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公开(公告)号：US20240056520A1
公开(公告)日：2024-02-15
申请号：US18313722
申请日：2023-05-08
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Youngsub KIM , Jungho PARK , Kwanghyun BAEK , Jungyub LEE , Juneseok LEE , Dohyuk HA
CPC classification number: H04M1/0277 , H05K1/144 , H05K1/028 , H05K2201/041 , H05K2201/10734 , H05K2201/10098
Abstract: In various embodiments, a module for a wireless communication includes: a radiator, a plurality of resonators, a first substrate on which the radiator and the plurality of resonators are disposed, and a second substrate including a power supply. The first substrate includes a plurality of first layers. The second substrate includes a plurality of second layers. The radiator is disposed on a radiation layer of the plurality of first layers of the first substrate. The plurality of resonators is disposed on a resonance layer of the plurality of first layers of the first substrate. At least part of the plurality of resonators in the resonance layer is disposed in an area in the radiation layer, different from an area in which the radiator is disposed.
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公开(公告)号：US20230299506A1
公开(公告)日：2023-09-21
申请号：US18192910
申请日：2023-03-30
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sanghoon PARK , Kwanghyun BAEK , Juneseok LEE , Dohyuk HA , Jungho PARK , Youngju LEE , Jungyub LEE , Jinsu HEO
CPC classification number: H01Q21/28 , H01Q1/2283
Abstract: The disclosure relates to a 5th generation (5G) or pre-5G communication system for supporting a higher data transmission rate than a 4th generation (4G) communication system such as long term evolution (LTE). An antenna module is provided. The antenna module includes a plurality of antennas, a first printed circuit board (PCB) on which the plurality of antennas are disposed, a second PCB on which one or more elements for processing a radio frequency (RF) signal are disposed, and an adhesive material for bonding the first PCB and the second PCB, wherein the first PCB includes a first metal layer, a second metal layer, a dielectric, and a coupling structure plated along the first metal layer, the second metal layer, and a via hole between the first metal layer and the second metal layer, and may be disposed to provide a coupling connection through the coupling structure of the first PCB.
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公开(公告)号：US20230129937A1
公开(公告)日：2023-04-27
申请号：US18145550
申请日：2022-12-22
Applicant: Samsung Electronics Co., Ltd.
Inventor： Youngsub KIM , Sohyeon JUNG , Kwanghyun BAEK , Youngju LEE , Juneseok LEE , Dohyuk HA
Abstract: An electronic device is provided. The electronic device includes a plurality of antenna arrays, a plurality of first printed circuit board (PCB) sets corresponding to the plurality of the antenna arrays, and a second PCB including a power interface, the second PCB may include a feeding line for delivering signals to the antenna elements, a first layer formed away from a first surface of the feeding line, and a second layer formed away from a second surface of the feeding line, and the second layer may include a metamaterial for transforming impedance.
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14.发明申请公开(公告)号：US20230030388A1
公开(公告)日：2023-02-02
申请号：US17786870
申请日：2020-12-15
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sanghoon PARK , Juneseok LEE , Dohyuk HA , Jinsu HEO , Youngju LEE
IPC: H01Q1/42
Abstract: The present disclosure relates to a communication technique for converging, with IoT technology, a 5G communication system for supporting a higher data transfer rate beyond the 4G system, and a system therefor. The present disclosure may be applied to intelligent services (for example, smart homes, smart buildings, smart cities, smart cars or connected cars, healthcare, digital education, retail businesses, security- and safety-related services, etc.) on the basis of 5G communication technology and IoT-related technology. Disclosed is a cover device for protecting an antenna device which is mounted in an electronic device to radiate a beam in an ultrahigh-frequency band, the cover device comprising: a cover frame including an open window region corresponding to a radiation region of the antenna device; and a thickness compensation structure disposed in the window region on the cover frame and having a different thickness according to the frequency band of the beam radiated from the antenna device.
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公开(公告)号：US20230019144A1
公开(公告)日：2023-01-19
申请号：US17946688
申请日：2022-09-16
Applicant: Samsung Electronics Co., Ltd.
Inventor： Juneseok LEE , Youngsub KIM , Sanghoon PARK , Jungho PARK , Kwanghyun BAEK , Youngju LEE , Jungyub LEE , Dohyuk HA , Jinsu HEO
Abstract: The disclosure relates to a pre-5th-Generation (5G) or 5G communication system for supporting higher data rates Beyond 4th-Generation (4G) communication system, such as long term evolution (LTE). An antenna device is provided. The antenna device includes a first printed circuit board (PCB), a second PCB for a plurality of antenna elements, and a radio frequency integrated circuit (RFIC) coupled through a first surface of the first PCB. The second PCB may include a radio frequency (RF) routing layer including RF lines for the respective plurality of antenna elements. The first PCB may include a feeding structure for connecting the RF routing layer and the RFIC. The second PCB may be electrically connected to a second surface of the first PCB opposite to the first surface of the first PCB, through a first surface of the second PCB. The second PCB may be coupled to the plurality of antenna elements.
