公开(公告)号：US10756700B2

公开(公告)日：2020-08-25

申请号：US15638809

申请日：2017-06-30

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Sung Han ,  Jae Chang Lee ,  Won Han ,  Tae Yoon Kim ,  Jong Woon Kim ,  Tae Kyung Lee ,  Moon Chul Lee ,  Tae Hun Lee ,  Sung Min Cho ,  In Young Kang

IPC: H01L41/09 ,  H03H9/10 ,  H03H9/02 ,  H03H9/54 ,  H03H9/17

Abstract: A bulk acoustic wave resonator device includes: a substrate; a lower electrode disposed on the substrate; a piezoelectric layer disposed over a portion of the lower electrode; an upper electrode disposed on the piezoelectric layer; and a shape control layer covering an edge of a cavity disposed between the substrate and the lower electrode, wherein tensile stress is applied to the shape control layer during formation of the shape control layer.

公开(公告)号：US10009007B2

公开(公告)日：2018-06-26

申请号：US15184230

申请日：2016-06-16

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Tae Kyung Lee ,  Sung Han ,  Hwa Sun Lee ,  Seung Joo Shin ,  Ran Hee Shin

IPC: H03H9/13 ,  H03H9/54 ,  H03H9/02 ,  H03H9/17

CPC classification number: H03H9/13 ,  H03H9/02149 ,  H03H9/173 ,  H03H9/54

Abstract: A bulk acoustic wave resonator includes a substrate, a first electrode and a second electrode disposed on the substrate, and a piezoelectric layer disposed between the first electrode and the second electrode. At least one of the first electrode and the second electrode includes an alloy of molybdenum and tantalum.

公开(公告)号：US20150101848A1

公开(公告)日：2015-04-16

申请号：US14491888

申请日：2014-09-19

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Ji Sung CHO ,  Toshiko Yokota ,  Makoto Dobashi ,  Seung Min Baek ,  Ichiro Ogura ,  Eun Jung Lim ,  Yoon Su Kim ,  Sung Han

IPC: H05K1/02 ,  H05K1/09 ,  H05K3/00 ,  H05K1/03

CPC classification number: H05K1/0284 ,  H05K1/0333 ,  H05K1/09 ,  H05K3/007 ,  H05K3/025 ,  H05K3/389 ,  H05K2201/0335 ,  H05K2203/0152 ,  H05K2203/0156 ,  H05K2203/0369 ,  Y10T428/265 ,  Y10T428/266 ,  Y10T428/31533 ,  Y10T428/31544 ,  Y10T428/31678

Abstract: Disclosed herein are a surface-treated copper foil, a copper-clad laminate plate including the same, a printed circuit board using the same, and a method for manufacturing the same. In detail, the copper-clad laminate plate according to one implementation embodiment of the present invention includes: carrier; a peel layer formed on the carrier; a copper-clad layer formed on the peel layer; and a surface-treated layer formed on the copper-clad layer, in which the surface-treated layer includes a thiol-based compound. Therefore, the present invention provides a printed circuit board capable of improving an adhesive force between a base and a copper-clad layer without treating a roughed surface by forming the surface-treated layer on the copper-clad layer.

Abstract translation: 本文公开了表面处理铜箔，包括该铜箔的覆铜层压板，使用其的印刷电路板及其制造方法。 具体地，根据本发明的一个实施方案的覆铜层压板包括：载体; 形成在载体上的剥离层; 形成在剥离层上的铜包层; 以及形成在覆铜层上的表面处理层，其中表面处理层包括硫醇基化合物。 因此，本发明提供一种印刷电路板，其能够通过在铜包覆层上形成表面处理层来改善基体和覆铜层之间的粘合力而不对粗糙表面进行处理。

公开(公告)号：US11909380B2

公开(公告)日：2024-02-20

申请号：US16668118

申请日：2019-10-30

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Ran Hee Shin ,  Tae Kyung Lee ,  Sung Han ,  Yun Sung Kang ,  Sung Sun Kim ,  Jin Suk Son ,  Jeong Suong Yang ,  Hwa Sun Lee ,  Eun Tae Park

IPC: H03H9/02 ,  H03H9/17 ,  H03H3/02

CPC classification number: H03H9/173 ,  H03H3/02 ,  H03H9/02015 ,  H03H9/174 ,  H03H9/02118 ,  H03H2003/021 ,  H03H2003/023

Abstract: An acoustic resonator and a method of manufacturing the same are provided. The acoustic resonator includes a resonating part including a first electrode, a second electrode, and a piezoelectric layer; and a plurality of seed layers disposed on one side of the resonating part.

