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    Multi-phase heat dissipating device for an electronic device
    13.
    发明授权
    Multi-phase heat dissipating device for an electronic device 有权

    公开(公告)号：US10353445B2

    公开(公告)日：2019-07-16

    申请号：US15481665

    申请日：2017-04-07

    Applicant: QUALCOMM Incorporated

    Inventor： Victor Adrian Chiriac ,  Jorge Luis Rosales ,  Stephen Arthur Molloy ,  Jon James Anderson

    IPC: G06F1/20 ,  H01L23/427 ,  H01L23/473 ,  F28D15/02

    Abstract: A device that includes a region comprising an integrated device, and a heat dissipating device coupled to the region comprising the integrated device. The heat dissipating device is configured to dissipate heat away from the region. The heat dissipating device includes a fluid, an evaporator configured to evaporate the fluid, a condenser configured to condense the fluid, an inner wall coupled to the evaporator and the condenser, an outer shell encapsulating the fluid, the evaporator, the condenser and the inner wall, an evaporation portion configured to channel an evaporated fluid from the evaporator to the condenser, wherein the evaporation portion is at least partially defined by the inner wall, and a collection portion configured to channel a condensed fluid from the condenser to the evaporator, wherein the collection portion is at least partially defined by the inner wall. The heat dissipating device may be a multi-phase heat dissipating device.

    METHODS AND APPARATUS FOR REDUCING MODEM POWER BASED ON A PRESENT STATE OF CHARGE OF BATTERY
    15.
    发明申请
    METHODS AND APPARATUS FOR REDUCING MODEM POWER BASED ON A PRESENT STATE OF CHARGE OF BATTERY 有权
    基于电池充电状态降低调制解调器功率的方法和装置

    公开(公告)号：US20150131461A1

    公开(公告)日：2015-05-14

    申请号：US14216399

    申请日：2014-03-17

    Applicant: QUALCOMM Incorporated

    Inventor： Vasanth Kumar Ramkumar ,  Srinivasan Rajagopalan ,  Jeffrey A. Niemann ,  Vijay Raman ,  Christopher Lee Medrano ,  Jon James Anderson ,  Amit Mahajan

    IPC: H04W52/02

    CPC classification number: H04W52/0251 ,  G06F1/3212 ,  G06F1/3278 ,  H04W52/0245 ,  H04W52/0277 ,  Y02D10/157 ,  Y02D10/174 ,  Y02D70/1242 ,  Y02D70/1262 ,  Y02D70/1264 ,  Y02D70/142 ,  Y02D70/146 ,  Y02D70/22 ,  Y02D70/24

    Abstract: Methods, systems, and devices are described for managing power of a user equipment (UE). A UE modem may determine the state of charge of the battery to determine that the battery is in one of two or more charge state levels, and may invoke one or more modem power saving modes based on the charge state level. Power saving modes may include, for example, reducing a number of available receive chains in a UE, initiating a time delay between one or more frequency scan requests performed by the UE, reducing a rate of neighbor search requests performed by the UE, providing a buffer status report (BSR) parameter that indicates a reduced amount of buffer data relative to an actual amount of buffer data for the UE, and/or adjusting a maximum transmit power level for an uplink channel.

    Abstract translation: 描述了用于管理用户设备（UE）的功率的方法，系统和设备。 UE调制解调器可以确定电池的充电状态以确定电池处于两个或多个充电状态电平之一，并且可以基于充电状态电平来调用一个或多个调制解调器功率节省模式。 省电模式可以包括例如减少UE中的可用接收链的数量，发起由UE执行的一个或多个频率扫描请求之间的时间延迟，降低由UE执行的邻居搜索请求的速率， 缓冲器状态报告（BSR）参数，其指示缓冲器数据相对于UE的实际缓冲器数据量减少的量和/或调整上行链路信道的最大发射功率电平。

    Multi-phase heat dissipating device comprising piezo structures
    16.
    发明授权
    Multi-phase heat dissipating device comprising piezo structures 有权

    公开(公告)号：US10746474B2

    公开(公告)日：2020-08-18

    申请号：US16398001

    申请日：2019-04-29

    Applicant: QUALCOMM Incorporated

    Inventor： Jorge Luis Rosales ,  Le Gao ,  Don Le ,  Jon James Anderson

    IPC: F28D15/02 ,  H05K7/20 ,  F04B49/06 ,  F04B17/00 ,  H01L23/427

    Abstract: A device that includes a region comprising an integrated device, and a heat dissipating device coupled to the region comprising the integrated device. The heat dissipating device is configured to dissipate heat away from the region. The heat dissipating device includes a fluid, an evaporator configured to evaporate the fluid, a condenser configured to condense the fluid, an inner wall coupled to the evaporator and the condenser, an outer shell encapsulating the fluid, the evaporator, the condenser and the inner wall, an evaporation portion configured to channel an evaporated fluid from the evaporator to the condenser, and a collection portion configured to channel a condensed fluid from the condenser to the evaporator. The heat dissipating device includes one or more piezo structures configured to move fluid inside the heat dissipating device.

