公开(公告)号：US10107947B2

公开(公告)日：2018-10-23

申请号：US15545766

申请日：2016-03-10

Applicant: NITTO DENKO CORPORATION

Inventor： Katsunori Takada ,  Kota Nakai ,  Naotaka Higuchi ,  Keisuke Kimura ,  Yoshitsugu Kitamura ,  Hiroki Kuramoto

IPC: G02B5/30 ,  G02B1/14 ,  C08J3/24 ,  C08J5/18 ,  G02B1/08 ,  B29D11/00

Abstract: There is provided a polarizer excellent in durability. A polarizer according to one embodiment of the present invention includes a resin film containing boric acid, wherein the resin film has a low-concentration portion, which contains a lower concentration of the boric acid than that in any other site, formed in an end portion thereof.

公开(公告)号：US20170123111A1

公开(公告)日：2017-05-04

申请号：US15290775

申请日：2016-10-11

Applicant: NITTO DENKO CORPORATION

Inventor： Katsunori Takada ,  Naotaka Higuchi ,  Kota Nakai ,  Shinobu Nagano ,  Eiko Suefusa ,  Yoshitsugu Kitamura ,  Keisuke Kimura

IPC: G02B1/14 ,  G02B5/30

CPC classification number: G02B1/14 ,  B32B3/02 ,  B32B3/266 ,  B32B7/12 ,  B32B27/08 ,  B32B27/16 ,  B32B27/306 ,  B32B38/0004 ,  B32B38/0036 ,  B32B2038/0028 ,  B32B2038/042 ,  B32B2038/047 ,  B32B2307/42 ,  B32B2307/518 ,  B32B2307/734 ,  B32B2329/04 ,  B32B2551/00 ,  G02B5/3033 ,  G02B5/305 ,  Y10S428/91 ,  Y10T428/24273 ,  Y10T428/24322 ,  Y10T428/24777

Abstract: A primary object of the present invention is to provide a polarizing plate excellent in durability. A polarizing plate (100) according to an embodiment of the present invention includes: a polarizer (10); and a protective film (21 and 22) arranged on at least one side of the polarizer (10). The polarizing plate (100) has a dimensional change ratio of −0.2% or more in a transmission axis direction thereof when the polarizing plate (100) cut into a size measuring 100 mm by 100 mm is bonded to a glass plate with a pressure-sensitive adhesive and the following operation is repeated 100 times: the polarizing plate (100) bonded to the glass plate is left to stand under an atmosphere at −40° C. for 30 minutes and then left to stand under an atmosphere at 85° C. for 30 minutes.

公开(公告)号：US09301406B2

公开(公告)日：2016-03-29

申请号：US13661290

申请日：2012-10-26

Applicant: NITTO DENKO CORPORATION

Inventor： Naotaka Higuchi ,  Tetsuya Ohsawa

IPC: H05K1/11 ,  H05K1/00 ,  H05K3/42 ,  G11B5/48 ,  H05K1/02 ,  H05K1/05

CPC classification number: H05K3/421 ,  G11B5/484 ,  G11B5/486 ,  H05K1/0219 ,  H05K1/056 ,  H05K2201/09845 ,  H05K2201/09854

Abstract: A wired circuit board includes a metal supporting layer, a first insulating layer, a conductive layer, a second insulating layer, and a ground layer. The first opening of the first insulating layer is surrounded by the second opening of the second insulating layer when projected in the thickness direction, and the ground layer fills the first opening via the second opening so as to come in contact with an upper surface of the metal supporting layer. Alternatively, the first opening surrounds the second opening when projected in the thickness direction, the second insulating layer fills a peripheral end portion of the first opening, and the ground layer fills the second opening so as to come in contact with the upper surface of the metal supporting layer.

Abstract translation: 布线电路板包括金属支撑层，第一绝缘层，导电层，第二绝缘层和接地层。 第一绝缘层的第一开口在第二绝缘层的第二开口沿厚度方向突出时被第二绝缘层包围，并且接地层经由第二开口填充第一开口以与第二绝缘层的上表面接触 金属支撑层。 或者，当沿着厚度方向投影时，第一开口围绕第二开口，第二绝缘层填充第一开口的外周端部，并且接地层填充第二开口以与第二开口的上表面接触 金属支撑层。