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    Planar waveguides with enhanced support and/or cooling features for high-power laser systems
    14.
    发明授权
    Planar waveguides with enhanced support and/or cooling features for high-power laser systems 有权

    公开(公告)号：US10069270B2

    公开(公告)日：2018-09-04

    申请号：US15041909

    申请日：2016-02-11

    Applicant: Raytheon Company

    Inventor： Stephen H. McGanty ,  David M. Filgas ,  Christopher R. Koontz

    IPC: H01S3/06 ,  H01S3/04 ,  G02B6/10 ,  G02B6/12 ,  H01S3/063 ,  H01S3/042 ,  H01S3/13 ,  H01S3/131 ,  H01S3/23

    Abstract: This disclosure provides planar waveguides with enhanced support and/or cooling. One or more endcaps could be disposed between coating/cladding layers at one or more ends of a core region, where the core region is doped with at least one active ion species and each endcap is not doped with any active ion species that creates substantial absorption at pump and signal wavelengths. A core region could include at least one crystal or crystalline material, and at least one cladding layer could include at least one glass. Different types of coolers could be disposed on or adjacent to different coating/cladding layers. Side claddings could be disposed on opposite sides of a planar waveguide, where the opposite sides represent longer sides of the waveguide. Endcaps and one or more coolers could be sealed to a housing, and coolant can flow through a substantially linear passageway along a length of the waveguide. One side of a planar waveguide could be uncooled.

    PLANAR WAVEGUIDES WITH ENHANCED SUPPORT AND/OR COOLING FEATURES FOR HIGH-POWER LASER SYSTEMS
    15.
    发明申请
    PLANAR WAVEGUIDES WITH ENHANCED SUPPORT AND/OR COOLING FEATURES FOR HIGH-POWER LASER SYSTEMS 审中-公开

    公开(公告)号：US20180090903A1

    公开(公告)日：2018-03-29

    申请号：US15825677

    申请日：2017-11-29

    Applicant: Raytheon Company

    Inventor： Stephen H. McGanty ,  David M. Filgas ,  Christopher R. Koontz

    IPC: H01S3/04 ,  H01S3/06 ,  H01S3/042 ,  H01S3/063

    Abstract: This disclosure provides planar waveguides with enhanced support and/or cooling. One or more endcaps could be disposed between coating/cladding layers at one or more ends of a core region, where the core region is doped with at least one active ion species and each endcap is not doped with any active ion species that creates substantial absorption at pump and signal wavelengths. A core region could include at least one crystal or crystalline material, and at least one cladding layer could include at least one glass. Different types of coolers could be disposed on or adjacent to different coating/cladding layers. Side claddings could be disposed on opposite sides of a planar waveguide, where the opposite sides represent longer sides of the waveguide. Endcaps and one or more coolers could be sealed to a housing, and coolant can flow through a substantially linear passageway along a length of the waveguide. One side of a planar waveguide could be uncooled.

    Microchip laser with single solid etalon and interfacial coating
    18.
    发明授权
    Microchip laser with single solid etalon and interfacial coating 有权
    具有单固体标准具和界面涂层的Microchip激光

    公开(公告)号：US09515448B2

    公开(公告)日：2016-12-06

    申请号：US13627633

    申请日：2012-09-26

    Applicant: Raytheon Company

    Inventor： Robert D. Stultz ,  Juan Carlos Sotelo ,  David M. Filgas

    IPC: H01S3/06 ,  H01S3/08 ,  H01S3/113 ,  H01S3/16 ,  H01S3/0941

    CPC classification number: H01S3/0627 ,  H01S3/0612 ,  H01S3/0621 ,  H01S3/08036 ,  H01S3/09415 ,  H01S3/113 ,  H01S3/1618 ,  H01S3/1643

    Abstract: A microchip laser includes a microchip laser base comprising a gain region and a passive Q-switch region. The microchip laser also includes a solid etalon coupled to the microchip laser base, and an interfacial coating disposed between the microchip laser base and the solid etalon. In some embodiments, the microchip laser further includes a dichroic coating disposed on a surface of the microchip laser base opposite the interfacial coating.

