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    Semiconductor devices including stacked semiconductor chips
    11.
    发明授权
    Semiconductor devices including stacked semiconductor chips 有权

    公开(公告)号：US10483243B2

    公开(公告)日：2019-11-19

    申请号：US16236882

    申请日：2018-12-31

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Donghyun Kim ,  DooWon Kwon

    IPC: H01L25/065 ,  H01L23/00 ,  H01L27/146 ,  B60K11/06 ,  B60H1/00 ,  B60H1/32 ,  F01P7/04 ,  F01P11/20

    Abstract: A semiconductor device includes a chip stack structure including a first semiconductor chip and a second semiconductor chip stacked on the first semiconductor chip. The first semiconductor chip includes a first substrate, a first circuit layer on a front surface of the first substrate, and a first connecting layer disposed on the first circuit layer and including a first metal pad electrically connected to the first circuit layer. The second semiconductor chip includes a second substrate, a second circuit layer on a front surface of the second substrate, and a second connecting layer disposed on the second circuit layer and including a second metal pad electrically connected to the second circuit layer. The first connecting layer faces the second connecting layer. The first and second metal pads are in contact with each other to couple the first and second semiconductor chips to each other.

    SEMICONDUCTOR DEVICES INCLUDING STACKED SEMICONDUCTOR CHIPS
    12.
    发明申请
    SEMICONDUCTOR DEVICES INCLUDING STACKED SEMICONDUCTOR CHIPS 审中-公开

    公开(公告)号：US20190157245A1

    公开(公告)日：2019-05-23

    申请号：US16236882

    申请日：2018-12-31

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Donghyun Kim ,  DooWon Kwon

    IPC: H01L25/065 ,  B60H1/00 ,  H01L27/146 ,  H01L23/00 ,  B60H1/32 ,  B60K11/06

    Abstract: A semiconductor device includes a chip stack structure including a first semiconductor chip and a second semiconductor chip stacked on the first semiconductor chip. The first semiconductor chip includes a first substrate, a first circuit layer on a front surface of the first substrate, and a first connecting layer disposed on the first circuit layer and including a first metal pad electrically connected to the first circuit layer. The second semiconductor chip includes a second substrate, a second circuit layer on a front surface of the second substrate, and a second connecting layer disposed on the second circuit layer and including a second metal pad electrically connected to the second circuit layer. The first connecting layer faces the second connecting layer. The first and second metal pads are in contact with each other to couple the first and second semiconductor chips to each other.

    Image sensor wherein the transfer gate contacts a first refractive layer that is coplanar with a second refractive layer
    14.
    发明授权
    Image sensor wherein the transfer gate contacts a first refractive layer that is coplanar with a second refractive layer 有权

    公开(公告)号：US12272709B2

    公开(公告)日：2025-04-08

    申请号：US17655576

    申请日：2022-03-21

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Minho Jang ,  Jeongsoon Kang ,  Donghyun Kim ,  Seungkuk Kang ,  Insung Joe

    IPC: H01L27/146

    Abstract: An image sensor includes a first structure, a second structure, and a third structure that are sequentially stacked in a vertical direction. The first structure includes a first substrate and at least one first transistor disposed on the first substrate. The second structure includes a second substrate and at least one second transistor disposed on the second substrate. The third structure includes a third substrate that includes an upper surface on which light is incident and a lower surface that is opposite to the upper surface, a photoelectric conversion region disposed in the third substrate, a transfer gate disposed on the lower surface of the third substrate, and a reflective structure disposed on the lower surface of the third substrate and on a lower surface and side surface of the transfer gate.

