公开(公告)号：US20240196594A1

公开(公告)日：2024-06-13

申请号：US18478978

申请日：2023-09-29

Applicant: Samsung Electronics Co .,LTD

Inventor： Hyeri AN ,  Dongsik Park ,  Sooho Shain ,  Joonsuk Park ,  Keonhee Park ,  Gaeun Lee ,  Jihoon Chang ,  Yujin Cho ,  Hana Cho

IPC: H10B12/00

CPC classification number: H10B12/315 ,  H10B12/01

Abstract: A semiconductor device includes a switching element, and a data storage structure electrically connected to the switching element. The data storage structure includes first electrodes, a second electrode, and a dielectric layer between the first electrodes and the second electrode. The second electrode includes a compound semiconductor layer doped with an impurity element, the compound semiconductor layer includes two or more elements and includes a semiconductor material doped with the impurity element, the two or more elements include a first element and a second element, the first element is silicon (Si), and a concentration of the impurity element in the compound semiconductor layer is in a range of about 0.1 at % to about 5 at %, and a concentration of the first element in the compound semiconductor layer is in a range of about 10 at % to about 15 at %.

公开(公告)号：US11616018B2

公开(公告)日：2023-03-28

申请号：US17398043

申请日：2021-08-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Juik Lee ,  Joongwon Shin ,  Jihoon Chang ,  Junghoon Han ,  Junwoo Lee

IPC: H01L23/528 ,  H01L23/532 ,  H01L25/065 ,  H01L25/18 ,  H01L23/522 ,  H01L27/108 ,  H01L23/00 ,  H01L23/48

Abstract: A semiconductor device includes a plurality of middle interconnections and a plurality of middle plugs, which are disposed in an interlayer insulating layer and on a substrate. An upper insulating layer is disposed on the interlayer insulating layer. A first upper plug, a first upper interconnection, a second upper plug, and a second upper interconnection are disposed in the upper insulating layer. Each of the plurality of middle interconnections has a first thickness. The first upper interconnection has a second thickness that is greater than the first thickness. The second upper interconnection has a third thickness that is greater than the first thickness. The third thickness is twice to 100 times the first thickness. The second upper interconnection includes a material different from the second upper plug.

公开(公告)号：US20230039205A1

公开(公告)日：2023-02-09

申请号：US17723747

申请日：2022-04-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyeon-Woo Jang ,  Dong-Wan Kim ,  Keonhee Park ,  Dong-sik Park ,  Joonsuk Park ,  Jihoon Chang

IPC: H01L27/108

Abstract: Disclosed are semiconductor memory devices and their fabrication methods. The method comprises providing a substrate including a cell array region and a boundary region, forming a device isolation layer that defines active sections on an upper portion of the substrate on the cell array region, forming an intermediate layer on the substrate on the boundary region, forming on the substrate an electrode layer that covers the intermediate layer on the boundary region, forming a capping layer on the electrode layer, forming an additional capping pattern including providing a first step difference to the capping layer on the boundary region, and allowing the additional capping pattern, the capping layer, and the electrode layer to proceed an etching process to form bit lines that run across the active sections. During the etching process, the electrode layer is simultaneously exposed on the cell array region and the boundary region.

公开(公告)号：US11133253B2

公开(公告)日：2021-09-28

申请号：US16885438

申请日：2020-05-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Juik Lee ,  Joongwon Shin ,  Jihoon Chang ,  Junghoon Han ,  Junwoo Lee

IPC: H01L23/528 ,  H01L23/532 ,  H01L25/065 ,  H01L25/18 ,  H01L23/522 ,  H01L27/108 ,  H01L23/00 ,  H01L23/48

Abstract: A semiconductor device includes a plurality of middle interconnections and a plurality of middle plugs, which are disposed in an interlayer insulating layer and on a substrate. An upper insulating layer is disposed on the interlayer insulating layer. A first upper plug, a first upper interconnection, a second upper plug, and a second upper interconnection are disposed in the upper insulating layer. Each of the plurality of middle interconnections has a first thickness. The first upper interconnection has a second thickness that is greater than the first thickness. The second upper interconnection has a third thickness that is greater than the first thickness. The third thickness is twice to 100 times the first thickness. The second upper interconnection includes a material different from the second upper plug.