公开(公告)号：US20200158791A1

公开(公告)日：2020-05-21

申请号：US16191694

申请日：2018-11-15

Applicant: NXP B.V.

Inventor： Stephan Marauska ,  Dennis Helmboldt ,  Bernd Offermann ,  Thomas Hain

IPC: G01R33/00 ,  G01D5/16 ,  H01L43/08 ,  H01L43/12 ,  H01L43/02

Abstract: A sensor package includes a magnetic field sensor having first and second surfaces, the first surface being a sensing surface of the magnetic field sensor, a shield structure spaced apart from the magnetic field sensor, and a spacer interposed between the magnetic field sensor and the shield structure. The shield structure is configured to suppress stray magnetic fields in a plane parallel to first and second axes that are parallel to the sensing surface of the magnetic field sensor and perpendicular to one another. The shield structure may include a continuous sidewall having a central region, the spacer being surrounded by the continuous sidewall and the sensing surface of the magnetic field sensor being positioned outside of the central region. A system includes an encoder magnet and the sensor package, with the sensing surface of the magnetic field sensor facing the encoder magnet.

公开(公告)号：US20200126895A1

公开(公告)日：2020-04-23

申请号：US16164776

申请日：2018-10-18

Applicant: NXP B.V.

Inventor： Chayathorn Saklang ,  Stephen Ryan Hooper ,  Chanon Suwankasab ,  Amornthep Saiyajitara ,  Bernd Offermann ,  James Lee Grothe ,  Russell Joseph Lynch

IPC: H01L23/495 ,  H01L23/31 ,  H01L21/56

Abstract: A press-fit semiconductor device includes a lead frame having a die pad, leads with inner and outer lead ends, and a press-fit lead. The press-fit lead has a circular section between an outer lead end and an inner lead end, and the circular section has a central hole that is sized and shaped to receive a press-fit connection pin. A die is attached to the die pad and electrically connected to the inner lead ends of the leads and the inner lead end of the press-fit lead. The die, electrical connections and inner lead ends are covered with an encapsulant that forms a housing. The outer lead ends of the leads extend beyond the housing. The housing has a hole extending therethrough that is aligned with the center hole of the press-fit lead, so that a press-fit connection pin can be pushed through the hole to connect the device to a circuit board.