Abstract:
There is provided an organic light emitting display device including a first substrate; an organic light emitting unit formed on the first substrate; a second substrate disposed on the organic light emitting unit; and an adhesive unit for adhering the first substrate and the second substrate to each other, wherein the adhesive unit includes a sealant, and particles that are arranged in the sealant so as to block penetration of external impurities. There is further provided a method of manufacturing the organic light emitting display device.
Abstract:
An organic light-emitting display apparatus is disclosed. In one embodiment, the display apparatus includes i) a substrate and ii) an organic light-emitting device formed on the substrate, the organic light-emitting device including a stack structure including a first electrode, an organic light-emitting layer, and a second electrode. The apparatus may further include a sealing layer formed on the substrate so as to cover the organic light-emitting device, the sealing layer including an inorganic layer and a porous layer interposed between the sealing layer and the organic light-emitting device. One embodiment can reduce a stress due to a sealing inorganic layer so as to maintain characteristics for a long time in a severe environment and not affect an organic light-emitting device.
Abstract:
A thin film encapsulation unit including an inorganic layer, a first organic layer on the inorganic layer and including a light-blocking unit and a light-transmitting unit, and a reflection-preventing layer on the first organic layer.
Abstract:
There is provided an organic light emitting display device including a first substrate; an organic light emitting unit formed on the first substrate; a second substrate disposed on the organic light emitting unit; and an adhesive unit for adhering the first substrate and the second substrate to each other, wherein the adhesive unit includes a sealant, and particles that are arranged in the sealant so as to block penetration of external impurities. There is further provided a method of manufacturing the organic light emitting display device.
Abstract:
A thin film encapsulation unit including an inorganic layer, a first organic layer on the inorganic layer and including a light-blocking unit and a light-transmitting unit, and a reflection-preventing layer on the first organic layer.
Abstract:
A display apparatus and a filter for improving color purity (color saturation filter) are disclosed. In one aspect, the display apparatus includes a substrate, a display device formed on the substrate and having a plurality of pixel areas that emit different colors of light, and a color saturation filter on the display device. The color saturation filter is formed with a substantially uniform thickness over the plurality of pixel areas and has a transmissivity such that a full width at half maximum at the central wavelength of blue light emitted from one of the pixel areas is about 100 nm or less.
Abstract:
Disclosed are a flexible display apparatus and a method of manufacturing the same. The method includes preparing an organic layer material for a thin film encapsulation layer, coating an edge area and a central area of a substrate with the organic layer material by using a plurality of nozzles, and finishing an organic layer for the thin film encapsulation layer on the substrate. An amount of the organic layer material is adjusted by selectively driving a variable adjustment unit of the substrate.
Abstract:
A thin film encapsulation unit including an inorganic layer, a first organic layer on the inorganic layer and including a light-blocking unit and a light-transmitting unit, and a reflection-preventing layer on the first organic layer.
Abstract:
Thin film encapsulation for a flat panel display device and a method of manufacturing the thin film encapsulation structure. The thin film encapsulation structure of the flat panel display device includes thin film layers covering a display unit formed on a substrate, wherein the thin film layers comprise a plurality of inorganic layers and a hexamethyldisiloxane (HMDSO) layer interposed between the inorganic layers. Accordingly, as multiple layers of the thin film encapsulation structure may be formed in a single chamber, the manufacturing process may be simplified, and also, as the HMDSO layer, which is flexible, absorbs stresses, a risk of cracks occurring may also be reduced.