公开(公告)号：US10062820B2

公开(公告)日：2018-08-28

申请号：US15573088

申请日：2016-04-26

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Mituhiko Ueda ,  Makoto Saito ,  Takanori Aketa ,  Toru Hirano

IPC: H01L33/00 ,  H01L33/62 ,  H01L23/14 ,  H01L33/60 ,  H01L23/00 ,  H01L33/44

CPC classification number: H01L33/62 ,  H01L23/147 ,  H01L23/32 ,  H01L23/49838 ,  H01L24/42 ,  H01L24/45 ,  H01L33/44 ,  H01L33/60 ,  H01L2224/14 ,  H01L2224/16145 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An interposer includes element mounting sections and terminal sections directly and partly formed on a surface of an aluminum film having the predetermined pattern. Each of the element mounting sections and the terminal sections has a laminated structure of an Ni film, an Pd film and an Au film. The interposer is formed with an AuSn layer on a predetermined region of a surface of each Au film in the element mounting sections. The interposer includes a protective film having optical permeability that directly covers a region of the surface of the aluminum film, which is out of contact with the element mounting sections and the terminal sections.

公开(公告)号：US09425373B2

公开(公告)日：2016-08-23

申请号：US14774207

申请日：2014-03-11

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Takanori Aketa ,  Yoshiharu Sanagawa ,  Mitsuhiko Ueda ,  Takaaki Yoshihara ,  Shintaro Hayashi ,  Toshihiko Sato

IPC: H01L33/64 ,  H01L33/62 ,  H01L23/00 ,  H01L27/15 ,  H01L33/38 ,  H01L33/40 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60

CPC classification number: H01L33/647 ,  H01L24/32 ,  H01L27/156 ,  H01L33/387 ,  H01L33/40 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L33/64 ,  H01L33/641 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/12041 ,  H01L2924/15787 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light emitting module includes: a first substrate including a resin having insulation properties, and a copper component embedded in the resin; a second substrate placed above the copper component of the first substrate, and soldered to the copper component; a mounting electrode formed above the second substrate; and an LED placed above the second substrate, and gold-tin soldered to the mounting electrode.

Abstract translation: 发光模块包括：包括具有绝缘性的树脂的第一基板和嵌入树脂中的铜成分; 位于第一基板的铜部件上方的第二基板，并焊接到铜部件上; 形成在所述第二基板上方的安装电极; 以及放置在第二基板上方的LED，并将金锡焊接到安装电极。