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公开(公告)号：US20230363082A1
公开(公告)日：2023-11-09
申请号：US18348003
申请日：2023-07-06
Applicant: Samsung Electronics Co., Ltd.
Inventor： Byeongkeol KIM , Eunseok HONG , Youngsun LEE
CPC classification number: H05K1/0219 , H05K1/028 , H05K1/118 , H05K3/28 , H05K3/429 , H04M1/0277 , H04B1/0053 , H05K2201/09636
Abstract: An electronic device is provided. The electronic device includes a housing including a first housing part and a second housing part movable with respect to the first housing part, and a circuit board positioned in the housing and including a first part bent in response to movement of the second housing part and a second part extending from the first part and more rigid than the first part, wherein the circuit board may comprise a flexible non-conductive film extending from the first part to the second part, a laminate structure including at least one conductive pattern positioned on the flexible non-conductive film, a coverlay extending from the first part to the second part, overlapping the laminate structure, and including an electromagnetic shielding material, and at least one conductive via positioned at the second part and electrically connecting the at least one conductive pattern and the coverlay.
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公开(公告)号：US20220174138A1
公开(公告)日：2022-06-02
申请号：US17671899
申请日：2022-02-15
Applicant: Samsung Electronics Co., Ltd.
Inventor： Youngsun LEE , Eunseok HONG
Abstract: According to certain embodiments, an electronic device comprises:a housing having an innerspace; a slide body slidably connected to the housing, the slide-body including an opening and at least one magnetic force generating member disposed in the opening; and a camera module assembly connected rotatably to the opening in the slide body, the camera module assembly including a module housing and at least one camera module disposed in the module housing, wherein the camera module assembly includes at least one magnetic force reactive member disposed to react to a magnetic force of the at least one magnetic force generating member, and wherein the at least one magnetic force reactive member is disposed at a position affected by the magnetic force of the at least one magnetic force generating member when the slide body slides out from the housing or slides in into the housing.
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13.发明申请公开(公告)号：US20210168934A1
公开(公告)日：2021-06-03
申请号：US17265888
申请日：2019-08-01
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Youngsun LEE , Eunseok HONG , Byeongkeol KIM , Jongmin JEON
Abstract: Disclosed are various embodiments related to a circuit board included in an electronic device. According to one embodiment, the circuit board may comprise: a core layer including an upper surface and a lower surface and formed as a substrate made of a prepreg material; a first flexible copper clad laminate including a plurality of conductive layers and laminated on the upper surface; at least one first substrate layer laminated above the first flexible copper clad laminate and including a conductive layer formed on the substrate made of a prepreg material; a second flexible copper clad laminate including a plurality of conductive layers and laminated on the lower surface; and at least one second substrate layer laminated under the second flexible copper clad laminate and including a conductive layer formed on the substrate made of a prepreg material. Various other embodiments are also possible.
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公开(公告)号：US20250063676A1
公开(公告)日：2025-02-20
申请号：US18937936
申请日：2024-11-05
Applicant: Samsung Electronics Co., Ltd.
Inventor： Youngsun LEE , Byeongkeol KIM , Sungjin KIM , Jaeyeon RA , Yongjae SONG , Jongmin JEON
Abstract: An electronic device comprises: a first housing; a second housing; a hinge structure comprising a hinge rotatably connecting the first housing with the second housing; and a substrate including a flexible portion, a rigid portion, and a stepped portion arranged at a boundary between the flexible portion and the rigid portion. The substrate comprises: a first conductive layer arranged in the flexible portion and the rigid portion; a first coating layer arranged on a portion of the first conductive layer corresponding to the rigid portion; a second conductive layer arranged on the first coating layer in the rigid portion; and a second coating layer arranged on the second conductive layer. A portion of the boundary of the first coating layer is aligned in the stepped portion.
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Patent Agency Ranking
公开(公告)号：US20230189463A1
公开(公告)日：2023-06-15
申请号：US18073127
申请日：2022-12-01
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jeong WOO , Youngsun LEE
CPC classification number: H05K5/0247 , H05K5/06 , H05K5/0226
Abstract: An electronic device is provided. The electronic device includes a display including a first area and a second area, a first housing supporting the first area and forming a first space on a rear surface of the first area, a second housing supporting the second area and forming a second space on a rear surface of the second area, a hinge structure connecting the first housing and the second housing to be foldable around a folding axis, a first bracket connecting the first housing and the hinge structure and having a first opening penetrating through a surface thereof, a second bracket connecting the second housing and the hinge structure and having a second opening penetrating through a surface thereof, and an FPCB extending from the first space to the second space across the folding axis in an extension direction.