    AUTOMOTIVE IMAGE SENSOR, IMAGE PROCESSING SYSTEM INCLUDING THE SAME AND OPERATING METHOD THEREOF
    16.
    发明公开
    AUTOMOTIVE IMAGE SENSOR, IMAGE PROCESSING SYSTEM INCLUDING THE SAME AND OPERATING METHOD THEREOF 审中-公开

    公开(公告)号：US20240281258A1

    公开(公告)日：2024-08-22

    申请号：US18649335

    申请日：2024-04-29

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Sigyoung KOO ,  Donghyun Kim

    IPC: G06F9/4401 ,  G06F21/44 ,  H04L9/30 ,  H04L9/32

    CPC classification number: G06F9/4401 ,  G06F21/44 ,  H04L9/30 ,  H04L9/3249

    Abstract: Provided is a method of operating an automotive image sensor, the method including performing a reset operation to set an initialization register corresponding to operation information of the automotive image sensor, receiving a device authentication request from an electronic control unit after performing the reset operation, performing an authentication operation with the electronic control unit based on the device authentication request, obtaining first image data while performing the authentication operation, transmitting the first image data to the electronic control unit while performing the authentication operation, obtaining second image data after the authentication operation is completed, generating a tag for the second image data, and transmitting the second image data and the tag to the electronic control unit.

    Air conditioner
    17.
    发明授权
    Air conditioner 有权

    公开(公告)号：US11965682B2

    公开(公告)日：2024-04-23

    申请号：US17574194

    申请日：2022-01-12

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Dongsu Ha ,  Donghyun Kim ,  Hyundal Kim ,  Jinwoo Hong

    IPC: F25B41/325 ,  F25B5/02

    CPC classification number: F25B41/325 ,  F25B5/02

    Abstract: An air conditioner includes an outdoor unit including a compressor, first and second indoor heat exchangers to receive a refrigerant from the outdoor unit, the second indoor heat exchanger receiving the refrigerant independently of the first indoor heat exchanger, and a fan disposed between the first and second indoor heat exchangers. First and second refrigerant pipes form flow paths between the outdoor unit and the first and second indoor heat exchangers. First and second expansion valves are disposed on the first and second refrigerant pipes. Third and fourth refrigerant pipes form flow paths between the compressor and the first and second indoor heat exchangers. A first opening and closing valve selectively opens and closes a fifth refrigerant pipe to selectively allow refrigerant to flow between the second and third refrigerant pipes. Second and third opening and closing valves selectively open and close the second and third refrigerant pipes.

    IMAGE SENSOR
    18.
    发明公开
    IMAGE SENSOR 审中-公开

    公开(公告)号：US20230352510A1

    公开(公告)日：2023-11-02

    申请号：US18164228

    申请日：2023-02-03

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Junghye Kim ,  Donghyun Kim ,  Sung In Kim ,  Kyoungeun Chang ,  Jae Ho Kim

    IPC: H01L27/146

    CPC classification number: H01L27/1463 ,  H01L27/14607 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14645

    Abstract: An image sensor includes a pixel separation part in a substrate and configured to separate pixels, the pixels including a first pixel, the pixel separation part including first to fourth sidewalls that at least partially define the first pixel, a first source follower gate electrode on the first pixel and adjacent to the first sidewall and the second sidewall, a first impurity region adjacent to a first corner where the first sidewall and the second sidewall meet, a second impurity region adjacent to a second corner where the second sidewall and the third sidewall meet, and a third impurity region adjacent to a third corner where the first sidewall and the fourth sidewall meet. The first to third impurity regions are adjacent to the first source follower gate electrode. The second impurity region and the third impurity region are electrically connected to each other.

    IMAGE SENSOR
    20.
    发明申请
    IMAGE SENSOR 有权

    公开(公告)号：US20220392930A1

    公开(公告)日：2022-12-08

    申请号：US17671651

    申请日：2022-02-15

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Kyoungeun Chang ,  Hyunchul Kim ,  Jinyoung Kim ,  Donghyun Kim ,  Sungin Kim

    IPC: H01L27/146

    Abstract: An image sensor includes: a substrate having a first surface on which light is incident and a second surface opposite to the first surface; a pixel isolation structure enclosing a pixel region in the substrate; a photoelectric conversion region in the pixel region; and a device isolation layer defining a pattern in the pixel region, wherein the device isolation layer includes a first portion contacting the pixel isolation structure and a second portion spaced apart from the pixel isolation structure, the device isolation layer extends from a second surface of the substrate into the substrate, and a length of the second portion of the device isolation layer in a vertical direction perpendicular to the first surface of the substrate is less than a length of the first portion of the device isolation layer in the vertical direction.

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