auxiliary portion may be lower than about 4.0 eV.
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公开(公告)号:US20220336574A1
公开(公告)日:2022-10-20
申请号:US17854679
申请日:2022-06-30
Applicant: Samsung Electronics Co., Ltd.
Inventor: Sang Yeol KANG , Kyu Ho CHO , Han Jin LIM , Cheol Seong HWANG
IPC: H01L49/02 , H01L27/108
Abstract: A semiconductor device including a switching element on a substrate, a pad isolation layer on the switching element, a conductive pad passing through the pad isolation layer and connected to the switching element, an insulating pattern on the pad isolation layer and having a height greater than a horizontal width, a lower electrode on side surfaces of the insulating pattern on side surfaces of the insulating pattern and in contact with the conductive pad, a capacitor dielectric layer on the lower electrode and having a monocrystalline dielectric layer and a polycrystalline dielectric layer, the monocrystalline dielectric layer being relatively close to side surfaces of the insulating pattern compared to the polycrystalline dielectric layer an upper electrode on the capacitor dielectric layer may be provided.
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公开(公告)号:US20220231117A1
公开(公告)日:2022-07-21
申请号:US17714259
申请日:2022-04-06
Applicant: Samsung Electronics Co., Ltd.
Inventor: Han Jin LIM , Ki Nam KIM , Hyung Suk JUNG , Kyoo Ho JUNG , Ki Hyun HWANG
IPC: H01L49/02 , H01L21/02 , H01L21/28 , H01L27/11507
Abstract: There is provided a semiconductor device capable of improving the performance and/or reliability of the element, by increasing the capacitance of the capacitor, using a capacitor dielectric film including a ferroelectric material and a paraelectric material. The semiconductor device includes first and second electrodes disposed to be spaced apart from each other, and a capacitor dielectric film disposed between the first electrode and the second electrode and including a first dielectric film and a second dielectric film. The first dielectric film includes one of a first monometal oxide film and a first bimetal oxide film, the first dielectric film has an orthorhombic crystal system, the second dielectric film includes a paraelectric material, and a dielectric constant of the capacitor dielectric film is greater than a dielectric constant of the second dielectric film.
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公开(公告)号:US20190027495A1
公开(公告)日:2019-01-24
申请号:US16142637
申请日:2018-09-26
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Ji Hoon CHOI , Sung Gil KIM , Seulye KIM , Jung Ho KIM , Hong Suk KIM , Phil Ouk NAM , Jae Young AHN , Han Jin LIM
IPC: H01L27/11582 , H01L23/528 , H01L27/11565
Abstract: A semiconductor device includes a stack structure on a substrate, the stack structure including interlayer insulating layers and first gate electrodes alternately stacked on each other, a semiconductor layer in an opening penetrating through the stack structure, a first dielectric layer between the semiconductor layer and the stack structure, and a lower pattern closer to the substrate than to the first gate electrodes in the stack structure, the lower pattern including a first surface facing the first dielectric layer, and a second surface facing the stack structure, the second surface defining an acute angle with the first surface, wherein the first dielectric layer includes a first portion facing the stack structure, and a second portion facing the first surface of the lower pattern, the second portion having a thickness greater than a thickness of the first portion.
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15.
公开(公告)号:US20160260813A1
公开(公告)日:2016-09-08
申请号:US14854272
申请日:2015-09-15
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Eunae CHO , Dongjin LEE , Ji Eun LEE , Kyoung-Ho JUNG , Dong Su KO , Yongsu KIM , Jiho YOO , Sung HEO , Hyun PARK , Satoru YAMADA , Moonyoung JEONG , Sungjin KIM , Gyeongsu PARK , Han Jin LIM
IPC: H01L29/423 , H01L29/51 , H01L21/28 , H01L29/49
CPC classification number: H01L29/4236 , H01L21/28088 , H01L29/4966 , H01L29/513 , H01L29/517
Abstract: A semiconductor device and a method of manufacturing the same are provided. The semiconductor device includes a substrate including a trench. The semiconductor device further includes a gate electrode disposed in the trench, and a gate insulating film disposed between the substrate and the gate electrode. The gate electrode includes a gate conductor and a metal element, and an effective work function of the gate electrode is less than an effective work function of the gate conductor.
Abstract translation: 提供半导体器件及其制造方法。 半导体器件包括包括沟槽的衬底。 半导体器件还包括设置在沟槽中的栅极电极和设置在衬底和栅电极之间的栅极绝缘膜。 栅电极包括栅极导体和金属元件,并且栅电极的有效功函数小于栅极导体的有效功函数。
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