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公开(公告)号：US20230119170A1
公开(公告)日：2023-04-20
申请号：US18084994
申请日：2022-12-20
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Youngsun LEE , Dohyeon KIM , Byeongkeol KIM , Jinsu KIM , Seokjoon PARK , Jungje BANG , Hoyeon SEO , Jongbum LEE , Jongmin JEON
Abstract: An electronic device including a thermosetting bonding sheet may include: a base substrate including a base substrate body and a plurality of base pads disposed on the base substrate body, a connection substrate including a connection substrate body facing the base substrate body, a plurality of connection pads disposed on the connection substrate body and including a pad hole, and a plurality of connection lines disposed on the connection substrate body and connected to the plurality of connection pads, a solder, at least a portion of which is inserted into the pad hole, disposed on the base pad and configured to electrically connect the base pad to the connection pad, and a thermosetting bonding sheet provided between the base substrate body and the connection substrate body, bonded to the base substrate body and the connection substrate body, and enclosing the solder
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公开(公告)号：US20220346224A1
公开(公告)日：2022-10-27
申请号：US17861630
申请日：2022-07-11
Applicant: Samsung Electronics Co., Ltd.
Inventor： Youngsun LEE , Jongmin JEON , Hyunsuk KIM , Kyuwon CHOI
Abstract: A flexible printed circuit board (FPCB) of an electronic device including a flexible display having a shape deformed by a hinge structure is provided. The FPCB of an electronic device includes a plurality of bending portions and a plurality of non-bending portions. The plurality of bending portions is bent according to a deformation of a shape of the electronic device. The plurality of non-bending portions are positioned on a periphery of the plurality of bending portions. The plurality of bending portions and the plurality of non-bending portions are formed to have different thicknesses.
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公开(公告)号：US20220151073A1
公开(公告)日：2022-05-12
申请号：US17545374
申请日：2021-12-08
Applicant: Samsung Electronics Co., Ltd.
Inventor： Youngsun LEE , Sungwon PARK , Sunghyup LEE , Byeonguk MIN
Abstract: A printed circuit board and an electronic device including the printed circuit board are provided. The electronic device includes a housing, and a printed circuit board located in an inner space of the housing, wherein the printed circuit board includes a component disposition area in which at least one component is disposed, a pre-forming area in which a plastic deformation material is laminated as a polymer material for inducing plastic deformation on a part of the printed circuit board, and a flexible area having flexible characteristics and on which the plastic deformation material is not laminated.
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公开(公告)号：US20210329784A1
公开(公告)日：2021-10-21
申请号：US17267651
申请日：2019-08-09
Applicant: Samsung Electronics Co., Ltd. , SI FLEX CO., LTD.
Inventor： Sungwon PARK , Junghyub KIM , Hwanyoul JEONG , Seungyup LEE , Youngsun LEE , Hesuk JUNG , Eunseok HONG
Abstract: Various embodiments disclosed in the disclosure relate to a flexible connection member and an electronic device comprising same, the flexible connection member having an RF line for signal transmission formed therein, wherein an impedance of the RF line is prevented from being changed even when a flexible printed circuit board is bent. According to one embodiment, a connection member may be provided, the connection member comprising, a first conductive layer including a first logic line, and a second conductive layer in contact with the first conductive layer and including a bonding sheet layer, wherein the second conductive layer includes, a second logic line formed on part of the second conductive layer, and an RF line formed on other part of the second conductive layer, the bonding sheet layer includes, the second conductive layer adhered over the second logic line and the RF line, a first insulating layer formed between the first conductive layer and the second conductive layer, and pins formed on one side of the first conductive layer and the second conductive layer and configured to be electrically connected to connection pins of an external module, and the second conductive layer includes at least one via formed between the second logic line and the RF line so as to energize between the layers included in the second conductive layer. Such a flexible connection member may vary according to embodiments, and an electronic device comprising the flexible connection member may be provided according to various other embodiments.
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