公开(公告)号：US10152099B2

公开(公告)日：2018-12-11

申请号：US14594984

申请日：2015-01-12

Applicant: QUALCOMM Incorporated

Inventor： Unnikrishnan Vadakkanmaruveedu ,  Jon James Anderson ,  Vinay Mitter ,  Peng Wang

IPC: G06F1/20 ,  H05K7/20 ,  C09K5/14 ,  G06F1/16 ,  G06F1/18 ,  F28F13/00

Abstract: An electronic device includes a housing with a plurality of sides and electronics components in the housing. A porous and thermally conductive material is associated with the housing. The material has a thermal conductively (k), and a porosity between 10% and 70% that results in a specific heat (ρ) and density (Cp) for the material, such that k*ρ*Cp is between 0 (J*W)/(m4*K2) and 1,000,000 (J*W)/(m4*K2). The material may be: a glass-based material having a thermal conductivity between 0.5-2 W/m-K, a density between 1000-2500 kg/m3, and a specific heat between 500-1000 J/kg-K; a metal-based material having a thermal conductivity between 300-400 W/m-K, a density between 4000-8000 kg/m3, and a specific heat between 200-300 J/kg-K; and a plastic-based material having a thermal conductivity may be between 0.1-0.4 W/m-K, a density between 400-1000 kg/m3, and a specific heat between 1900-2000 J/kg-K.

公开(公告)号：US09037882B2

公开(公告)日：2015-05-19

申请号：US13779153

申请日：2013-02-27

Applicant: QUALCOMM INCORPORATED

Inventor： Unnikrishnan Vadakkanmaruveedu ,  Paras S. Doshi ,  Ankur Jain ,  Vinay Mitter ,  Richard A. Stewart

IPC: G06F1/00 ,  G06F1/26 ,  G06F1/20 ,  G06F1/32

CPC classification number: G06F1/26 ,  G06F1/203 ,  G06F1/206 ,  G06F1/324 ,  G06F1/3296 ,  G06F2217/80 ,  Y02D10/126 ,  Y02D10/16 ,  Y02D10/172

Abstract: Various embodiments of methods and systems for thermal energy management in a portable computing device (“PCD”) based on power level calculations are disclosed. An exemplary method includes tracking instantaneous operating temperatures and active power supply levels to one or more components. With an estimate or measurement of ambient temperature, the instantaneous operating temperature values and active power supply level values can be used to calculate an instantaneous thermal resistance value. In the event that thermal energy generation should be managed, a target operating temperature may be used with the ambient temperature and the instantaneous thermal resistance value to solve for an optimum power supply level. The active power supply level may then be adjusted based on the calculated optimum power supply level.

Abstract translation: 公开了基于功率电平计算的便携式计算设备（“PCD”）中用于热能管理的方法和系统的各种实施例。 示例性方法包括将瞬时操作温度和有功电力供应水平跟踪到一个或多个组件。 通过对环境温度的估计或测量，可以使用瞬时工作温度值和有功电源电平值来计算瞬时热阻值。 在管理热能产生的情况下，可以使用目标工作温度与环境温度和瞬时热阻值来求解最佳供电水平。 然后可以基于计算的最佳电源电平来调整有功电源电平。

公开(公告)号：US20140245032A1

公开(公告)日：2014-08-28

申请号：US13779153

申请日：2013-02-27

Applicant: QUALCOMM INCORPORATED

Inventor： Unnikrishnan Vadakkanmaruveedu ,  Paras S. Doshi ,  Ankur Jain ,  Vinay Mitter

IPC: G06F1/26

CPC classification number: G06F1/26 ,  G06F1/203 ,  G06F1/206 ,  G06F1/324 ,  G06F1/3296 ,  G06F2217/80 ,  Y02D10/126 ,  Y02D10/16 ,  Y02D10/172

Abstract: Various embodiments of methods and systems for thermal energy management in a portable computing device (“PCD”) based on power level calculations are disclosed. An exemplary method includes tracking instantaneous operating temperatures and active power supply levels to one or more components. With an estimate or measurement of ambient temperature, the instantaneous operating temperature values and active power supply level values can be used to calculate an instantaneous thermal resistance value. In the event that thermal energy generation should be managed, a target operating temperature may be used with the ambient temperature and the instantaneous thermal resistance value to solve for an optimum power supply level. The active power supply level may then be adjusted based on the calculated optimum power supply level.

Abstract translation: 公开了基于功率电平计算的便携式计算设备（“PCD”）中用于热能管理的方法和系统的各种实施例。 示例性方法包括将瞬时操作温度和有功电力供应水平跟踪到一个或多个组件。 通过对环境温度的估计或测量，可以使用瞬时工作温度值和有功电源电平值来计算瞬时热阻值。 在管理热能产生的情况下，可以使用目标工作温度与环境温度和瞬时热阻值来求解最佳供电水平。 然后可以基于计算的最佳电源电平来调整有功电源电平。