知搜-全球专利检索

  1. Login
  2. Sign Up

Search Results

25 records (took 0.022 seconds)

    CAMERA MODULE
    13.
    发明申请
    CAMERA MODULE 审中-公开

    公开(公告)号：US20160353029A1

    公开(公告)日：2016-12-01

    申请号：US15232995

    申请日：2016-08-10

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Young-jae Hwang ,  Kwang-seok Byon ,  Seung-hwan Lee ,  Bong-su Jung

    IPC: H04N5/232 ,  G02B7/09 ,  H04N5/225

    CPC classification number: H04N5/23287 ,  G02B7/09 ,  H04N5/2257

    Abstract: A camera module includes a lens barrel including at least one lens group; a moving frame that includes the lens barrel and moves in an optical axis direction and in a first direction and a second direction that are perpendicular to the optical axis direction; a fixed frame that movably supports the moving frame and provides the moving frame with a driving force in the optical axis direction, a driving force in the first direction, and a driving force in the second direction; and a base that fixes the fixed frame and includes an image sensor that is spaced apart from the at least one lens group in the optical axis direction.

    Method for manufacturing light emitting device package
    14.
    发明授权
    Method for manufacturing light emitting device package 有权
    制造发光器件封装的方法

    公开(公告)号：US09391233B2

    公开(公告)日：2016-07-12

    申请号：US14163587

    申请日：2014-01-24

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Myong-soo Cho ,  Myeong-rak Son ,  Young-chul Shin ,  Seung-hwan Lee

    IPC: H01L21/00 ,  H01L33/00

    CPC classification number: H01L33/0079 ,  H01L33/0095 ,  H01L2933/0033

    Abstract: A method for manufacturing a light emitting device package is provided. In the method, a growth substrate including a plurality of light emitting devices disposed on a top surface of the growth substrate is prepared. A first package substrate having a bonding pattern corresponding to a portion of the plurality of light emitting devices is prepared, and the bonding pattern is disposed on a top surface of the first package substrate. The portion of the plurality of light emitting devices and the bonding pattern are bonded by disposing the top surface of the growth substrate to face the top surface of the first package substrate. The portion of the plurality of light emitting devices is separated from the growth substrate. The portion of the plurality of light emitting devices joined to the bonding pattern is packaged.

    Abstract translation: 提供一种制造发光器件封装的方法。 在该方法中，制备包括设置在生长衬底的顶表面上的多个发光器件的生长衬底。 准备具有与多个发光元件的一部分对应的接合图案的第一封装基板，并且接合图案设置在第一封装基板的顶面上。 通过将生长衬底的顶表面设置为面对第一封装衬底的顶表面，多个发光器件的部分和接合图案被接合。 多个发光器件的部分与生长衬底分离。 连接到接合图案的多个发光器件的部分被封装。

    Mobile X-ray imaging apparatus
    16.
    发明授权
    Mobile X-ray imaging apparatus 有权

    公开(公告)号：US10806414B2

    公开(公告)日：2020-10-20

    申请号：US15706557

    申请日：2017-09-15

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Jae-won Nam ,  Seung-hwan Lee ,  Jung-min Kim ,  Ku-il Jang

    IPC: A61B6/00 ,  B60B33/04

    Abstract: A mobile X-ray imaging apparatus includes a main body performing X-ray imaging by operating an X-ray source, a movable wheel provided in a lower end of the main body and capable of moving the main body, and a support portion comprising a wheel support plate supporting the movable wheel capable of rotating, a frame connected to the main body and supporting the wheel support plate capable of moving, an elastic member disposed between the frame and the wheel support plate and applying an elastic force to the wheel support plate in a direction in which the movable wheel faces a ground, and a stopper restricting a movement of the wheel support plate, wherein the elastic force of the elastic member is smaller than a minimum load applied to the movable wheel.

Patent Agency Ranking