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Patent Agency Ranking
公开(公告)号：US20210344120A1
公开(公告)日：2021-11-04
申请号：US17373000
申请日：2021-07-12
Applicant: Samsung Electronics Co., Ltd.
Inventor： Kwanghyun BAEK , Seungtae KO , Kijoon KIM , Juho SON , Sangho LEE , Youngju LEE , Jungyub LEE , Yonghun CHEON , Dohyuk HA
Abstract: A communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT) are provided. The disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. According to the disclosure, an antenna module includes a first substrate layer on which at least one substrate is stacked; an antenna coupled to an upper end surface of the first substrate layer; a second substrate layer having an upper end surface coupled to a lower end surface of the first substrate layer and on which at least one substrate is stacked; and a radio frequency (RF) element coupled to a lower end surface of the second substrate layer.
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公开(公告)号：US20210126379A1
公开(公告)日：2021-04-29
申请号：US17062990
申请日：2020-10-05
Applicant: Samsung Electronics Co., Ltd.
Inventor： Kwanghyun BAEK , Seungtae KO , Kijoon KIM , Juho SON , Sangho LEE , Youngju LEE , Jungyub LEE , Yonghun CHEON , Dohyuk HA
IPC: H01Q21/06 , H01Q1/24 , H01Q1/42 , H04B7/0413 , H05K1/18
Abstract: A communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT) are provided. The disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. According to the disclosure, an antenna module includes a first substrate layer on which at least one substrate is stacked; an antenna coupled to an upper end surface of the first substrate layer; a second substrate layer having an upper end surface coupled to a lower end surface of the first substrate layer and on which at least one substrate is stacked; and a radio frequency (RF) element coupled to a lower end surface of the second substrate layer.
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公开(公告)号：US20210075124A1
公开(公告)日：2021-03-11
申请号：US17063929
申请日：2020-10-06
Applicant: Samsung Electronics Co., Ltd.
Inventor： Kwanghyun BAEK , Seungtae KO , Kijoon KIM , Juho SON , Sangho LEE , Youngju LEE , Jungyub LEE , Yonghun CHEON , Dohyuk HA
IPC: H01Q21/06 , H05K1/18 , H04B7/0413 , H01Q1/42 , H01Q1/24
Abstract: A communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT) are provided. The disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. According to the disclosure, an antenna module includes a first substrate layer on which at least one substrate is stacked; an antenna coupled to an upper end surface of the first substrate layer; a second substrate layer having an upper end surface coupled to a lower end surface of the first substrate layer and on which at least one substrate is stacked; and a radio frequency (RF) element coupled to a lower end surface of the second substrate layer.
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公开(公告)号：US20240405449A1
公开(公告)日：2024-12-05
申请号：US18799612
申请日：2024-08-09
Applicant: Samsung Electronics Co., Ltd.
Inventor： Kwanghyun BAEK , Seungtae KO , Kijoon KIM , Juho SON , Sangho LEE , Youngju LEE , Jungyub LEE , Yonghun CHEON , Dohyuk HA
Abstract: A communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT) are provided. The disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. According to the disclosure, an antenna module includes a first substrate layer on which at least one substrate is stacked; an antenna coupled to an upper end surface of the first substrate layer; a second substrate layer having an upper end surface coupled to a lower end surface of the first substrate layer and on which at least one substrate is stacked; and a radio frequency (RF) element coupled to a lower end surface of the second substrate layer.
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20.发明公开公开(公告)号：US20230361451A1
公开(公告)日：2023-11-09
申请号：US18208349
申请日：2023-06-12
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Sanghoon PARK , Juneseok LEE , Dohyuk HA , Jungyub LEE , Jinsu HEO , Youngju LEE
CPC classification number: H01Q1/246 , H01Q1/1271 , H01Q1/42
Abstract: The disclosure relates to a communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT). The disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. Disclosed is a cover device configured to protect an antenna device embedded in an electronic device to radiate a beam of an ultra-high frequency band, the cover device including: a cover frame including a window area corresponding to a radiation area of the antenna device; and a functional structure disposed in the window area on the cover frame and having a stacked structure comprising one or more functional layers.
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