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公开(公告)号：US11973275B2
公开(公告)日：2024-04-30
申请号：US17838425
申请日：2022-06-13
Applicant: MEDIATEK Inc.
Inventor： Chung-Hsin Chiang , Li-Yu Chen , Shih-Huang Yeh
IPC: H01Q5/30 , H01Q1/48 , H01Q5/307 , H01Q5/385 , H01Q5/392 , H01Q5/50 , H01Q9/16 , H01Q21/06 , H01Q21/24
CPC classification number: H01Q5/392 , H01Q1/48 , H01Q5/307 , H01Q5/385 , H01Q5/50 , H01Q9/16 , H01Q21/062 , H01Q21/24
Abstract: An antenna for multi-broadband and multi-polarization communication, may include a plurality of radiators configured to jointly function as one or more dipoles, a first feed terminal for a first signal of a first polarization, and a second feed terminal for a second signal of a second polarization different from the first polarization. Each radiator may be configured to contribute to resonances at two or more nonoverlapping bands. In an embodiment, the antenna may further include a third feed terminal for a third signal of the first polarization, and a fourth feed terminal for a fourth signal of the second polarization.
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公开(公告)号：US20230291127A1
公开(公告)日：2023-09-14
申请号：US18116251
申请日：2023-03-01
Applicant: MEDIATEK INC.
Inventor： Wun-Jian Lin , Chung-Hsin Chiang , Shyh-Tirng Fang , Shih-Huang Yeh
CPC classification number: H01Q21/28 , H01Q21/065
Abstract: An antenna module, comprising: a substrate; at least one first antenna array, located on the substrate, comprising at least one first antenna and having a first maximum radiation direction; and at least one second antenna array, located on the substrate, comprising at least one second antenna and having a second maximum radiation direction. A communication device using the antenna module is also disclosed.
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公开(公告)号：US11532875B2
公开(公告)日：2022-12-20
申请号：US17489900
申请日：2021-09-30
Applicant: MEDIATEK Inc.
Inventor： Chung-Hsin Chiang , Li-Yu Chen , Shih-Huang Yeh
Abstract: An antenna module includes a first dielectric layer, an antenna layer, a grounding layer and a conductive layer. The first dielectric layer has a first dielectric surface and a second dielectric surface opposite to the first dielectric surface and a first dielectric lateral surface extending between the first dielectric surface and the second dielectric surface. The antenna layer is formed on the first dielectric surface. The grounding layer is formed below the second dielectric surface. The conductive layer is formed on the first dielectric lateral surface of first dielectric layer, wherein the conductive layer electrically connects to the grounding layer and extends from the grounding layer toward the antenna layer but not contacts the first dielectric surface.
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公开(公告)号：US11387557B2
公开(公告)日：2022-07-12
申请号：US16898587
申请日：2020-06-11
Applicant: MEDIATEK Inc.
Inventor： Chung-Hsin Chiang , Li-Yu Chen , Shih-Huang Yeh
Abstract: The invention provides an antenna for multi-broadband and multi-polarization communication, which may include a plurality of radiators configured to jointly function as one or more dipoles, and a plurality of parasitic elements. Each radiator may be configured to contribute to resonances at two or more nonoverlapping bands, and may comprise an arm and a ground wall connecting the arm and a ground plane. The arm may comprise an arm plate and a folded arm. The ground wall may comprise a meandering portion causing a distance between the arm and the ground plane to be shorter than a length of a current conduction path along the ground wall between the arm and the ground plane. On a geometric reference surface, a projection of each parasitic element may extend between two gaps which clamp a projection of an associated one of the radiators.
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公开(公告)号：US11245188B2
公开(公告)日：2022-02-08
申请号：US16240795
申请日：2019-01-07
Applicant: MEDIATEK INC.
