公开(公告)号：US11482478B2

公开(公告)日：2022-10-25

申请号：US16936480

申请日：2020-07-23

Applicant: NXP B.V.

Inventor： Crispulo Estira Lictao, Jr. ,  Chayathorn Saklang ,  Amornthep Saiyajitara ,  Chanon Suwankasab ,  Stephen Ryan Hooper ,  Bernd Offermann

IPC: H01L23/552 ,  H01L23/495 ,  H01L23/00 ,  H01L25/00

Abstract: An electronic device package includes a first die coupled to a substrate, a second die coupled with the first die, and a spacer element coupled to the second die to form a stacked structure that includes the first die, the second die, and the spacer element. An electrically conductive shield overlies the stacked structure. The shield has a first end coupled to the spacer element and a second end coupled to the substrate. Inter-chip bond wires may electrically interconnect the first and second dies, and the shield may additionally overlie the bond wires. The spacer element may extend above a surface of the second die at a height that is sufficient to prevent the shield from touching the inter-chip bond wires.

公开(公告)号：US20220028766A1

公开(公告)日：2022-01-27

申请号：US16936480

申请日：2020-07-23

Applicant: NXP B.V.

Inventor： Crispulo Estira Lictao, JR. ,  Chayathorn Saklang ,  Amornthep Saiyajitara ,  Chanon Suwankasab ,  Stephen Ryan Hooper ,  Bernd Offermann

IPC: H01L23/495 ,  H01L23/552 ,  H01L23/00 ,  H01L25/00

Abstract: An electronic device package includes a first die coupled to a substrate, a second die coupled with the first die, and a spacer element coupled to the second die to form a stacked structure that includes the first die, the second die, and the spacer element. An electrically conductive shield overlies the stacked structure. The shield has a first end coupled to the spacer element and a second end coupled to the substrate. Inter-chip bond wires may electrically interconnect the first and second dies, and the shield may additionally overlie the bond wires. The spacer element may extend above a surface of the second die at a height that is sufficient to prevent the shield from touching the inter-chip bond wires.

公开(公告)号：US20200126895A1

公开(公告)日：2020-04-23

申请号：US16164776

申请日：2018-10-18

Applicant: NXP B.V.

Inventor： Chayathorn Saklang ,  Stephen Ryan Hooper ,  Chanon Suwankasab ,  Amornthep Saiyajitara ,  Bernd Offermann ,  James Lee Grothe ,  Russell Joseph Lynch

IPC: H01L23/495 ,  H01L23/31 ,  H01L21/56

Abstract: A press-fit semiconductor device includes a lead frame having a die pad, leads with inner and outer lead ends, and a press-fit lead. The press-fit lead has a circular section between an outer lead end and an inner lead end, and the circular section has a central hole that is sized and shaped to receive a press-fit connection pin. A die is attached to the die pad and electrically connected to the inner lead ends of the leads and the inner lead end of the press-fit lead. The die, electrical connections and inner lead ends are covered with an encapsulant that forms a housing. The outer lead ends of the leads extend beyond the housing. The housing has a hole extending therethrough that is aligned with the center hole of the press-fit lead, so that a press-fit connection pin can be pushed through the hole to connect the device to a circuit board.

公开(公告)号：US20190229044A1

公开(公告)日：2019-07-25

申请号：US15878292

申请日：2018-01-23

Applicant: NXP B.V.

Inventor： AMORNTHEP SAIYAJITARA ,  Wiwat Tanwongwan ,  Chanon Suwankasab ,  Ekapong Tangpattanasaeree

IPC: H01L23/495 ,  H01L21/48

Abstract: A lead frame is formed with exposed lead tips. The leads are not attached at their tips to any of a tie bar, a dam bar or an end bar, so when the lead frame is plated, the lead tips are plated. During packaging, after die attach and molding, when the lead frame is cut from the frame assembly, the lead tips are not cut, so the plating remains on the tips. This improves solder joint reliability when the package is mounted on a PCB. The lead frame has connection bars that run parallel to the leads from the tie bar to the end bar. The connection bars provide stability to the leads during wire bonding, but are cut from the lead frame after wire bonding.