公开(公告)号：US12298676B2

公开(公告)日：2025-05-13

申请号：US18322161

申请日：2023-05-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Injae Lee ,  Sungyong Bae ,  Daegeun Yoon ,  Inho Choi ,  Sunghyup Kim ,  Euishin Kim ,  Jeonggil Kim ,  Yebin Nam ,  Dongjin Lee ,  Jonggu Lee ,  Dohyun Jung ,  Dongsik Jeong

IPC: G03F7/00 ,  H01L21/68

Abstract: A substrate processing apparatus includes a table in an exposure chamber that is configured to perform an exposure process on a semiconductor substrate, a guiding device including a first horizontal driving body slidably movable in a first horizontal direction and a guide rail on the first horizontal driving body and having a trench extending in a second horizontal direction, a positioning device connected to the guiding device, the positioning device including a slider, a second horizontal driving body and a substrate stage, the slider configured to slidably move in the second horizontal direction along the trench, the second horizontal driving body connected or fixed to the slider, the substrate stage on the second horizontal driving body and configured to support the semiconductor substrate, and a blocking member between the guide rail and the substrate stage to block an inflow of foreign substances onto the substrate stage.

公开(公告)号：US20240421014A1

公开(公告)日：2024-12-19

申请号：US18618160

申请日：2024-03-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Injae Lee

IPC: H01L23/31 ,  H01L21/56 ,  H01L23/00 ,  H01L23/538 ,  H01L25/00 ,  H01L25/065

Abstract: A semiconductor package includes a package substrate extending in a first direction, the package substrate having at least one first opening in a chip mounting region of the package substrate; a first semiconductor chip mounted in the chip mounting region on an upper surface of the package substrate; a plurality of second semiconductor chips sequentially stacked on the upper surface of the package substrate and spaced apart from the first semiconductor chip in the first direction; a sealant covering the first semiconductor chip and the plurality of second semiconductor chips on the package substrate, the sealant filling a gap between the first semiconductor chip and the package substrate and filling an interior of the at least one first opening of the package substrate; and a taping film attached on a lower surface of the package substrate to cover at least a portion of the sealant exposed in the first opening.

公开(公告)号：US20240215140A1

公开(公告)日：2024-06-27

申请号：US18520472

申请日：2023-11-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Daegeun Yoon ,  Sunghyup Kim ,  Seungpyo Hong ,  Injae Lee

IPC: H05G2/00

CPC classification number: H05G2/008

Abstract: A source vessel for extreme ultraviolet (EUV) includes a body that includes an outlet for discharging tin debris disposed in a central portion and an intermediate focus (IF) disposed in an upper end portion, and a reflector disposed in a lower end of the body and that includes a through-hole through which laser light passes. The body includes an IF cap portion disposed on a lower portion of the intermediate focus and that includes a heater disposed on an outer surface thereof, and an IF scanner portion disposed on an upper portion of the intermediate focus and that includes a cooling pipe disposed on an external surface thereof. An inner surface of the IF cap portion includes a flow groove through which tin residue flows, and the source vessel further includes a collection container connected to the flow groove.

公开(公告)号：US11711883B2

公开(公告)日：2023-07-25

申请号：US17393474

申请日：2021-08-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Minseok Choi ,  Injae Lee ,  Inho Choi ,  Sungyeol Kim ,  Sunghyup Kim ,  Jeonggil Kim ,  Jongbin Park

IPC: H05G2/00 ,  G03F7/20 ,  G03F7/00

CPC classification number: H05G2/006 ,  G03F7/70033 ,  G03F7/7055 ,  H05G2/008

Abstract: A droplet accelerating assembly includes an acceleration chamber extending in a first direction parallel to an ejection direction of the droplet, the acceleration chamber having a first side connected to the droplet generator, a second side opposite the first side in the first direction, the second side including a discharge hole, and a fluid flow path, a pressure controller connected to the fluid flow path of the acceleration chamber, the pressure controller being configured to adjust an internal pressure of the acceleration chamber, an electrifier in the acceleration chamber, the electrifier being configured to electrify the droplet ejected by the droplet generator into an electrified droplet, and an accelerator in the acceleration chamber, the accelerator being configured to accelerate the electrified droplet.

公开(公告)号：US11415891B2

公开(公告)日：2022-08-16

申请号：US17221388

申请日：2021-04-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sunghyup Kim ,  Myeongjun Gil ,  Yebin Nam ,  Injae Lee

IPC: G03F7/20 ,  H05G2/00

Abstract: An extreme ultraviolet light source system includes a chamber configured to maintain a pressure of an inner space thereof at a first pressure, a droplet supply unit disposed in the chamber and configured to discharge a droplet on a first path, a light source configured to emit a light for generating plasma by irradiating a laser light to the droplet at a focal point on the first path, and a suction unit disposed on the first path so as to face the droplet supply unit in the chamber and configured to suction debris of the droplet irradiated with the laser light at a second pressure, lower than the first pressure, wherein the suction unit includes a nozzle protruding from a side wall of the chamber toward the focal point, and an end of the nozzle is closer to the focal point than it is to the side wall of the chamber.

公开(公告)号：US20220104336A1

公开(公告)日：2022-03-31

申请号：US17325327

申请日：2021-05-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： SUNGHYUP KIM ,  Myeongjun Gil ,  Yebin Nam ,  Sanghoon Lee ,  Injae Lee

IPC: H05G2/00 ,  G03F7/20

Abstract: Extreme ultraviolet light source systems may include a chamber including a condensing mirror and having an intermediate focus, by which extreme ultraviolet light reflected from the condensing mirror is emitted along a first optical path, a blocking plate that may be on the chamber so as to intersect the first optical path and may include an opening through which the extreme ultraviolet light is emitted, a transparent cover on the blocking plate so as to cover the opening, a nozzle that may be between the chamber and the blocking plate so that an end portion faces the intermediate focus and may spray a first gas in a direction intersecting the first optical path, and an exhaust pipe between the chamber and the blocking plate so as to face the end portion of the nozzle.