公开(公告)号：US09369172B2

公开(公告)日：2016-06-14

申请号：US14603367

申请日：2015-01-23

Applicant: MEDIATEK INC.

Inventor： Li-Chun Tu ,  Chia-Hao Yang ,  Tsung-Huang Chen

IPC: H04B1/00 ,  H04B1/40

CPC classification number: H04B1/40

Abstract: A wireless communication device including an integrated processing circuit and a first memory is provided. The integrated processing circuit includes a processing unit capable of processing a wireless communication signal and a radio frequency (RF) unit capable of performing a conversion between a radio frequency (RF) signal and a baseband signal, wherein the wireless communication signal is one of the RF signal and the baseband signal. The first memory is coupled to the integrated processing circuit. The first memory is capable of storing data used by the processing unit, wherein the integrated processing circuit and the first memory are packaged in a single semiconductor package.

公开(公告)号：US20160134324A1

公开(公告)日：2016-05-12

申请号：US15000023

申请日：2016-01-18

Applicant: MEDIATEK INC.

Inventor： Li-Chun Tu ,  Chia-Hao Yang ,  Tsung-Huang Chen

IPC: H04B1/40

CPC classification number: H04W52/0261 ,  G06F3/0625 ,  G06F3/0659 ,  G06F3/067 ,  H04B1/40 ,  H04W88/06 ,  Y02D70/00 ,  Y02D70/26 ,  Y02D70/40

Abstract: A wireless communication device including an integrated processing circuit, a first memory and a testing circuit is provided. The integrated processing circuit includes a processing unit capable of processing a wireless communication signal and a radio frequency (RF) unit capable of performing a conversion between a radio frequency (RF) signal and a baseband signal, wherein the wireless communication signal is one of the RF signal and the baseband signal. The first memory is coupled to the integrated processing circuit. The first memory is capable of storing data used by the processing unit. The testing circuit is coupled to the first memory, and is capable of testing the first memory for determining if the first memory is an effective memory. The RF unit and the first memory are placed in a single module.

Abstract translation: 提供一种包括集成处理电路，第一存储器和测试电路的无线通信设备。 集成处理电路包括能够处理无线通信信号的处理单元和能够执行射频（RF）信号和基带信号之间的转换的射频（RF）单元，其中无线通信信号是 RF信号和基带信号。 第一存储器耦合到集成处理电路。 第一存储器能够存储由处理单元使用的数据。 测试电路耦合到第一存储器，并且能够测试第一存储器以确定第一存储器是否是有效存储器。 RF单元和第一存储器被放置在单个模块中。

公开(公告)号：US20150155905A1

公开(公告)日：2015-06-04

申请号：US14613374

申请日：2015-02-04

Applicant: Mediatek Inc.

Inventor： Li-Chun Tu ,  Chia-Hao Yang ,  Tsung-Huang Chen

IPC: H04B1/40 ,  H04B1/713 ,  H04B1/3827

CPC classification number: H04B1/40 ,  G11C29/028 ,  G11C29/12 ,  H04B1/385 ,  H04B1/713 ,  H04L29/00

Abstract: A wireless communication device including an integrated processing circuit and a first memory is provided. The integrated processing circuit includes a processing unit capable of processing a wireless communication signal and a radio frequency (RF) unit capable of performing a conversion between a radio frequency (RF) signal and a baseband signal, wherein the wireless communication signal is one or more of the RF signal and the baseband signal. The first memory is coupled to the integrated processing circuit. The first memory is capable of storing data used by the processing unit, wherein the RF unit and the first memory are packaged in a single semiconductor device.

Abstract translation: 提供一种包括集成处理电路和第一存储器的无线通信装置。 集成处理电路包括能够处理无线通信信号的处理单元和能够执行射频（RF）信号和基带信号之间的转换的射频（RF）单元，其中无线通信信号是一个或多个 的RF信号和基带信号。 第一存储器耦合到集成处理电路。 第一存储器能够存储由处理单元使用的数据，其中RF单元和第一存储器封装在单个半导体器件中。