Inventor： Chung-Hsin Chiang , Yeh-Chun Kao , Shih-Huang Yeh
IPC: H01Q5/35
Abstract: An antenna device includes a first dipole antenna, a second loop shaped antenna, a first feed line and a second feed line. The first dipole antenna operates at a first frequency band. The first dipole antenna includes a first portion and a second portion. The second loop shaped antenna operates at a second frequency band different from the first frequency band. A first terminal of the second loop shaped antennal is coupled to a second terminal of the first portion of the first dipole antenna. A second terminal of the second loop shaped antenna is coupled to a first terminal of the second portion of the first dipole antenna. The first feed line is coupled to the second terminal of the first portion of the first dipole antenna. The second feed line is coupled to the first terminal of the second portion of the first dipole antenna.
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Patent Agency Ranking
公开(公告)号：US20210119329A1
公开(公告)日：2021-04-22
申请号：US17030313
申请日：2020-09-23
Applicant: MEDIATEK INC.
Inventor： Wun-Jian Lin , Shyh-Tirng Fang , Shih-Huang Yeh
Abstract: An antenna device includes a substrate, a feed line and an antenna. The substrate is formed with a non-opaque material. The feed line is disposed at the substrate and has a first terminal and a second terminal. The antenna is disposed at the substrate, electrically connected to the first terminal of the feed line, and is used to access a wireless signal. The second terminal of the feed line is electrically connected to a chip disposed on the substrate.
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公开(公告)号：US10903563B2
公开(公告)日：2021-01-26
申请号：US16398455
申请日：2019-04-30
Applicant: MEDIATEK INC.
Inventor： Ting-Wei Kang , Shih-Huang Yeh , Chen-Fang Tai
Abstract: The invention is directed to a communication device. The communication device includes a millimeter-wave antenna array and an appearance metal element. The appearance metal element has an antenna window. The millimeter-wave antenna array is configured to transmit or receive a wireless signal. The wireless signal is transferred through the antenna window of the appearance metal element.
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18.发明申请公开(公告)号：US20200243971A1
公开(公告)日：2020-07-30
申请号：US16745303
申请日：2020-01-16
Applicant: MEDIATEK INC.
Inventor： Shao-Yu Huang , Yeh-Chun Kao , Chung-Hsin Chiang , Shih-Huang Yeh
Abstract: A millimeter wave antenna device includes an antenna array, a first parasitic element and a second parasitic element. The antenna array includes m×n antennas and is disposed in an antenna area. The first parasitic element is disposed beside a first side of the antenna area. The second parasitic element is disposed beside a second side of the antenna area. None of the first parasitic element and the second parasitic element overlaps with the antenna area.
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公开(公告)号：US20200013735A1
公开(公告)日：2020-01-09
申请号：US16452395
申请日：2019-06-25
Applicant: MediaTek Inc.
Inventor： Nai-Wei Liu , Yen-Yao Chi , Yeh-Chun Kao , Shih-Huang Yeh , Tzu-Hung Lin , Wen-Sung Hsu
Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a first redistribution layer (RDL) structure formed on a non-active surface of a semiconductor die. A second RDL structure is formed on and electrically coupled to an active surface of the semiconductor die. A ground layer is formed in the first RDL structure. A first molding compound layer is formed on the first RDL structure. A first antenna includes a first antenna element formed in the second RDL structure and a second antenna element formed on the first molding compound layer. Each of the first antenna element and the second antenna element has a first portion overlapping the semiconductor die as viewed from a top-view perspective.
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公开(公告)号：US20190319369A1
公开(公告)日：2019-10-17
申请号：US16378281
申请日：2019-04-08
Applicant: MediaTek Inc.
Inventor： Chung-Hsin Chiang , Yeh-Chun Kao , Shih-Huang Yeh , Chen-Fang Tai
Abstract: An antenna assembly includes a first antenna element coupled to RF circuitry via a first feeder, and a second antenna element coupled to the RF circuitry via a second feeder. The first feeder and the second feeder have different shapes. The first antenna element and the second antenna element radiate in different frequency bands and in a direction parallel to a ground plane. The ground plane is disposed on at least one layer in a substrate that includes a plurality of layers parallel to one another. The first antenna element is disposed on first one or more of the layers and the second antenna element is disposed on second one or more of the layers, which are different from the first one or more of the layers. Another antenna assembly includes a first subarray of the first antenna elements and a second subarray of the second antenna elements.
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