公开(公告)号：US20220231954A1

公开(公告)日：2022-07-21

申请号：US17711706

申请日：2022-04-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Wonbo LEE ,  Youngwook KIM ,  Youngki HONG

IPC: H04L47/20 ,  H04L47/24

Abstract: A device and method for improving data transmission and reception throughput in an electronic device are provided. The electronic device includes a communication circuit for communication with a designated network, a processor including a multi-core, and a memory. The memory may store instructions that, when executed, cause the processor to detect a new data flow on the basis of the communication circuit, identify the type of the network connected via the communication circuit, identify, on the basis of a policy related to the identified network, a boosting start condition for the new data flow, and when boosting for the new data flow starts, set the frequency of a core, which processes a packet related to the new data flow, to a designated frequency.

公开(公告)号：US20210314391A1

公开(公告)日：2021-10-07

申请号：US17220734

申请日：2021-04-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Wonbo LEE ,  Jinhyoung KIM ,  Sangcheol LEE ,  Youngwook KIM ,  Taewan KIM ,  Hongshik KIM ,  Ansik SHIN

IPC: H04L29/08 ,  H04W48/18 ,  H04W72/10

Abstract: An electronic device includes a memory, a communication circuit, and a processor. The memory is configured to store an application and an edge enabler client. The communication circuit is configured to communicate with at least one of a first server, a second server, or a third server. The application is configured to perform one or more functions corresponding to the third server. The processor is configured to receive access information for accessing the second server from the first server. The processor is configured to receive access information of the third server from each of a plurality of second servers. The processor is configured to check at least one or more third servers capable of providing a service The processor is configured to select the third server to request access among a plurality of third servers. The processor is configured to perform the service using the selected third server.

公开(公告)号：US20180336067A1

公开(公告)日：2018-11-22

申请号：US15982633

申请日：2018-05-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Wonbo LEE ,  Young Ki HONG ,  Youngwook KIM ,  Jung-Hwan LIM

IPC: G06F9/50

Abstract: A communication technique for combining a fifth generation (5G) communication system that supports higher data transmission rates after fourth generation (4G) systems with Internet of things (IoT) technology and to the system therefor are provided. The disclosure relates to a multiple cores-based data processing method and apparatus, the method including determining whether a condition for a first packet flow among one or more packet flows for data communication is met, if the condition is met, selecting cores to distribute packets of the first packet flow from among the multiple cores, allocating packets received through the first packet flow to the selected cores, and operating the selected cores in parallel to process the packets allocated from the first packet flow.

公开(公告)号：US20250094113A1

公开(公告)日：2025-03-20

申请号：US18925711

申请日：2024-10-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Nakwon CHOI ,  Sunyoung KIM ,  Youngwook KIM ,  Sooyeoun YOON ,  Dongho LEE ,  Yongjoo LEE ,  Bumho CHUN ,  Jaewon JUNG ,  Suan CHOI ,  Saerom HONG

IPC: G06F3/14

Abstract: A display apparatus includes a memory storing first apparatus information corresponding to the display apparatus and instructions, a sensor, a display, a communication interface, and at least one processor operatively connected to the memory and configured to execute the instructions to, based on detecting connection with an external display apparatus through the sensor, receive second apparatus information corresponding to the external display apparatus from the external display apparatus, generate integrated apparatus information based on the first apparatus information and the second apparatus information, and control the communication interface to transmit the integrated apparatus information to a source apparatus.

公开(公告)号：US20240317492A1

公开(公告)日：2024-09-26

申请号：US18612401

申请日：2024-03-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Junhyuk CHANG ,  Seunggyu KANG ,  Hyunjae KANG ,  Sangmin KIM ,  Youngwook KIM ,  Jaesung BYUN ,  Yongjun AHN ,  Sangkyung LEE ,  Hyunwoo LEE ,  Jeonghun LIM

IPC: B65G1/04

CPC classification number: B65G1/0457 ,  B65G2201/0297

Abstract: A distribution storage system including a wall protruding from a floor in a vertical direction and extending in a first horizontal direction, a plurality of shelves positioned adjacent to a side of the wall and having a space in which carriers are accommodated, an interface port positioned adjacent to a lowermost shelf among the plurality of shelves, a first rail positioned near a ceiling to face the interface port in the vertical direction and extending in the first horizontal direction, a crane moving along the first rail, and a transfer robot coupled to the crane, driven in the vertical direction, and gripping and releasing the carriers, wherein the plurality of shelves are all arranged on one plane.

