公开(公告)号：US20220151073A1

公开(公告)日：2022-05-12

申请号：US17545374

申请日：2021-12-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Youngsun LEE ,  Sungwon PARK ,  Sunghyup LEE ,  Byeonguk MIN

IPC: H05K1/14 ,  H05K1/11 ,  H05K1/03

Abstract: A printed circuit board and an electronic device including the printed circuit board are provided. The electronic device includes a housing, and a printed circuit board located in an inner space of the housing, wherein the printed circuit board includes a component disposition area in which at least one component is disposed, a pre-forming area in which a plastic deformation material is laminated as a polymer material for inducing plastic deformation on a part of the printed circuit board, and a flexible area having flexible characteristics and on which the plastic deformation material is not laminated.