    Skin material design to reduce touch temperature
    18.
    发明授权
    Skin material design to reduce touch temperature 有权

    公开(公告)号：US10152099B2

    公开(公告)日：2018-12-11

    申请号：US14594984

    申请日：2015-01-12

    Applicant: QUALCOMM Incorporated

    Inventor： Unnikrishnan Vadakkanmaruveedu ,  Jon James Anderson ,  Vinay Mitter ,  Peng Wang

    IPC: G06F1/20 ,  H05K7/20 ,  C09K5/14 ,  G06F1/16 ,  G06F1/18 ,  F28F13/00

    Abstract: An electronic device includes a housing with a plurality of sides and electronics components in the housing. A porous and thermally conductive material is associated with the housing. The material has a thermal conductively (k), and a porosity between 10% and 70% that results in a specific heat (ρ) and density (Cp) for the material, such that k*ρ*Cp is between 0 (J*W)/(m4*K2) and 1,000,000 (J*W)/(m4*K2). The material may be: a glass-based material having a thermal conductivity between 0.5-2 W/m-K, a density between 1000-2500 kg/m3, and a specific heat between 500-1000 J/kg-K; a metal-based material having a thermal conductivity between 300-400 W/m-K, a density between 4000-8000 kg/m3, and a specific heat between 200-300 J/kg-K; and a plastic-based material having a thermal conductivity may be between 0.1-0.4 W/m-K, a density between 400-1000 kg/m3, and a specific heat between 1900-2000 J/kg-K.

    Energy efficiency aware thermal management in a multi-processor system on a chip
    20.
    发明授权
    Energy efficiency aware thermal management in a multi-processor system on a chip 有权
    芯片上多处理器系统中的节能意识热管理

    公开(公告)号：US09582012B2

    公开(公告)日：2017-02-28

    申请号：US14280629

    申请日：2014-05-18

    Applicant: QUALCOMM INCORPORATED

    Inventor： Hee Jun Park ,  Young Hoon Kang ,  Ronald Frank Alton ,  Christoper Lee Medrano ,  Jon James Anderson

    IPC: G06F1/32 ,  G05D23/19 ,  G05B15/02 ,  G06F1/20 ,  G06F1/26

    CPC classification number: G05D23/1917 ,  G05B15/02 ,  G06F1/203 ,  G06F1/206 ,  G06F1/26 ,  G06F1/3206 ,  G06F1/324 ,  G06F1/3296 ,  G06F11/30 ,  G06F11/34 ,  Y02D10/16

    Abstract: Various embodiments of methods and systems for energy efficiency aware thermal management in a portable computing device that contains a heterogeneous, multi-processor system on a chip (“SoC”) are disclosed. Because individual processing components in a heterogeneous, multi-processor SoC may exhibit different processing efficiencies at a given temperature, energy efficiency aware thermal management techniques that compare performance data of the individual processing components at their measured operating temperatures can be leveraged to optimize quality of service (“QoS”) by adjusting the power supplies to, reallocating workloads away from, or transitioning the power mode of, the least energy efficient processing components. In these ways, embodiments of the solution optimize the average amount of power consumed across the SoC to process a MIPS of workload.

    Abstract translation: 公开了在包含芯片上的异构多处理器系统（“SoC”）的便携式计算设备中的用于能量效率感知热管理的方法和系统的各种实施例。 由于异构多处理器SoC中的单独处理组件可能在给定温度下可能表现出不同的处理效率，因此可以利用能源效率感知热管理技术来比较其测量工作温度下各个处理组件的性能数据，从而优化服务质量 （“QoS”），通过调整电力供应，重新分配工作量远离或转移最低能效处理组件的功率模式。 以这些方式，该解决方案的实施例优化了跨SoC消耗的平均功耗量以处理MIPS的工作负载。

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