    Abstract translation: 微芯片激光器包括包括增益区域和无源Q开关区域的微芯片激光器基座。 微芯片激光器还包括耦合到微芯片激光器基座的固体标准具和设置在微芯片激光基座和固体标准具之间的界面涂层。 在一些实施例中，微芯片激光器还包括设置在与界面涂层相对的微芯片激光器基底的表面上的二向色涂层。

    SYSTEM AND METHOD FOR COOLING A LASER GAIN MEDIUM USING AN ULTRA-THIN LIQUID THERMAL OPTICAL INTERFACE
    19.
    发明申请
    SYSTEM AND METHOD FOR COOLING A LASER GAIN MEDIUM USING AN ULTRA-THIN LIQUID THERMAL OPTICAL INTERFACE 有权
    使用超薄液体热光学接口冷却激光增益介质的系统和方法

    公开(公告)号：US20160164241A1

    公开(公告)日：2016-06-09

    申请号：US14661828

    申请日：2015-03-18

    Applicant: Raytheon Company

    Inventor： David M. Filgas ,  Christopher R. Koontz

    IPC: H01S3/04 ,  H01S3/042

    CPC classification number: H01S3/042 ,  H01S3/0407 ,  H01S3/1643

    Abstract: A heat sink for cooling a laser gain medium includes a coolant channel, an inlet pore, an outlet pore, and a thermal optical interface (TOI) channel. The coolant channel is configured to receive a coolant for removing heat from the heat sink. The TOI channel is coupled to the coolant channel by the inlet pore and the outlet pore. The TOI channel is configured to receive a portion of the coolant through the inlet pore. The received portion forms an ultra-thin liquid TOI. The TOI channel is further configured to return a portion of the TOI through the outlet pore to the coolant channel.

    Abstract translation: 用于冷却激光增益介质的散热器包括冷却剂通道，入口孔，出口孔和热光学界面（TOI）通道。 冷却剂通道构造成接收用于从散热器移除热量的冷却剂。 TOI通道由入口孔和出口孔耦合到冷却剂通道。 TOI通道构造成通过入口孔接收一部分冷却剂。 接收的部分形成超薄液体TOI。 TOI通道还被配置成将TOI的一部分通过出口孔返回到冷却剂通道。

    END PUMPED PWG WITH TAPERED CORE THICKNESS
    20.
    发明申请
    END PUMPED PWG WITH TAPERED CORE THICKNESS 有权
    带泵芯的厚度的末端泵

    公开(公告)号：US20160047981A1

    公开(公告)日：2016-02-18

    申请号：US14682539

    申请日：2015-04-09

    Applicant: RAYTHEON COMPANY

    Inventor： David M. Filgas ,  Robert D. Stultz

    IPC: G02B6/122

    CPC classification number: G02B6/1228 ,  G02B6/12007 ,  G02B6/4296 ,  G02B6/4298 ,  G02B2006/12159 ,  H01S3/042 ,  H01S3/0617 ,  H01S3/0625 ,  H01S3/0632 ,  H01S3/0637 ,  H01S3/08072 ,  H01S3/09415 ,  H01S3/1643

    Abstract: A planar wave guide (PWG) having a first end for coupling to a light pump and a second end opposite to the first end and including a first cladding layer; a second cladding layer; and a uniformly doped core layer between the first cladding layer and the second cladding layer, wherein the core layer is tapered having a smaller thickness at the first end and a larger thickness at the second end, and wherein a ratio of the core thickness to thickness of the cladding layers is smaller at the first end and larger at the second end.

    Abstract translation: 具有用于耦合到光泵的第一端和与第一端相对的第二端并包括第一包层的平面波导（PWG） 第二覆层; 以及在所述第一包层和所述第二包层之间的均匀掺杂的芯层，其中所述芯层在所述第一端具有较小厚度的锥形并且在所述第二端具有较大的厚度，并且其中所述芯厚度与厚度的比率 的包层在第一端较小，在第二端较大。

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