公开(公告)号：US11469152B2

公开(公告)日：2022-10-11

申请号：US17035719

申请日：2020-09-29

Applicant: MEDIATEK INC.

Inventor： Yi-Lin Tsai ,  Yi-Jou Lin ,  I-Hsuan Peng ,  Wen-Sung Hsu

IPC: H01L23/00 ,  H01L23/31 ,  H01L25/065 ,  H01L21/56

Abstract: A semiconductor chip package includes a substrate having a top surface and a bottom surface, and a semiconductor device mounted on the top surface of the substrate. A gap is provided between the semiconductor device and the top surface of the substrate. A pre-cut laminate epoxy sheet is disposed on the top surface of the substrate and around a perimeter of the semiconductor device.

公开(公告)号：US20210217707A1

公开(公告)日：2021-07-15

申请号：US17111456

申请日：2020-12-03

Applicant: MEDIATEK INC.

Inventor： Yi-Lin Tsai ,  Shih-Chao Chiu ,  Wen-Sung Hsu ,  Sang-Mao Chiu ,  Chi-Yuan Chen ,  Yao-Pang Hsu

IPC: H01L23/00 ,  H01L23/498

Abstract: A semiconductor package includes a substrate component having a first surface, a second surface opposite to the first surface, and a sidewall surface extending between the first surface and the second surface; a re-distribution layer (RDL) structure disposed on the first surface and electrically connected to the first surface through first connecting elements comprising solder bumps or balls; a plurality of ball grid array (BGA) balls mounted on the second surface of the substrate component; and at least one integrated circuit die mounted on the RDL structure through second connecting elements.