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公开(公告)号：US09101077B2
公开(公告)日：2015-08-04
申请号：US13722282
申请日：2012-12-20
Applicant: STMicroelectronics (Grenoble 2) SAS
Inventor： Jean-Michel Riviere , Karine Saxod
CPC classification number: H05K7/20 , G01F1/20 , H01L23/34 , H01L23/4334 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2924/15311 , H05K1/0209 , H05K3/284 , H05K7/20436 , H05K2201/10378 , H05K2201/10734 , H05K2203/1316 , H01L2924/00
Abstract: An electronic component package includes a support and heat conductor. The heat conductor has a protuberance and the support has a socket arranged to be able to receive the protuberance so that the movement of heat conductor relative to the support during the assembly process is reduced.
Abstract translation: 电子部件封装包括支撑件和导热体。 热导体具有突起，并且支撑件具有布置成能够容纳突起的插座，使得在组装过程期间热导体相对于支撑件的移动减小。
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12.发明申请公开(公告)号：US20150036309A1
公开(公告)日：2015-02-05
申请号：US14444583
申请日：2014-07-28
Applicant: STMicroelectronics (Grenoble 2) SAS
Inventor： Jean-Michel Riviere , Karine Saxod
CPC classification number: H05K1/0271 , H01L23/49844 , H01L23/562 , H01L24/16 , H01L2224/131 , H01L2224/16111 , H01L2224/16237 , H05K1/181 , H05K3/28 , H05K3/30 , H05K2201/0275 , H05K2201/09909 , H05K2201/10007 , H05K2201/2009 , Y10T29/4913 , H01L2924/014
Abstract: A substrate board includes an electrical connection network on a face thereof. An integrated-circuit chip is mounted to the face of the substrate board in electrical contact with the electrical connection network. A local reinforcing or balancing layer made of a non-metallic material is mounted to the face of the substrate board in at least one local zone free of the face which is free of metal portions of the electrical connection network.
Abstract translation: 基板包括在其表面上的电连接网络。 集成电路芯片安装到与电连接网络电接触的基板的表面。 由非金属材料制成的局部增强或平衡层在至少一个不具有电连接网络的金属部分的表面的局部区域中安装到基板的表面上。
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公开(公告)号：US12272922B2
公开(公告)日：2025-04-08
申请号：US18408149
申请日：2024-01-09
Applicant: STMICROELECTRONICS (GRENOBLE 2) SAS
Inventor： Fabien Quercia , Jean-Michel Riviere
IPC: H01S5/02345 , H01L23/00
Abstract: Electronic device comprising a support substrate having a mounting face and an electronic chip having a rear face bonded on the mounting face by a volume of adhesive, wherein the support substrate comprises a plurality of wedging elements projecting from the mounting face so as to hold the chip bearing on contact areas of the wedging elements in a position substantially parallel to the mounting face of the support substrate.
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公开(公告)号：US11908968B2
公开(公告)日：2024-02-20
申请号：US17838929
申请日：2022-06-13
Applicant: STMicroelectronics (Grenoble 2) SAS
Inventor： Romain Coffy , Remi Brechignac , Jean-Michel Riviere
CPC classification number: H01L31/16 , H01L24/73 , H01L2224/73265
Abstract: An optoelectronic device includes an emitter of light rays and a receiver of light rays. The emitter is encapsulated in a transparent block. An opaque conductive layer is applied to a top surface and a side surface of the transparent block. The receiver is mounted to the opaque conductive layer at the top surface. An electrical connection is made between the receiver and the opaque conductive layer. A conductive strip is also mounted to the side surface of the transparent block and isolated from the opaque conductive layer. A further electrical connection is made between the receiver and the conductive strip.
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公开(公告)号：US11740416B2
公开(公告)日：2023-08-29
申请号：US17546314
申请日：2021-12-09
Applicant: STMicroelectronics (Grenoble 2) SAS
Inventor： Romain Coffy , Jean-Michel Riviere
IPC: G02B6/42
CPC classification number: G02B6/4239 , G02B6/4213 , G02B6/4274
Abstract: An optoelectronic element is located in a package. The package includes a first optical block and a second optical block that are attached to each other by a bonding layer. One of the first and second optical blocks is attached to lateral walls of the package by glue. The material of the bonding layer is configured to induce less stress to the first and second optical blocks than the glue.