公开(公告)号：US20240114662A1

公开(公告)日：2024-04-04

申请号：US18529528

申请日：2023-12-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Youngwook KIM ,  Sungwoo LIM ,  Chankyu LIM ,  Jonggeun YOON ,  Jiwoo LEE

IPC: H05K7/20 ,  C08K7/06 ,  C09K5/14

CPC classification number: H05K7/2039 ,  C08K7/06 ,  C09K5/14 ,  C08K2201/001

Abstract: An electronic device is provided. The electronic device includes a heat generation source including a heat dissipation surface dissipating heat, a support member disposed on a lateral side of the heat dissipation surface and surrounding at least a part of the heat generation source, a heat dissipation member facing the heat dissipation surface of the heat generation source and disposed so as to cover an area in which the support member is disposed, a thermal interface material disposed between the upper part of the heat dissipation surface of a heat generation surface and the lower surface of the heat generation source, and supported by the support member, and an adhesive member disposed in the area in which the thermal interface material is supported by the support member between the thermal interface material and the heat dissipation member, and for coupling the thermal interface material and the heat dissipation member.

公开(公告)号：US20240031297A1

公开(公告)日：2024-01-25

申请号：US18475699

申请日：2023-09-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Youngwook KIM ,  Wonbo LEE ,  Youngki HONG ,  Sungin KIM ,  Hongshik KIM ,  Sangsoo LEE

IPC: H04L47/24 ,  H04L47/12 ,  H04L49/9005

CPC classification number: H04L47/24 ,  H04L47/12 ,  H04L49/9005

Abstract: An electronic device is provided. The electronic device includes an application processor comprising a plurality of cores, and a communication processor electrically connected to the application processor. The application processor may configure at least one session associated with respective applications based on quality of service (QoS) so as to correspond to at least one core from among the plurality of cores, transmit, to the communication processor, information corresponding to a first core configured for a first session from among the at least one session, receive a data packet of the first session from the communication processor, and process the received data packet of the first session by means of the first core configured for the first session, based on the information corresponding to the first core.

公开(公告)号：US20230326777A1

公开(公告)日：2023-10-12

申请号：US17972187

申请日：2022-10-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Youngwook KIM ,  Hyunjae KANG ,  Sangmin KIM ,  Chul-Jun PARK ,  Yong-Jun AHN ,  Sangkyung LEE ,  Hyunwoo LEE ,  Junhyuk CHANG

IPC: H01L21/677 ,  B65G47/91

CPC classification number: H01L21/67733 ,  H01L21/67724 ,  H01L21/67727 ,  H01L21/67712 ,  B65G47/91

Abstract: Disclosed are semiconductor carrier storage systems, semiconductor fabrication systems including the same, and/or semiconductor fabrication methods using the same. The semiconductor carrier storage system comprises storage ports each of which accommodates a semiconductor carrier, a shuttle rail that extends in a horizontal direction on a side of the storage ports, an internal carrier shuttle that moves along the shuttle rail and transfers a semiconductor carrier to each of the storage ports, and an upper transport that receives the semiconductor carrier from an overhead hoist transport (OHT). The internal carrier shuttle includes a shuttle body coupled to the shuttle rail, a transfer wheel that connects the shuttle body to the shuttle rail, a gripper that holds the semiconductor carrier, and a hoist that vertically extends between the shuttle body and the gripper and drives the gripper to vertically move.

公开(公告)号：US20230300107A1

公开(公告)日：2023-09-21

申请号：US18320688

申请日：2023-05-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jinhyoung KIM ,  Wonbo LEE ,  Youngwook KIM ,  Hongshik KIM ,  Ansik SHIN ,  Sangcheol LEE

IPC: H04L61/4511 ,  H04L61/58

CPC classification number: H04L61/4511 ,  H04L61/58

Abstract: An electronic device and an operation method of an electronic device are provided. The electronic device includes a memory for storing multiple applications including a first application, an edge enabler client (EPC), and multiple domain name system (DNS) caches allocated to each of at least some applications of the multiple applications and/or mapping data obtained by mapping identification information of the at least some applications to the multiple DNS caches; a communication circuit used for a communication connection of an edge service provision server and/or an edge network management server through a base station; and a processor configured to receive, from the first application, an access request for the edge service provision server that the first application desires to access; identify whether a DNS cache corresponding to the first application exits in the multiple DNS caches based on the mapping data and identification information of the first application, acquire an internet protocol (IP) address corresponding to a domain address included in the access request in case that the DNS cache corresponding to the first application exists, and access the edge service provision server based on the acquired IP address and perform the service.

公开(公告)号：US20230072048A1

公开(公告)日：2023-03-09

申请号：US17986315

申请日：2022-11-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Youngwook KIM ,  Wonbo LEE

IPC: H04L47/41 ,  H04L47/30 ,  H04L47/56 ,  H04L61/2503

Abstract: An electronic device is provided. The electronic device includes a network connection device, at least one processor, and a memory operably connected to the at least one processor, wherein the memory store instructions which are configured to, when executed, control the electronic device to receive a data packet from the network connection device, identify an Internet protocol (IP) type of a server, based on header information of the received data packet, identify information related to packet mergence set according to the identified IP type of the server and an IP type of the electronic device, and merge the data packets received from the network connection device or flush the data packets as a network stack, based on the identified information related to the packet mergence.