公开(公告)号：US10541668B2

公开(公告)日：2020-01-21

申请号：US15085072

申请日：2016-03-30

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Ran Hee Shin ,  Tae Kyung Lee ,  Sung Han ,  Yun Sung Kang ,  Sung Sun Kim ,  Jin Suk Son ,  Jeong Suong Yang ,  Hwa Sun Lee ,  Eun Tae Park

IPC: H03H9/17 ,  H03H3/02 ,  H03H9/02

Abstract: An acoustic resonator and a method of manufacturing the same are provided. The acoustic resonator includes a resonating part including a first electrode, a second electrode, and a piezoelectric layer; and a plurality of seed layers disposed on one side of the resonating part.

公开(公告)号：US10439589B2

公开(公告)日：2019-10-08

申请号：US15452090

申请日：2017-03-07

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Tae Kyung Lee ,  Jae Sang Lee ,  Ran Hee Shin ,  In Young Kang ,  Sung Sun Kim ,  Sung Han

IPC: H03H9/17 ,  H03H9/54 ,  H03H9/13 ,  H03H9/60

Abstract: A bulk acoustic wave resonator includes a substrate, a first electrode and a second electrode formed on the substrate, and a piezoelectric layer provided between the first electrode and the second electrode. Either one or both of the first electrode and the second electrode include a molybdenum-tungsten alloy having a weight ratio of molybdenum to tungsten in a range of 3:1 to 1:3.

公开(公告)号：US10396755B2

公开(公告)日：2019-08-27

申请号：US15271579

申请日：2016-09-21

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sung Han ,  Dae Ho Kim ,  Ran Hee Shin ,  Hwa Sun Lee ,  Chang Hyun Lim ,  Tae Kyung Lee ,  Sung Sun Kim

IPC: H03H9/17 ,  H03H3/02 ,  H03H9/13 ,  H03H9/54 ,  H03H9/02

Abstract: A resonator includes a resonating portion including a first electrode, a second electrode, and a piezoelectric layer positioned between the first electrode and the second electrode; and a frame provided at an outer edge of the resonating portion, at least a portion of the frame covering an outer end portion of the second electrode.

公开(公告)号：US20150212538A1

公开(公告)日：2015-07-30

申请号：US14249719

申请日：2014-04-10

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hyun Dong LEE ,  Youn Soo Kim ,  Sung Han ,  Seung Min Lee ,  Jae Ho Shin

IPC: G06F1/16 ,  G06F3/041

CPC classification number: G06F1/16 ,  G06F3/0416

Abstract: A touch panel may include: at least one substrate; a sensor part formed on a mounting region of the at least one substrate so as to sense a user's touch; a wiring unit delivering a detection signal from each sensor node in the sensor part; and a connection part including a plurality of pads to receive detection signals from the wiring unit. The plurality of pads are arranged in at least two rows, with at least two pads in each row.

Abstract translation: 触摸面板可以包括：至少一个基板; 传感器部分，形成在所述至少一个基板的安装区域上，以感测用户的触摸; 布线单元，其从所述传感器部分中的每个传感器节点传送检测信号; 以及连接部分，其包括用于接收来自所述布线单元的检测信号的多个焊盘。 多个衬垫被布置成至少两排，每行中至少有两个衬垫。

公开(公告)号：US20150103261A1

公开(公告)日：2015-04-16

申请号：US14103159

申请日：2013-12-11

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Seung Min LEE ,  Sung Han ,  Hyun Dong Lee

IPC: G06F1/16 ,  C23F4/04

CPC classification number: G06F3/044 ,  G06F3/045 ,  G06F2203/04103

Abstract: There are provided a touch panel and a manufacturing method thereof, the touch panel including: a substrate, a plurality of fine conductive lines provided on one surface of the substrate, and a black treated part including a first black layer and a second black layer provided on the one surface of the substrate, wherein the first black layer, the plurality of fine conductive lines, and the second black layer are sequentially stacked on the substrate, the first black layer has a width wider than a line width of the fine conductive lines, and the second black layer has a width narrower than the line width of the fine conductive lines.

Abstract translation: 提供一种触摸面板及其制造方法，所述触摸面板包括：基板，设置在所述基板的一个表面上的多条细导电线，以及设置有第一黑色层和第二黑色层的黑色处理部， 在基板的一个表面上，其中第一黑色层，多根细导电线和第二黑色层依次层叠在基板上，第一黑色层的宽度比细导电线的线宽宽 并且第二黑色层的宽度比细导电线的线宽窄。