公开(公告)号：US20210384457A1

公开(公告)日：2021-12-09

申请号：US17172762

申请日：2021-02-10

Applicant: Samsung Display Co., LTD.

Inventor： DAEHWAN JANG ,  SUNGHOON KIM ,  HYUK-HWAN KIM ,  SEOKHYUN NAM ,  HAENGWON PARK ,  JIN HO CHO

IPC: H01L51/52 ,  H01L27/32 ,  H01L51/50 ,  H01L51/56

Abstract: A display device includes a first substrate including at least one first opening part defined, a pixel disposed on the first substrate, at least one first heat dissipation layer disposed in the at least one first opening part, an insulation layer disposed under the first substrate and including at least one second opening part overlapping the at least one first opening part, and a second heat dissipation layer disposed in the at least one second opening part.

公开(公告)号：US20210323287A1

公开(公告)日：2021-10-21

申请号：US17197447

申请日：2021-03-10

Applicant: Samsung Display Co., Ltd.

Inventor： YOUNGOK PARK ,  HYUK-HWAN KIM

IPC: B32B27/08

Abstract: A display device includes a display panel having a light emitting element. A nano-cellulose sheet is disposed on the display panel. The nano-cellulose sheet is configured to transmit light generated from the light emitting element. The nano-cellulose sheet includes a plurality of layers that are sequentially laminated Each of the plurality of layers includes a pattern comprising a nano-cellulose fiber arranged in a hexagonal shape.

公开(公告)号：US20150261040A1

公开(公告)日：2015-09-17

申请号：US14599630

申请日：2015-01-19

Applicant: Samsung Display Co., Ltd.

Inventor： Hyun-Jeong KIM ,  HYUK-HWAN KIM ,  SEOKHYUN NAM ,  Si joon SONG

IPC: G02F1/1335 ,  B05D1/36 ,  B05D1/32 ,  B23K1/00 ,  B23K31/02

CPC classification number: G02F1/133603 ,  B23K1/0016 ,  B23K1/20 ,  B23K3/0638 ,  B23K3/08 ,  B23K2101/38 ,  G02F1/133606 ,  G02F1/133611 ,  G02F2001/133607 ,  H05K1/0274 ,  H05K1/181 ,  H05K2201/09909 ,  H05K2201/10106 ,  H05K2201/2054

Abstract: A manufacturing method of a backlight unit includes providing a solder paste on a printed circuit board and forming a solder part in a first area of the printed circuit board, aligning a bank mask on the printed circuit board to align a first opening defined through the bank mask with a second area of the printed circuit board not overlapped with the first area, providing a bank material in the first opening and forming a bank on the printed circuit board in an area corresponding to the second area, separating the bank mask from the printed circuit board including the bank thereon, and connecting the solder part of the printed circuit board and a light emitting unit to each other.

Abstract translation: 背光单元的制造方法包括在印刷电路板上设置焊膏并在印刷电路板的第一区域中形成焊料部分，使印刷电路板上的堤防掩模对齐，以对准通过堤岸限定的第一开口 掩模，其中印刷电路板的第二区域不与第一区域重叠，在第一开口中提供堤岸材料，并且在对应于第二区域的区域中在印刷电路板上形成堤岸，将堤防掩模与印刷 包括其上的堤，并且将印刷电路板的焊料部分和发光单元彼此连接。

公开(公告)号：US20140043855A1

公开(公告)日：2014-02-13

申请号：US13737638

申请日：2013-01-09

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Eui Jeong KANG ,  Yu-Dong KIM ,  HYUK-HWAN KIM ,  SEKI PARK ,  Si Joon SONG

IPC: F21V8/00 ,  F21V29/00

CPC classification number: G02B6/009 ,  G02B6/0083 ,  G02B6/0085 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/00014

Abstract: A backlight assembly includes a receiving container, a light emitting unit and a light guide plate. The receiving container includes a bottom portion, and a sidewall extended from the bottom portion. The light emitting unit is on an inner lateral surface of the sidewall. The light guide plate is in the receiving container and includes a side surface facing the light emitting unit. The light emitting unit includes a light emitting diode package which generates light, a first lead frame and a second lead frame. The first lead frame is electrically connected to a first electrode of the light emitting diode package. The second lead frame is spaced apart from the first lead frame and electrically connected to a second electrode of the light emitting diode package.

Abstract translation: 背光组件包括接收容器，发光单元和导光板。 接收容器包括底部和从底部延伸的侧壁。 发光单元位于侧壁的内侧表面上。 导光板位于接收容器中，并且包括面向发光单元的侧表面。 发光单元包括产生光的发光二极管封装，第一引线框和第二引线框。 第一引线框架电连接到发光二极管封装的第一电极。 第二引线框架与第一引线框架间隔开并且电连接到发光二极管封装的第二电极。