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Patent Agency Ranking
公开(公告)号：US11546059B2
公开(公告)日：2023-01-03
申请号：US17169010
申请日：2021-02-05
Applicant: STMICROELECTRONICS (GRENOBLE 2) SAS
Inventor： Jean-Michel Riviere , Romain Coffy , Karine Saxod
Abstract: A cover for an electronic circuit package, including: a body having an opening extending therethrough; a first element located in the opening and having a surface continuing planar or rounded shapes of a surface of the cover; and a second element of connection of the first element to the body.
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公开(公告)号：US11038595B2
公开(公告)日：2021-06-15
申请号：US16409723
申请日：2019-05-10
Applicant: STMICROELECTRONICS (GRENOBLE 2) SAS
Inventor： Alexandre Coullomb , Romain Coffy , Jean-Michel Riviere
IPC: H04B10/40 , H01L31/0203 , H01L25/04 , H04B10/50 , H04B10/69
Abstract: An optoelectronic device includes a substrate and a first optoelectronic chip flush with a surface of the substrate. The device includes a cover that covers the substrate and the first optoelectronic chip. The cover comprises a cavity above a first optical transduction region of the first optoelectronic chip. The device also includes a second optoelectronic chip having a second optical transduction region spaced apart from the first optical transduction region and the cavity continues above the second optical transduction region.
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公开(公告)号：US10777710B2
公开(公告)日：2020-09-15
申请号：US16432561
申请日：2019-06-05
Applicant: STMICROELECTRONICS (GRENOBLE 2) SAS
Inventor： Romain Coffy , Jean-Michel Riviere
Abstract: A housing for a light source mounted on a substrate, the housing comprising: a barrel having first and second conducting columns; and a diffuser having a through-hole or partial hole filled with a conductive plug, the conductive plug electrically bridging a gap in an electrical connection between the first and second conducting columns.
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公开(公告)号：US10738985B2
公开(公告)日：2020-08-11
申请号：US16439308
申请日：2019-06-12
Applicant: STMICROELECTRONICS (RESEARCH & DEVELOPMENT) LIMITED , STMICROELECTRONICS (GRENOBLE 2) SAS
Inventor： Joseph Hannan , Stuart Robertson , Romain Coffy , Jean-Michel Riviere
Abstract: The disclosure concerns a housing for a light source mounted on a substrate, the housing comprising: a molded body having an opening permitting the passage of a light beam generated by the light source; one or more surfaces for receiving a diffuser; and first and second conducting pins traversing the molded body.
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20.发明授权公开(公告)号：US09420685B2
公开(公告)日：2016-08-16
申请号：US14444583
申请日：2014-07-28
Applicant: STMicroelectronics (Grenoble 2) SAS
Inventor： Jean-Michel Riviere , Karine Saxod
CPC classification number: H05K1/0271 , H01L23/49844 , H01L23/562 , H01L24/16 , H01L2224/131 , H01L2224/16111 , H01L2224/16237 , H05K1/181 , H05K3/28 , H05K3/30 , H05K2201/0275 , H05K2201/09909 , H05K2201/10007 , H05K2201/2009 , Y10T29/4913 , H01L2924/014
Abstract: A substrate board includes an electrical connection network on a face thereof. An integrated-circuit chip is mounted to the face of the substrate board in electrical contact with the electrical connection network. A local reinforcing or balancing layer made of a non-metallic material is mounted to the face of the substrate board in at least one local zone free of the face which is free of metal portions of the electrical connection network.
Abstract translation: 基板包括在其表面上的电连接网络。 集成电路芯片安装到与电连接网络电接触的基板的表面。 由非金属材料制成的局部增强或平衡层在至少一个不具有电连接网络的金属部分的表面的局部区域中安装到基板的表面上。
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